JPH0334227U - - Google Patents
Info
- Publication number
- JPH0334227U JPH0334227U JP9471689U JP9471689U JPH0334227U JP H0334227 U JPH0334227 U JP H0334227U JP 9471689 U JP9471689 U JP 9471689U JP 9471689 U JP9471689 U JP 9471689U JP H0334227 U JPH0334227 U JP H0334227U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- view
- electrode
- plan
- solder layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
Description
第1図aおよびbは本考案の一実施例に係る電
子部品の電極の周辺部を拡大して模式的に示す平
面図および側面図、第2図aおよびbは同電子部
品にリード端子を差込んだところを模式的に示す
平面図および側面図、第3図aおよびbは電極形
状が変化された電子部品の一例を示す平面図およ
び側面図、第4図aおよびbは電極形状が変化さ
れた電子部品の他の例を示す平面図および側面図
、第5図は本考案の背景となる電子部品の一例を
示す平面図、第6図は同電子部品の部分断面模式
図、第7図aおよびbは従来の電子部品の電極の
周辺部を拡大して模式的に示す平面図および側面
図である。
符号の説明、1,1a,1b……電子部品、2
,2a,2b……電極、3……基板、4……リー
ド端子、4a……接続部、5,5a,5b……半
田層、6,6a,6b……ガイド部。
1A and 1B are plan views and side views schematically showing an enlarged peripheral part of an electrode of an electronic component according to an embodiment of the present invention, and FIGS. 2A and 2B are diagrams showing lead terminals on the same electronic component. A plan view and a side view schematically showing the inserted part, FIGS. 3 a and b are a plan view and a side view showing an example of an electronic component with a changed electrode shape, and FIGS. 4 a and b show an example of an electronic component with a changed electrode shape. FIG. 5 is a plan view and side view showing another example of the electronic component that has been changed; FIG. 5 is a plan view showing an example of the electronic component that is the background of the present invention; FIG. 7a and 7b are a plan view and a side view schematically showing an enlarged peripheral part of an electrode of a conventional electronic component. Explanation of symbols, 1, 1a, 1b...electronic parts, 2
, 2a, 2b... Electrode, 3... Substrate, 4... Lead terminal, 4a... Connection portion, 5, 5a, 5b... Solder layer, 6, 6a, 6b... Guide portion.
Claims (1)
た電極が表面に形成された基板を具備する電子部
品において、 上記半田層に上記リード端子の接続部を案内す
るガイド部が形成されていることを特徴とする電
子部品。[Claims for Utility Model Registration] An electronic component comprising a substrate on the surface of which an electrode is formed with a solder layer for connecting a lead terminal, a guide for guiding the connecting portion of the lead terminal to the solder layer. An electronic component characterized by having a part formed therein.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9471689U JPH0334227U (en) | 1989-08-11 | 1989-08-11 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9471689U JPH0334227U (en) | 1989-08-11 | 1989-08-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0334227U true JPH0334227U (en) | 1991-04-04 |
Family
ID=31644029
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9471689U Pending JPH0334227U (en) | 1989-08-11 | 1989-08-11 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0334227U (en) |
-
1989
- 1989-08-11 JP JP9471689U patent/JPH0334227U/ja active Pending