JPH044745U - - Google Patents
Info
- Publication number
- JPH044745U JPH044745U JP1990045392U JP4539290U JPH044745U JP H044745 U JPH044745 U JP H044745U JP 1990045392 U JP1990045392 U JP 1990045392U JP 4539290 U JP4539290 U JP 4539290U JP H044745 U JPH044745 U JP H044745U
- Authority
- JP
- Japan
- Prior art keywords
- pellet
- lead frame
- conveyance path
- semiconductor
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/0113—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990045392U JPH044745U (enExample) | 1990-04-26 | 1990-04-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990045392U JPH044745U (enExample) | 1990-04-26 | 1990-04-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH044745U true JPH044745U (enExample) | 1992-01-16 |
Family
ID=31559528
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990045392U Pending JPH044745U (enExample) | 1990-04-26 | 1990-04-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH044745U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60139590U (ja) * | 1984-02-28 | 1985-09-14 | 大阪グリツプ化工株式会社 | ハンドルのグリツプ |
-
1990
- 1990-04-26 JP JP1990045392U patent/JPH044745U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60139590U (ja) * | 1984-02-28 | 1985-09-14 | 大阪グリツプ化工株式会社 | ハンドルのグリツプ |