JPH03285383A - Metallic base wiring board - Google Patents

Abstract

PURPOSE:To improve heat resistance by arranging metallic foil sheets coated with inorganic composite layers on the upper and/or lower side of a metal plate via a resin layer and integrating them all together. CONSTITUTION:Metallic foil sheets coated with inorganic composite layers are arranged on the upper and/or lower side of metal plate via resin layers to be integrated all together. As the metal plate, aluminum or the like alone, its alloy or complex plate can be used. The metal plate is favorably 0.1-10mm thick and interlayer adhesiveness is improved by roughening the surface of the metal plate. As the resin layer, the application layer of phenol resin, fluororesin or the like alone, its modified resin, mixed resin or the like, a resin impregnated base material layer, a resin sheet layer or the like alone, its complex layer or a layer made of a resin impregnated base material wherein a layer thickness is easily unified is favorable. The partial hydrolyzate of alkyltrialkoxyl-silane or the like with a thermosetting property dispersed in an organic solvent in a sol state is used as a coating inorganic composite. The 0.018-0.07mm thick foil sheet of copper, aluminum or the like alone, its alloy or complex is used as the metallic foil sheet and coating inorganic composite layer is required to be provided on an adhesive surface.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a metal-based wiring board used in electronic equipment, electrical equipment, computers, communication equipment, etc.

[Conventional technology]

Conventional metal-based wiring boards are made by integrally disposing metal foil on the top and/or bottom of a metal plate with a resin layer interposed between them, and are used in a variety of applications due to their heat dissipation properties, but the heat resistance has been further improved. There was a request to do so.

(Problems to be Solved by the Invention) As described in the prior art section, there is a strong desire to improve the heat resistance of conventional metal-based wiring boards.

The present invention has been made in view of the above-mentioned problems in the prior art, and its purpose is to provide a metal-based wiring board with excellent heat resistance.

[Means for solving problems]

The present invention is a metal-based wiring board characterized by integrally disposing a metal foil coated with an inorganic coating composition on the upper and/or lower surfaces of a metal plate via a resin layer. The present invention will now be described in detail.

Metal plates used in the present invention include aluminum, steel, iron,
Single, alloy, or composite plates of copper, zinc, nickel, etc. can be used, and the thickness is preferably 0.1 to 10 ma+, and the surface of the metal plate is further activated by physical treatment or chemical treatment.
It is also possible to roughen the surface and improve interlayer adhesion. The resin layer includes phenol resin, cresol resin, epoxy resin, unsaturated polyester resin, melamine resin, polyimide, polybutadiene, polyamide, polyamideimide,
Coating layers of polysulfone, polyphenylene sulfide, polyphenylene oxide, polybutylene terephthalate, polyethylene terephthalate, fluorinated resins, etc. alone, modified products, mixtures, etc., individual or composite layers such as resin-impregnated base material layers, resin sheet layers, etc. are used. However, it is preferable to use a resin-impregnated base material that can easily make the resin layer thickness uniform.

The inorganic coating composition used is one that has thermosetting properties and is dispersed in the form of a sol in an organic solvent. Partial hydrolysates, partial hydrolysates of alkyltrialkoxysilanes and tetraalkoxysilanes, partial hydrolysates of alkyltrialkoxysilanes, alkyltrihydroxylanes and colloidal silica, alkyltriacquinesilanes and tetraalkoxysilanes and silane cambling agents These include partial hydrolysates of The inorganic coating composition may contain curing agents, curing accelerators, leveling agents, thickeners,
Stabilizers, colorants, etc. may also be added. Thickness is 0 for metal foil.

It is preferable to use single, alloy, or composite foils of copper, aluminum, iron, nickel, zinc, etc. with a thickness of 0.018 to 0.07 mm, and the adhesive surface may be surface-treated by physical treatment or chemical treatment if necessary. However, it is necessary to provide the above-mentioned inorganic coating composition layer on the adhesive surface. Application to the adhesive surface can be carried out by any application method such as brushing, spraying, dipping, flow coating, or transfer. The integration means may be laminated under pressure or pressureless laminated using a press, multi-stage press, multi-roll, double-held, etc., and is not particularly limited.

The present invention will be explained below based on examples.

Example C] After polishing one side of the iron plate with a thickness of 1 with sandpaper, the thickness was reduced to 0.
．． Through two pieces of 1 mm epoxy resin-impregnated glass cloth,
After spraying an inorganic coating composition on one side of a 35 micron thick copper foil so that the film thickness after curing is 10 microns,
Dry at 120'C for 10 minutes and then dry at 160'C.
The copper foil coated with the inorganic coating composition layer heat-cured at C for 30 minutes was layered and laminated and molded at 165° C. for 90 minutes at a molding pressure of 30 kg/d to obtain a metal base wiring board. The inorganic coating composition used at this time was placed in a hydrolysis vessel equipped with a reflux condenser, containing 68 parts by weight of isopropyl alcohol (hereinafter simply referred to as parts), 38 parts of tetraethoxysilane, 72 parts of methyltriethoxysilane, and 0.5 parts by weight of isopropyl alcohol. A partial hydrolyzate of alkyltrialkoxysilane and tetraalkoxysilane was obtained by adding 36 parts of 0 5 N hydrochloric acid and reacting with heating for 5 hours.

r Comparative Example] A metal base wiring board was obtained by processing in the same manner as in the example except that a 35 micron thick copper foil was not coated with the inorganic coating composition of the example.

The performance of the metal-based wiring boards of Examples and Comparative Examples 1 and 2 is shown in Table 1.

Table 1 Note: Strength after being held on molten solder at 260°C for 10 seconds (effects of the invention) The present invention is constructed as described above.In a metal-based wiring board having the construction described in the claims. has the effect of improving heat resistance.

Claims (1)

[Claims] (1) A metal-based wiring board characterized in that a metal foil coated with an inorganic coating composition layer is integrally disposed on the upper and/or lower surfaces of a metal plate via a resin layer.