JPH0345543B2 - - Google Patents

Info

Publication number
JPH0345543B2
JPH0345543B2 JP12909982A JP12909982A JPH0345543B2 JP H0345543 B2 JPH0345543 B2 JP H0345543B2 JP 12909982 A JP12909982 A JP 12909982A JP 12909982 A JP12909982 A JP 12909982A JP H0345543 B2 JPH0345543 B2 JP H0345543B2
Authority
JP
Japan
Prior art keywords
leads
lead
enclosure
ridges
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP12909982A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5827354A (ja
Inventor
Daburyu Haitawaa Angusu
Daburyu Sumisu Reginarudo
Daburyu Ookatsuto Jon
Emu Haadein Richaado
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of JPS5827354A publication Critical patent/JPS5827354A/ja
Publication of JPH0345543B2 publication Critical patent/JPH0345543B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP12909982A 1981-07-27 1982-07-26 集積回路用キャリア Granted JPS5827354A (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US28683381A 1981-07-27 1981-07-27
US286833 1981-07-27
US286910 1981-07-27
US286832 2001-04-25

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP26130688A Division JPH01132148A (ja) 1981-07-27 1988-10-17 集積回路用キャリア

Publications (2)

Publication Number Publication Date
JPS5827354A JPS5827354A (ja) 1983-02-18
JPH0345543B2 true JPH0345543B2 (enrdf_load_stackoverflow) 1991-07-11

Family

ID=23100361

Family Applications (2)

Application Number Title Priority Date Filing Date
JP12909982A Granted JPS5827354A (ja) 1981-07-27 1982-07-26 集積回路用キャリア
JP13476787A Granted JPS63114153A (ja) 1981-07-27 1987-05-29 集積回路用キャリア

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP13476787A Granted JPS63114153A (ja) 1981-07-27 1987-05-29 集積回路用キャリア

Country Status (1)

Country Link
JP (2) JPS5827354A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101478616B1 (ko) * 2014-04-21 2015-01-15 케이.엘.이.에스 주식회사 반사형 금속 단열재

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01132148A (ja) * 1981-07-27 1989-05-24 Texas Instr Inc <Ti> 集積回路用キャリア
JPS592152U (ja) * 1982-06-28 1984-01-09 富士通株式会社 リ−ド付チツプキヤリア
US4657172A (en) * 1985-10-31 1987-04-14 American Microsystems, Inc. Apparatus and method of solder coating integrated circuit leads
JPH0644806B2 (ja) * 1987-02-18 1994-06-08 三洋電機株式会社 オ−トフオ−カス回路

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101478616B1 (ko) * 2014-04-21 2015-01-15 케이.엘.이.에스 주식회사 반사형 금속 단열재

Also Published As

Publication number Publication date
JPS5827354A (ja) 1983-02-18
JPS63114153A (ja) 1988-05-19
JPH0453102B2 (enrdf_load_stackoverflow) 1992-08-25

Similar Documents

Publication Publication Date Title
US4465898A (en) Carrier for integrated circuit
US5386087A (en) Printed circuit board having U-shaped solder mask layer separating respective contacts
JPH0376582B2 (enrdf_load_stackoverflow)
US5177326A (en) Lead wire array for a leadless chip carrier
JPH06302347A (ja) Ｉｃソケット及びそのコンタクト
JPH0345543B2 (enrdf_load_stackoverflow)
US4530552A (en) Electrical connector for integrated circuit package
US4495376A (en) Carrier for integrated circuit
US5392932A (en) Boat transport for suporting semiconductor device assemblies
JPH10256318A (ja) 半導体装置、その製造方法及びその実装方法、これを実装した回路基板並びにフレキシブル基板及びその製造方法
JPH06111869A (ja) 表面実装用端子
KR100246360B1 (ko) 마이크로 비지에이 패키지
JPH0445987B2 (enrdf_load_stackoverflow)
US8105644B2 (en) Manufacturing method of printed circuit board
JPS6223136A (ja) 半導体装置
EP0526147A2 (en) Film-carrier type semiconductor device and process for fabricating the same
JPS635248Y2 (enrdf_load_stackoverflow)
JPH03248543A (ja) フィルムキャリアテープ
JP2502535Y2 (ja) Ｐｇａ型セラミックパッケ―ジ
JP2594365B2 (ja) 配線基板及び配線基板の接続方法
JPH025543Y2 (enrdf_load_stackoverflow)
JPH04243187A (ja) プリント基板
JPH09321218A (ja) 半導体装置およびその製造方法
JPH11261187A (ja) 基板実装部品及びその取付構造
JPH03125464A (ja) 表面実装パッケージ