JPS62136092A - プリント配線回路用金属箔 - Google Patents

プリント配線回路用金属箔

Info

Publication number
JPS62136092A
JPS62136092A JP23682085A JP23682085A JPS62136092A JP S62136092 A JPS62136092 A JP S62136092A JP 23682085 A JP23682085 A JP 23682085A JP 23682085 A JP23682085 A JP 23682085A JP S62136092 A JPS62136092 A JP S62136092A
Authority
JP
Japan
Prior art keywords
roughened
copper foil
printed wiring
foil
wiring circuits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23682085A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0217946B2 (enrdf_load_stackoverflow
Inventor
鎌田　長生
渡瀬　眞生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Arkray Inc
Hitachi Cable Ltd
Original Assignee
Arkray Inc
Hitachi Cable Ltd
Kyoto Daiichi Kagaku KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arkray Inc, Hitachi Cable Ltd, Kyoto Daiichi Kagaku KK filed Critical Arkray Inc
Priority to JP23682085A priority Critical patent/JPS62136092A/ja
Publication of JPS62136092A publication Critical patent/JPS62136092A/ja
Publication of JPH0217946B2 publication Critical patent/JPH0217946B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP23682085A 1985-10-23 1985-10-23 プリント配線回路用金属箔 Granted JPS62136092A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23682085A JPS62136092A (ja) 1985-10-23 1985-10-23 プリント配線回路用金属箔

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23682085A JPS62136092A (ja) 1985-10-23 1985-10-23 プリント配線回路用金属箔

Publications (2)

Publication Number Publication Date
JPS62136092A true JPS62136092A (ja) 1987-06-19
JPH0217946B2 JPH0217946B2 (enrdf_load_stackoverflow) 1990-04-24

Family

ID=17006266

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23682085A Granted JPS62136092A (ja) 1985-10-23 1985-10-23 プリント配線回路用金属箔

Country Status (1)

Country Link
JP (1) JPS62136092A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01255687A (ja) * 1988-04-04 1989-10-12 Ibiden Co Ltd 金属表面改質法
JP2008279663A (ja) * 2007-05-10 2008-11-20 Nikko Kinzoku Kk 銅張り積層板用Ａｌ被膜付き銅箔及び銅張り積層板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01255687A (ja) * 1988-04-04 1989-10-12 Ibiden Co Ltd 金属表面改質法
JP2008279663A (ja) * 2007-05-10 2008-11-20 Nikko Kinzoku Kk 銅張り積層板用Ａｌ被膜付き銅箔及び銅張り積層板

Also Published As

Publication number Publication date
JPH0217946B2 (enrdf_load_stackoverflow) 1990-04-24

Similar Documents

Publication Publication Date Title
JP4754402B2 (ja) キャリア箔付銅箔、キャリア箔付銅箔の製造方法、キャリア箔付表面処理銅箔及びそのキャリア箔付表面処理銅箔を用いた銅張積層板
CN101454153B (zh) 带载体片的铜箔、带载体片铜箔的制造方法、带载体片的表面处理铜箔以及采用该带载体片的表面处理铜箔的覆铜层压板
US4568413A (en) Metallized and plated laminates
EP0989914B1 (en) Multilayer metalized composite on polymer film product and process
EP0773710A1 (en) Flexible printed wiring board
WO2001074585A1 (fr) Couche mince en polyimide metallisee
WO2001016402A1 (fr) Feuille de cuivre electrolytique avec feuille support et son procede de fabrication et lamine a gaine de cuivre utilisant la feuille de cuivre electrolytique
JPH11268183A (ja) ポリイミド−金属積層体およびその製造方法
CN114929944A (zh) 表面处理铜箔及其制造方法
JPS62136092A (ja) プリント配線回路用金属箔
JPH0983134A (ja) フレキシブルプリント回路用基板
KR20120053195A (ko) 내열접착력을 개선한 연성회로기판용 동박 적층 구조체 및 그의 제조방법
KR20210106811A (ko) 연성회로기판 적층구조체의 제조방법 및 제조장치
JP7043731B2 (ja) 銅張積層基板とその製造方法、並びに配線基板
WO1986001544A1 (en) Process for etching electrode foil for aluminum electrolytic capacitor
JPS6214040B2 (enrdf_load_stackoverflow)
JPH05299820A (ja) フレキシブルプリント配線板
KR102175755B1 (ko) 연성동박적층필름 및 이의 제조방법
WO2010004885A1 (ja) 表面処理銅箔
JPS61189689A (ja) プリント回路用金属箔
JP2008297569A (ja) 表面処理銅箔
JPH01214096A (ja) フレキシブルプリント回路基板の製造方法
JP2006310359A (ja) フレキシブルプリント回路用基板
JPH05259595A (ja) フレキシブルプリント配線用基板
JPH05283848A (ja) フレキシブルプリント配線板