JPH0329198B2 - - Google Patents
Info
- Publication number
- JPH0329198B2 JPH0329198B2 JP59038710A JP3871084A JPH0329198B2 JP H0329198 B2 JPH0329198 B2 JP H0329198B2 JP 59038710 A JP59038710 A JP 59038710A JP 3871084 A JP3871084 A JP 3871084A JP H0329198 B2 JPH0329198 B2 JP H0329198B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- matrix
- group
- wiring group
- capacitance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000006243 chemical reaction Methods 0.000 claims description 8
- 239000011159 matrix material Substances 0.000 description 27
- 238000000034 method Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 5
- 230000007423 decrease Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000003491 array Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Facsimile Heads (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59038710A JPS60183785A (ja) | 1984-03-02 | 1984-03-02 | 配線装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59038710A JPS60183785A (ja) | 1984-03-02 | 1984-03-02 | 配線装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60183785A JPS60183785A (ja) | 1985-09-19 |
| JPH0329198B2 true JPH0329198B2 (enExample) | 1991-04-23 |
Family
ID=12532870
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59038710A Granted JPS60183785A (ja) | 1984-03-02 | 1984-03-02 | 配線装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60183785A (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0715978B2 (ja) * | 1985-12-13 | 1995-02-22 | 三菱電機株式会社 | イメ−ジセンサ |
-
1984
- 1984-03-02 JP JP59038710A patent/JPS60183785A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60183785A (ja) | 1985-09-19 |
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