JPH0334914Y2 - - Google Patents
Info
- Publication number
- JPH0334914Y2 JPH0334914Y2 JP4096685U JP4096685U JPH0334914Y2 JP H0334914 Y2 JPH0334914 Y2 JP H0334914Y2 JP 4096685 U JP4096685 U JP 4096685U JP 4096685 U JP4096685 U JP 4096685U JP H0334914 Y2 JPH0334914 Y2 JP H0334914Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- heat
- semiconductor element
- conductive member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4096685U JPH0334914Y2 (en:Method) | 1985-03-20 | 1985-03-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4096685U JPH0334914Y2 (en:Method) | 1985-03-20 | 1985-03-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61157336U JPS61157336U (en:Method) | 1986-09-30 |
| JPH0334914Y2 true JPH0334914Y2 (en:Method) | 1991-07-24 |
Family
ID=30550350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4096685U Expired JPH0334914Y2 (en:Method) | 1985-03-20 | 1985-03-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0334914Y2 (en:Method) |
-
1985
- 1985-03-20 JP JP4096685U patent/JPH0334914Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61157336U (en:Method) | 1986-09-30 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2002290087A (ja) | オンボード実装型電子機器およびオンボード実装型電源装置 | |
| US6351385B1 (en) | Heat sink for integrated circuit packages | |
| US5757619A (en) | Cooling apparatus for electronic components | |
| US7360586B2 (en) | Wrap around heat sink apparatus and method | |
| JPH0334914Y2 (en:Method) | ||
| JPH0736468U (ja) | 電子部品の放熱構造 | |
| JP2536470Y2 (ja) | プリント基盤固定構造 | |
| JP2779537B2 (ja) | フィン付き電子部品搭載用基板 | |
| JP2612455B2 (ja) | 半導体素子搭載用基板 | |
| JPH09102685A (ja) | 電子装置の放熱構造 | |
| JPH10224065A (ja) | 電子回路の放熱構造 | |
| JP2002033428A (ja) | 放熱板固定端子 | |
| JP2003152365A (ja) | 電子回路パッケージの冷却構造及びヒートシンク | |
| JP2575953Y2 (ja) | 半導体部品取付構造 | |
| JPS6228773Y2 (en:Method) | ||
| JPH039335Y2 (en:Method) | ||
| JPH0412684Y2 (en:Method) | ||
| JPH0810230Y2 (ja) | 電気部品と放熱体の取付構造 | |
| JPS6246270Y2 (en:Method) | ||
| JPH0222956Y2 (en:Method) | ||
| JPH11289036A (ja) | 電子装置 | |
| JPH1093270A (ja) | 表面実装素子の放熱構造 | |
| JPS6144443Y2 (en:Method) | ||
| JPS621251A (ja) | 放熱フインの構造 | |
| JP2879786B2 (ja) | 半導体装置の放熱構造 |