JPH0331599B2 - - Google Patents
Info
- Publication number
- JPH0331599B2 JPH0331599B2 JP8891686A JP8891686A JPH0331599B2 JP H0331599 B2 JPH0331599 B2 JP H0331599B2 JP 8891686 A JP8891686 A JP 8891686A JP 8891686 A JP8891686 A JP 8891686A JP H0331599 B2 JPH0331599 B2 JP H0331599B2
- Authority
- JP
- Japan
- Prior art keywords
- copper plate
- copper
- integrated circuit
- resin layer
- protective film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 30
- 229910052802 copper Inorganic materials 0.000 claims description 25
- 239000010949 copper Substances 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 11
- 238000005530 etching Methods 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 7
- 239000011889 copper foil Substances 0.000 claims description 5
- 229910001374 Invar Inorganic materials 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 230000001681 protective effect Effects 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 3
- 229920000298 Cellophane Polymers 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8891686A JPS62244625A (ja) | 1986-04-17 | 1986-04-17 | 混成集積回路基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8891686A JPS62244625A (ja) | 1986-04-17 | 1986-04-17 | 混成集積回路基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62244625A JPS62244625A (ja) | 1987-10-26 |
| JPH0331599B2 true JPH0331599B2 (enrdf_load_stackoverflow) | 1991-05-07 |
Family
ID=13956247
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8891686A Granted JPS62244625A (ja) | 1986-04-17 | 1986-04-17 | 混成集積回路基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62244625A (enrdf_load_stackoverflow) |
-
1986
- 1986-04-17 JP JP8891686A patent/JPS62244625A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62244625A (ja) | 1987-10-26 |
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