JPH0341556B2 - - Google Patents
Info
- Publication number
- JPH0341556B2 JPH0341556B2 JP57214552A JP21455282A JPH0341556B2 JP H0341556 B2 JPH0341556 B2 JP H0341556B2 JP 57214552 A JP57214552 A JP 57214552A JP 21455282 A JP21455282 A JP 21455282A JP H0341556 B2 JPH0341556 B2 JP H0341556B2
- Authority
- JP
- Japan
- Prior art keywords
- palladium
- bath
- phosphoric acid
- ammonia
- electrodeposition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 69
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 57
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 50
- 229910052763 palladium Inorganic materials 0.000 claims description 32
- 229910021529 ammonia Inorganic materials 0.000 claims description 26
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 25
- 239000003792 electrolyte Substances 0.000 claims description 21
- 238000004070 electrodeposition Methods 0.000 claims description 17
- 239000012153 distilled water Substances 0.000 claims description 15
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 claims description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 10
- 238000002347 injection Methods 0.000 claims description 6
- 239000007924 injection Substances 0.000 claims description 6
- 238000000151 deposition Methods 0.000 claims description 4
- 230000005484 gravity Effects 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 230000008021 deposition Effects 0.000 claims description 2
- 238000001914 filtration Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000007747 plating Methods 0.000 description 13
- 239000000654 additive Substances 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910000069 nitrogen hydride Inorganic materials 0.000 description 2
- 150000002940 palladium Chemical class 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 101150003085 Pdcl gene Proteins 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- -1 amine compounds Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 150000002941 palladium compounds Chemical class 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Battery Electrode And Active Subsutance (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE3148788.2 | 1981-12-09 | ||
| DE3148788A DE3148788C2 (de) | 1981-12-09 | 1981-12-09 | Wäßriges Bad und Verfahren zum galvanischen Abscheiden von glänzenden und rißfreien Palladiumschichten sowie Verfahren zur Herstellung des Bades |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58107492A JPS58107492A (ja) | 1983-06-27 |
| JPH0341556B2 true JPH0341556B2 (enExample) | 1991-06-24 |
Family
ID=6148299
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57214552A Granted JPS58107492A (ja) | 1981-12-09 | 1982-12-06 | パラジウム層の電着用水性浴およびその製法、並びに電着方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US4451336A (enExample) |
| EP (1) | EP0081788B1 (enExample) |
| JP (1) | JPS58107492A (enExample) |
| DE (2) | DE3148788C2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4622110A (en) * | 1981-10-06 | 1986-11-11 | Learonal, Inc. | Palladium plating |
| US4545868A (en) * | 1981-10-06 | 1985-10-08 | Learonal, Inc. | Palladium plating |
| DE3443420A1 (de) * | 1984-11-26 | 1986-05-28 | Siemens AG, 1000 Berlin und 8000 München | Galvanisches bad zur schnellabscheidung von palladium-legierungen |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US330149A (en) * | 1885-11-10 | Gaston pilbt and clement cabby | ||
| SU454280A1 (ru) * | 1972-10-17 | 1974-12-25 | Киевский Ордена Ленина Политехнический Институт Им.50-Летия Великой Октябрьской Социалистической Революции | Электролит дл осаждени сплава платина-палладий |
| US3925170A (en) * | 1974-01-23 | 1975-12-09 | American Chem & Refining Co | Method and composition for producing bright palladium electrodepositions |
| US3972787A (en) * | 1974-06-14 | 1976-08-03 | Lea-Ronal, Inc. | Palladium electrolyte baths utilizing quaternized pyridine compounds as brighteners |
| DE2551988A1 (de) * | 1975-11-17 | 1977-05-26 | Schering Ag | Verfahren zur selektiven galvanischen abscheidung von metallen sowie vorrichtung zur durchfuehrung des verfahrens |
| DE2657925A1 (de) * | 1976-12-21 | 1978-06-22 | Siemens Ag | Ammoniakfreies, waessriges bad zur galvanischen abscheidung von palladium bzw. palladiumlegierungen |
| FR2403399A1 (fr) * | 1977-09-19 | 1979-04-13 | Oxy Metal Industries Corp | Bains de revetement electrolytique de palladium brillant |
| GB2028870B (en) * | 1978-07-26 | 1982-11-03 | Effluent Treatment Ltd | Electrolysis method and apparatus for treating solutions |
| NL7812196A (nl) * | 1978-12-15 | 1980-06-17 | Galentan Ag | Inrichting voor het electrolytisch aanbrengen van metalen deklagen. |
| DE2939920C2 (de) * | 1979-10-02 | 1982-09-23 | W.C. Heraeus Gmbh, 6450 Hanau | Verwendung eines Amins in einem Bad zum galvanischen Abscheiden von Palladium |
| US4392921A (en) * | 1980-12-17 | 1983-07-12 | Occidental Chemical Corporation | Composition and process for electroplating white palladium |
| DE3108358C2 (de) * | 1981-03-05 | 1985-08-29 | Siemens AG, 1000 Berlin und 8000 München | Vorrichtung zum partiellen Galvanisieren von zu elektrisch leitenden Bändern, Streifen oder dgl. zusammengefaßten Teilen im Durchlaufverfahren |
| EP0076523B1 (en) * | 1981-10-06 | 1988-06-29 | LeaRonal, Inc. | A method of high speed electroplating palladium and palladium electroplating solution therefor |
-
1981
- 1981-12-09 DE DE3148788A patent/DE3148788C2/de not_active Expired
-
1982
- 1982-11-19 US US06/443,011 patent/US4451336A/en not_active Expired - Fee Related
- 1982-12-06 EP EP82111270A patent/EP0081788B1/de not_active Expired
- 1982-12-06 DE DE8282111270T patent/DE3277311D1/de not_active Expired
- 1982-12-06 JP JP57214552A patent/JPS58107492A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| DE3277311D1 (en) | 1987-10-22 |
| EP0081788B1 (de) | 1987-09-16 |
| EP0081788A1 (de) | 1983-06-22 |
| DE3148788A1 (de) | 1983-07-21 |
| JPS58107492A (ja) | 1983-06-27 |
| DE3148788C2 (de) | 1986-08-21 |
| US4451336A (en) | 1984-05-29 |
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