JPH0341474Y2 - - Google Patents
Info
- Publication number
- JPH0341474Y2 JPH0341474Y2 JP1985202064U JP20206485U JPH0341474Y2 JP H0341474 Y2 JPH0341474 Y2 JP H0341474Y2 JP 1985202064 U JP1985202064 U JP 1985202064U JP 20206485 U JP20206485 U JP 20206485U JP H0341474 Y2 JPH0341474 Y2 JP H0341474Y2
- Authority
- JP
- Japan
- Prior art keywords
- cap
- circuit board
- ring
- substrate
- sealant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 description 7
- 239000000565 sealant Substances 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985202064U JPH0341474Y2 (US07223432-20070529-C00017.png) | 1985-12-24 | 1985-12-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985202064U JPH0341474Y2 (US07223432-20070529-C00017.png) | 1985-12-24 | 1985-12-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62107457U JPS62107457U (US07223432-20070529-C00017.png) | 1987-07-09 |
| JPH0341474Y2 true JPH0341474Y2 (US07223432-20070529-C00017.png) | 1991-08-30 |
Family
ID=31166103
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985202064U Expired JPH0341474Y2 (US07223432-20070529-C00017.png) | 1985-12-24 | 1985-12-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0341474Y2 (US07223432-20070529-C00017.png) |
-
1985
- 1985-12-24 JP JP1985202064U patent/JPH0341474Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62107457U (US07223432-20070529-C00017.png) | 1987-07-09 |
