JPH03254175A - Metal base wiring board - Google Patents

Abstract

PURPOSE:To improve rust preventive property by providing a metal foil, in which a resin layer is integrally arranged on the surface and/or the rear surface of a metal board and an inorganic coating composite layer is arranged on the outermost side through a thermocuring resin primer. CONSTITUTION:A metal foil is integrally arranged on the surface and/or the rear surface of a metal board, and an inorganic coating composite layer is arranged on the outermost side through a thermocuring resin primer. Aluminium and steel can be used as the metal board. Alkyl etherized melamin resin and phenol resin is used as the thermocuring resin primer, while that having a thermocuring property and in a state of sol dispersed in an organic solvent is used as the inorganic coating composite. Further, a single, alloy and composite board of copper, aluminium iron, nickel and zinc is desirably used as the metal foil. Thereby, rust preventive property is improved.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a metal-based wiring board used in electronic equipment, electrical equipment, computers, communication equipment, etc.

[Conventional technology]

Conventional metal-based wiring boards are made by integrally disposing metal foil on the top and/or bottom of a metal plate with a resin layer interposed between them, and are used in a variety of applications due to their heat dissipation properties, but the heat resistance has been further improved. There was a request to do so.

[Problem that the invention seeks to solve]

As described in the related art section, there is a strong desire to improve the heat resistance of conventional metal-based wiring boards.

The present invention has been made in view of the above-mentioned problems in the prior art, and its object is to provide a metal-based wiring board with excellent heat resistance.

[Means for solving problems]

The present invention is characterized in that a resin layer is disposed on the upper and/or lower surface of a metal plate, and a metal foil having an inorganic coating composition layer disposed on the outermost side via a thermosetting resin primer is arranged and integrated. The above object can be achieved by using an inorganic coating composition for a metal-based wiring board, and the present invention will be described in detail below.

Metal plates used in the present invention include aluminum, steel, iron,
Single, alloy, or composite plates of copper, zinc, nickel, etc. can be used, and the thickness is preferably 0.1 to 10 ynm, and the surface of the metal plate is activated by physical treatment or chemical treatment.
It is also possible to roughen the surface and improve interlayer adhesion. Thermosetting resin brimers include alkyl etherified melamine resins, phenolic resins, modified phenolic resins, unsaturated polyester resins, epoxy resins, thermosetting acrylic resins, melamine/alkyd resins, acrylic/melamine resins, acrylic/urethane resins, These include composite resins of organic resins and silicon compounds, and these can be used alone or in combination. In addition, in order to carry out the dry curing process after applying the brimer more efficiently and in an energy-saving manner, we have developed resins that harden by irradiation with light energy such as ultraviolet rays, and resins that harden using light energy and heat. Resins can also be used.

When applying the brimer, the brimer is dissolved or dispersed in a suitable organic solvent, and can be applied by any coating method such as dipping, spraying, dipping, flow coating, or transfer, and is then dried and cured. Although the thickness of the cured film of the brimer is not particularly limited, it is preferably 0.1 to 5ξ thick. That is, if the thickness is less than 0.1 micron, the adhesion strength is unstable, and if it exceeds 5 microns, cranks will occur in the inorganic coating composition. Brimer has a pencil hardness of IH class or higher for good adhesion and is preferred.

The inorganic coating composition used is one that has thermosetting properties and is dispersed in the form of a sol in an organic solvent. Partial hydrolyzate, partial hydrolyzate of alkyltrialkoxysilane and tetraalkoxysilane, partial hydrolyzate of alkyltrialkoxysilane, alkyltrihydroxysilane and colloidal silica, alkyltrialkoxysilane and tetraalkoxysilane and silane coupling agent These include partial hydrolysates of A curing agent, a curing accelerator, a leveling agent, a thickener, a stabilizer, a coloring agent, etc. can also be added to the inorganic coating composition as required. The application method is arbitrary, same as with the braiser. The resin layer includes phenolic resin, cresol resin, epoxy resin, unsaturated polyester resin, melamine resin, polyimide, polybutadiene, polyamide, polyamide, polysulfone, polyphenylene sulfide, polyphenylene oxide, polybutylene terephthalate, polyethylene terephthalate, and fluorinated resin. Single or composite layers such as single, modified or mixed coating layers, resin-impregnated base material layers, resin sheet layers, etc. are used, but it is preferable to use resin-impregnated base materials that can easily make the resin layer thickness uniform. .

The metal foil is copper with a thickness of 0.018 to 0.07 mm,
It is preferable to use a single plate, an alloy plate, or a composite plate of aluminum, iron, nickel, zinc, etc., and the adhesive surface may be surface-treated by physical treatment or chemical treatment, if necessary.

The integration means may be laminated under pressure or pressureless laminated using a press, multi-stage press, multi-roll, double belt, etc., and is not particularly limited.

The present invention will be explained below based on examples.

〔Example〕

After sanding one side of an iron plate with a thickness of 1 mm, apply epoxy resin brimer so that the thickness becomes IOS Kron after drying, and after drying, the film thickness after curing is 10 mm.
After spraying the inorganic coating composition to a micron thickness, it was dried at 120°C for 10 minutes, and then heated and cured at 160'C for 30 minutes.
Two sheets of epoxy resin-impregnated glass cloth with a thickness of 0.1 + nm were stacked, and a 35-micron-thick W4 foil was further stacked on top of the cloth and laminated for 90 minutes at a molding pressure of 30 kg/c+f at 1165° C. to obtain a metal base wiring board. The inorganic coating composition used at this time was placed in a hydrolysis vessel equipped with a reflux condenser, containing 68 parts by weight of isopropyl alcohol (hereinafter simply referred to as parts), 38 parts of tetraethoxysilane, and 72 parts of methyltriethoxysilane.
36 parts of 0.05N hydrochloric acid were added thereto and heated for 5 hours to obtain a partial hydrolyzate of alkyltrialkoxysilane and tetraalkoxysilane.

[Comparative Example 1] A metal-based wiring board was obtained in the same manner as in the example except that a 35 micron thick copper foil was not coated with the inorganic coating composition of the example.

[Comparative Example 2] A metal-based wiring board was obtained in the same manner as in the example except that the epoxy resin primer of the example was removed.

Table 1 shows the performance of the metal-based wiring boards of Examples and Comparative Examples 1 and 2.

Table 1 [Effects of the Invention] The present invention is constructed as described above. The metal base wiring board having the structure described in the claims has the effect of improving rust prevention.

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Claims (1)

[Claims] (1) A resin layer is arranged on the upper and/or lower surface of a metal plate, and a metal foil with an inorganic coating composition layer arranged on the outermost side via a thermosetting resin primer is arranged and integrated. Metal-based wiring board.