JPH0343782B2 - - Google Patents
Info
- Publication number
- JPH0343782B2 JPH0343782B2 JP16628283A JP16628283A JPH0343782B2 JP H0343782 B2 JPH0343782 B2 JP H0343782B2 JP 16628283 A JP16628283 A JP 16628283A JP 16628283 A JP16628283 A JP 16628283A JP H0343782 B2 JPH0343782 B2 JP H0343782B2
- Authority
- JP
- Japan
- Prior art keywords
- glass
- heated
- lid
- thin piece
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011521 glass Substances 0.000 claims description 56
- 239000000919 ceramic Substances 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 18
- 238000002844 melting Methods 0.000 claims description 16
- 230000009970 fire resistant effect Effects 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 5
- 238000002788 crimping Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 description 11
- 239000011230 binding agent Substances 0.000 description 10
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 239000005394 sealing glass Substances 0.000 description 5
- 239000000843 powder Substances 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000011819 refractory material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 238000005469 granulation Methods 0.000 description 1
- 230000003179 granulation Effects 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 208000012201 sexual and gender identity disease Diseases 0.000 description 1
- 208000015891 sexual disease Diseases 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Products (AREA)
- Joining Of Glass To Other Materials (AREA)
- Laminated Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16628283A JPS6057652A (ja) | 1983-09-08 | 1983-09-08 | セラミツクジユアルインラインパツケ−ジの封着用ガラス形成方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16628283A JPS6057652A (ja) | 1983-09-08 | 1983-09-08 | セラミツクジユアルインラインパツケ−ジの封着用ガラス形成方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6057652A JPS6057652A (ja) | 1985-04-03 |
| JPH0343782B2 true JPH0343782B2 (US07223432-20070529-C00017.png) | 1991-07-03 |
Family
ID=15828474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16628283A Granted JPS6057652A (ja) | 1983-09-08 | 1983-09-08 | セラミツクジユアルインラインパツケ−ジの封着用ガラス形成方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6057652A (US07223432-20070529-C00017.png) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2535515B2 (ja) * | 1986-10-24 | 1996-09-18 | 日東電工株式会社 | サ−デイツプの製造方法 |
| US5133795A (en) * | 1986-11-04 | 1992-07-28 | General Electric Company | Method of making a silicon package for a power semiconductor device |
| US5034044A (en) * | 1988-05-11 | 1991-07-23 | General Electric Company | Method of bonding a silicon package for a power semiconductor device |
-
1983
- 1983-09-08 JP JP16628283A patent/JPS6057652A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6057652A (ja) | 1985-04-03 |
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