JPH0217946B2 - - Google Patents
Info
- Publication number
- JPH0217946B2 JPH0217946B2 JP23682085A JP23682085A JPH0217946B2 JP H0217946 B2 JPH0217946 B2 JP H0217946B2 JP 23682085 A JP23682085 A JP 23682085A JP 23682085 A JP23682085 A JP 23682085A JP H0217946 B2 JPH0217946 B2 JP H0217946B2
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- roughened
- rolled copper
- aluminum
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 43
- 239000011889 copper foil Substances 0.000 claims description 39
- 229910052782 aluminium Inorganic materials 0.000 claims description 19
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 19
- 238000007747 plating Methods 0.000 claims description 17
- 239000012808 vapor phase Substances 0.000 claims description 11
- 239000011888 foil Substances 0.000 claims description 9
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 238000005530 etching Methods 0.000 claims description 8
- 239000008151 electrolyte solution Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 10
- 238000002845 discoloration Methods 0.000 description 7
- 239000010408 film Substances 0.000 description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 5
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- 239000011701 zinc Substances 0.000 description 5
- 229910052725 zinc Inorganic materials 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000007788 roughening Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000004070 electrodeposition Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000010953 base metal Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 238000004649 discoloration prevention Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000005554 pickling Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Physical Vapour Deposition (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23682085A JPS62136092A (ja) | 1985-10-23 | 1985-10-23 | プリント配線回路用金属箔 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23682085A JPS62136092A (ja) | 1985-10-23 | 1985-10-23 | プリント配線回路用金属箔 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62136092A JPS62136092A (ja) | 1987-06-19 |
JPH0217946B2 true JPH0217946B2 (enrdf_load_stackoverflow) | 1990-04-24 |
Family
ID=17006266
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23682085A Granted JPS62136092A (ja) | 1985-10-23 | 1985-10-23 | プリント配線回路用金属箔 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62136092A (enrdf_load_stackoverflow) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2681188B2 (ja) * | 1988-04-04 | 1997-11-26 | イビデン株式会社 | 金属表面改質法 |
JP2008279663A (ja) * | 2007-05-10 | 2008-11-20 | Nikko Kinzoku Kk | 銅張り積層板用Al被膜付き銅箔及び銅張り積層板 |
-
1985
- 1985-10-23 JP JP23682085A patent/JPS62136092A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS62136092A (ja) | 1987-06-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0773710A1 (en) | Flexible printed wiring board | |
US5501350A (en) | Process for producing printed wiring board | |
WO2001074585A1 (fr) | Couche mince en polyimide metallisee | |
JPH0255943B2 (enrdf_load_stackoverflow) | ||
JPH11268183A (ja) | ポリイミド−金属積層体およびその製造方法 | |
JP2005054259A (ja) | プラスチックフィルム及びその製造方法及びそれを応用したフレキシブルプリント回路基板 | |
CN114929944A (zh) | 表面处理铜箔及其制造方法 | |
JPH05259596A (ja) | フレキシブルプリント配線用基板 | |
JPH0217946B2 (enrdf_load_stackoverflow) | ||
KR20210106811A (ko) | 연성회로기판 적층구조체의 제조방법 및 제조장치 | |
US5057193A (en) | Anti-tarnish treatment of metal foil | |
JPH05110247A (ja) | フレキシブル印刷配線用基板の製造方法 | |
JPH05136547A (ja) | フレキシブル印刷配線用基板の製造方法 | |
WO1986001544A1 (en) | Process for etching electrode foil for aluminum electrolytic capacitor | |
KR102175755B1 (ko) | 연성동박적층필름 및 이의 제조방법 | |
JPH05299820A (ja) | フレキシブルプリント配線板 | |
JP2001288569A (ja) | プラズマ処理装置およびプラズマ処理方法 | |
JPS6214040B2 (enrdf_load_stackoverflow) | ||
JP3731841B2 (ja) | 二層フレキシブル回路基材の製造方法 | |
JP3269818B2 (ja) | 表面粗化銅とその製造方法、及びそれを用いたプリント基板 | |
JPH0257712B2 (enrdf_load_stackoverflow) | ||
JP2003094589A (ja) | 積層材の製造方法及び積層材の製造装置 | |
JPH05259595A (ja) | フレキシブルプリント配線用基板 | |
JPH05283848A (ja) | フレキシブルプリント配線板 | |
JPH03225995A (ja) | 配線板 |