JPH0334542A - 半導体ウエハの当板固着方法および装置 - Google Patents

半導体ウエハの当板固着方法および装置

Info

Publication number
JPH0334542A
JPH0334542A JP16921289A JP16921289A JPH0334542A JP H0334542 A JPH0334542 A JP H0334542A JP 16921289 A JP16921289 A JP 16921289A JP 16921289 A JP16921289 A JP 16921289A JP H0334542 A JPH0334542 A JP H0334542A
Authority
JP
Japan
Prior art keywords
semiconductor wafer
backplates
semiconductor wafers
plate
contact plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16921289A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0583174B2 (enExample
Inventor
Tsutomu Sato
勉 佐藤
Yuichi Kimura
裕一 木村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Naoetsu Electronics Co Ltd
Original Assignee
Naoetsu Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Naoetsu Electronics Co Ltd filed Critical Naoetsu Electronics Co Ltd
Priority to JP16921289A priority Critical patent/JPH0334542A/ja
Publication of JPH0334542A publication Critical patent/JPH0334542A/ja
Publication of JPH0583174B2 publication Critical patent/JPH0583174B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)
JP16921289A 1989-06-30 1989-06-30 半導体ウエハの当板固着方法および装置 Granted JPH0334542A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16921289A JPH0334542A (ja) 1989-06-30 1989-06-30 半導体ウエハの当板固着方法および装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16921289A JPH0334542A (ja) 1989-06-30 1989-06-30 半導体ウエハの当板固着方法および装置

Publications (2)

Publication Number Publication Date
JPH0334542A true JPH0334542A (ja) 1991-02-14
JPH0583174B2 JPH0583174B2 (enExample) 1993-11-25

Family

ID=15882284

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16921289A Granted JPH0334542A (ja) 1989-06-30 1989-06-30 半導体ウエハの当板固着方法および装置

Country Status (1)

Country Link
JP (1) JPH0334542A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10323779B2 (en) 2013-11-20 2019-06-18 Toki Engineering Co., Ltd. Pipe coupling structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10323779B2 (en) 2013-11-20 2019-06-18 Toki Engineering Co., Ltd. Pipe coupling structure

Also Published As

Publication number Publication date
JPH0583174B2 (enExample) 1993-11-25

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