JPS6365237U - - Google Patents
Info
- Publication number
- JPS6365237U JPS6365237U JP15918286U JP15918286U JPS6365237U JP S6365237 U JPS6365237 U JP S6365237U JP 15918286 U JP15918286 U JP 15918286U JP 15918286 U JP15918286 U JP 15918286U JP S6365237 U JPS6365237 U JP S6365237U
- Authority
- JP
- Japan
- Prior art keywords
- tape
- vacuum
- wafer
- pipe
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002390 adhesive tape Substances 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 claims 4
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 238000001179 sorption measurement Methods 0.000 description 2
Landscapes
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15918286U JPH0521886Y2 (enExample) | 1986-10-17 | 1986-10-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15918286U JPH0521886Y2 (enExample) | 1986-10-17 | 1986-10-17 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6365237U true JPS6365237U (enExample) | 1988-04-30 |
| JPH0521886Y2 JPH0521886Y2 (enExample) | 1993-06-04 |
Family
ID=31083373
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15918286U Expired - Lifetime JPH0521886Y2 (enExample) | 1986-10-17 | 1986-10-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0521886Y2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0311749A (ja) * | 1989-06-09 | 1991-01-21 | Fujitsu Ltd | 半導体ウエハに粘着テープを接着する方法 |
-
1986
- 1986-10-17 JP JP15918286U patent/JPH0521886Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0311749A (ja) * | 1989-06-09 | 1991-01-21 | Fujitsu Ltd | 半導体ウエハに粘着テープを接着する方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0521886Y2 (enExample) | 1993-06-04 |