JPH0346521Y2 - - Google Patents
Info
- Publication number
- JPH0346521Y2 JPH0346521Y2 JP2776985U JP2776985U JPH0346521Y2 JP H0346521 Y2 JPH0346521 Y2 JP H0346521Y2 JP 2776985 U JP2776985 U JP 2776985U JP 2776985 U JP2776985 U JP 2776985U JP H0346521 Y2 JPH0346521 Y2 JP H0346521Y2
- Authority
- JP
- Japan
- Prior art keywords
- end plate
- housing
- shield case
- electronic device
- heating element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 description 15
- 238000005192 partition Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000004512 die casting Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2776985U JPH0346521Y2 (US08188275-20120529-C00054.png) | 1985-02-27 | 1985-02-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2776985U JPH0346521Y2 (US08188275-20120529-C00054.png) | 1985-02-27 | 1985-02-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61144678U JPS61144678U (US08188275-20120529-C00054.png) | 1986-09-06 |
| JPH0346521Y2 true JPH0346521Y2 (US08188275-20120529-C00054.png) | 1991-10-01 |
Family
ID=30525024
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2776985U Expired JPH0346521Y2 (US08188275-20120529-C00054.png) | 1985-02-27 | 1985-02-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0346521Y2 (US08188275-20120529-C00054.png) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2612339B2 (ja) * | 1989-04-18 | 1997-05-21 | 三菱電機株式会社 | 電子機器筐体 |
| US9054659B2 (en) * | 2010-07-16 | 2015-06-09 | Emblation Limited | Apparatus and method for thermal interfacing |
-
1985
- 1985-02-27 JP JP2776985U patent/JPH0346521Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61144678U (US08188275-20120529-C00054.png) | 1986-09-06 |
