JPH0583174B2 - - Google Patents
Info
- Publication number
- JPH0583174B2 JPH0583174B2 JP16921289A JP16921289A JPH0583174B2 JP H0583174 B2 JPH0583174 B2 JP H0583174B2 JP 16921289 A JP16921289 A JP 16921289A JP 16921289 A JP16921289 A JP 16921289A JP H0583174 B2 JPH0583174 B2 JP H0583174B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor wafer
- contact plate
- wafer
- parallel
- mounting table
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 235000012431 wafers Nutrition 0.000 claims description 111
- 239000004065 semiconductor Substances 0.000 claims description 78
- 239000000853 adhesive Substances 0.000 claims description 25
- 230000001070 adhesive effect Effects 0.000 claims description 25
- 239000012535 impurity Substances 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 20
- 238000003860 storage Methods 0.000 claims description 16
- 230000001105 regulatory effect Effects 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 238000009792 diffusion process Methods 0.000 claims description 3
- 230000000694 effects Effects 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000036544 posture Effects 0.000 description 3
- 238000011084 recovery Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000010186 staining Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16921289A JPH0334542A (ja) | 1989-06-30 | 1989-06-30 | 半導体ウエハの当板固着方法および装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16921289A JPH0334542A (ja) | 1989-06-30 | 1989-06-30 | 半導体ウエハの当板固着方法および装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0334542A JPH0334542A (ja) | 1991-02-14 |
| JPH0583174B2 true JPH0583174B2 (enExample) | 1993-11-25 |
Family
ID=15882284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16921289A Granted JPH0334542A (ja) | 1989-06-30 | 1989-06-30 | 半導体ウエハの当板固着方法および装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0334542A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015075966A1 (ja) | 2013-11-20 | 2015-05-28 | ＴＯＫｉエンジニアリング株式会社 | 管継手構造体 |
-
1989
- 1989-06-30 JP JP16921289A patent/JPH0334542A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0334542A (ja) | 1991-02-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |