JPH0328746U - - Google Patents

Info

Publication number
JPH0328746U
JPH0328746U JP8931589U JP8931589U JPH0328746U JP H0328746 U JPH0328746 U JP H0328746U JP 8931589 U JP8931589 U JP 8931589U JP 8931589 U JP8931589 U JP 8931589U JP H0328746 U JPH0328746 U JP H0328746U
Authority
JP
Japan
Prior art keywords
semiconductor
semiconductor pellet
resin
lead frame
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8931589U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8931589U priority Critical patent/JPH0328746U/ja
Publication of JPH0328746U publication Critical patent/JPH0328746U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Description

【図面の簡単な説明】
第１図は本考案の第１の実施例のリードフレー
ムに半導体ペレツトを搭載した平面図、第２図は
本考案の第２の実施例のリードフレームに半導体
ペレツトを搭載した平面図、第３図は本考案の実
施例の効果確認のための試験方法を説明する要部
側面図、第４図は第３図による強度試験結果を示
す特性図、第５図は従来のリードフレームの一例
に半導体ペレツトを搭載した平面図である。 １，１１，２１……リードフレーム、２，１２
，２２……アウター放熱板、３……アウターリー
ド、４……半導体ペレツト、５……半導体ペレツ
ト搭載部、６，１６……切り溝、７……樹脂封止
エリア、８……封止樹脂、９……クランプ。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体ペレツトを搭載する半導体ペレツト搭載
    部と、該半導体ペレツト搭載部に接続するアウタ
    ー放熱板と、前記半導体ペレツトの電極に接続し
    外部へ導出するアウターリードとを有する樹脂封
    止型半導体装置用リードフレームにおいて、前記
    半導体搭載部とアウター放熱板との間の樹脂エリ
    ア内に少くとも１個の切り溝を設けたことを特徴
    とする樹脂封止型半導体装置用リードフレーム。
JP8931589U 1989-07-28 1989-07-28 Pending JPH0328746U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8931589U JPH0328746U (ja) 1989-07-28 1989-07-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8931589U JPH0328746U (ja) 1989-07-28 1989-07-28

Publications (1)

Publication Number Publication Date
JPH0328746U true JPH0328746U (ja) 1991-03-22

Family

ID=31638898

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8931589U Pending JPH0328746U (ja) 1989-07-28 1989-07-28

Country Status (1)

Country Link
JP (1) JPH0328746U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002291789A (ja) * 2001-03-29 2002-10-08 Impress:Kk 人体部位当て具、保温具、保冷具及び炭化物を収容した袋

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60161647A (ja) * 1984-02-02 1985-08-23 Toshiba Corp 半導体装置用リ−ドフレ−ム

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60161647A (ja) * 1984-02-02 1985-08-23 Toshiba Corp 半導体装置用リ−ドフレ−ム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002291789A (ja) * 2001-03-29 2002-10-08 Impress:Kk 人体部位当て具、保温具、保冷具及び炭化物を収容した袋

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