JPH02146431U - - Google Patents
Info
- Publication number
- JPH02146431U JPH02146431U JP1989055604U JP5560489U JPH02146431U JP H02146431 U JPH02146431 U JP H02146431U JP 1989055604 U JP1989055604 U JP 1989055604U JP 5560489 U JP5560489 U JP 5560489U JP H02146431 U JPH02146431 U JP H02146431U
- Authority
- JP
- Japan
- Prior art keywords
- tapered surface
- semiconductor pellet
- bonding
- tapered
- bonding collet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989055604U JPH02146431U (enExample) | 1989-05-15 | 1989-05-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989055604U JPH02146431U (enExample) | 1989-05-15 | 1989-05-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02146431U true JPH02146431U (enExample) | 1990-12-12 |
Family
ID=31578702
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989055604U Pending JPH02146431U (enExample) | 1989-05-15 | 1989-05-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02146431U (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1050737A (ja) * | 1996-08-02 | 1998-02-20 | Nec Corp | 半導体装置及び半導体素子搭載用コレット |
-
1989
- 1989-05-15 JP JP1989055604U patent/JPH02146431U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1050737A (ja) * | 1996-08-02 | 1998-02-20 | Nec Corp | 半導体装置及び半導体素子搭載用コレット |