JPH03254195A - Multilayer wiring board - Google Patents

Abstract

PURPOSE:To improve heat resistance and heat dissipation by integrating a laminate wherein a resin layer is arranged at each upside and/or downside of a required number of inner layer materials where circuits are made, and outer layer materials are arranged at the outermost sides through a thermosetting primer and an inorganic cover composition. CONSTITUTION:A laminate, wherein a resin layer is arranged at each upside and/or downside of a required number of inner layer materials where circuits are made, outer layer materials are arranged at the outermost sides through a thermosetting resin primer and an inorganic cover composition, is integrated. As the resin layer arranged at the upside and/or downside of the inner layer material, the application layer of resin, the base material impregnated with resin, or the like is used, and the thermosetting resin primer is alkyletherified melamine resin, phenol resin, or the like. Hereby, heat resistance and heat dissipation improve.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a multilayer wiring board used in electronic/electrical equipment, computers, communication equipment, etc.

[Conventional technology]

Conventional multilayer wiring boards are made by integrating a laminated body in which a required number of circuit-formed inner layer materials, a resin layer on each top and/or bottom surface, and an outer layer material on the outermost side. Multilayer wiring boards require various needs such as heat resistance and heat dissipation, and the current situation is that they cannot fully meet these needs.

[Problem that the invention seeks to solve]

As described in the section on conventional technology, conventional multilayer wiring boards cannot meet a variety of needs.

The present invention has been made in view of the above-mentioned problems in the prior art, and its purpose is to provide an electrical laminate with excellent heat resistance and heat dissipation properties.

[Means for solving problems]

The present invention integrates a laminate in which a required number of circuit-formed inner layer materials are provided with a resin layer on each upper and/or lower surface, and an outer layer material is provided on the outermost side via a thermosetting resin primer and an inorganic coating composition. The present invention will be described in detail below.

Inner layer materials used in the present invention include phenolic resin, cresol resin, epoxy resin, unsaturated polyester resin,
Melamine resin, polyimide, polybutadiene, polyamide, polyamideimide, polysulfone, polyphenylene sulfide, polyphenylene oxide, polybutylene terephthalate, polyethylene terephthalate, fluorinated resin, etc. alone, modified products, and mixtures of resins, paper, glass cloth, glass nonwoven fabric Electric circuits are formed on single-sided or double-sided metal foil-clad laminates made of base materials such as synthetic fiber cloth, synthetic fiber nonwoven fabric, or cotton, and single, alloy, or composite foils of copper, aluminum, iron, nickel, zinc, etc. It is. The resin layer disposed on the upper and lower surfaces of the inner layer material includes a coating layer of the above resin,
Single or composite layers such as a resin-impregnated base material layer and a resin sheet layer may be used, but it is preferable to use a resin-impregnated base material that can easily make the resin layer thickness uniform. Thermosetting resin primers include alkyl etherified melamine resin, phenolic resin, modified phenolic resin, unsaturated polyester resin, epoxy resin, thermosetting acrylic resin, melagone alkyd resin, acrylic melamine resin, acrylic urethane. These include resins, composite resins of organic resins and silicon compounds, and these can be used alone or in combination. In addition, in order to dry and cure the primer after applying it more efficiently and in an energy-saving manner, we have developed resins that harden by irradiation with light energy such as ultraviolet rays, and resins that harden using light energy and heat. Resins can also be used. When applying a primer, it can be applied by any method such as brushing, spraying, dipping, flow coating, or transfer by dissolving or dispersing the primer in a suitable organic solvent, and drying and curing it. Although the thickness of the cured film is not particularly limited, it is preferably 0.1 to 5 microns. In other words, if it is less than 061 ξ chron, the adhesion strength is unstable;
This is because if it exceeds 5ξ chron, cracks will occur in the inorganic coating composition. It is preferable for the primer to have a pencil hardness of IH or higher because of its adhesive properties. The inorganic coating composition used is one that has thermosetting properties and is dispersed in the form of a sol in an organic solvent. partial hydrolyzate,
Partial hydrolyzate of alkyltrialkoxysilane and tetraalkoxysilane, partial hydrolyzate of alkyltrialkoxysilane, alkyltrihydroxysilane and colloidal silica, partial hydrolyzate of alkyltrialkoxysilane, tetraalkoxysilane and silane coupling agent etc. A curing agent, a curing accelerator, a leveling agent, a thickener, a stabilizer, a coloring agent, etc. can also be added to the inorganic coating composition as required. As the outer layer material, a single-sided metal foil clad laminate or metal foil is used, and the lamination integration method may be pressurized lamination molding or non-pressure lamination molding using a press, multi-stage press, multi-roll, double belt, etc. It is not particularly limited.

The present invention will be explained below based on examples.

〔Example〕

In a hydrolysis container equipped with a reflux condenser, 68 parts by weight of isopropyl alcohol (hereinafter simply referred to as parts) and 95 parts by weight of tetraethoxy
38 parts of fu, 772 parts of methyltriethoxysila, 0.05
36 parts of N-hydrochloric acid was added and the mixture was heated for 5 hours to obtain a partial hydrolyzate of alkyltrialkoxysilane and tetraalkoxysilane (hereinafter referred to as inorganic coating composition A). Separately, electrical circuits were formed on both sides of a 0.8 mm thick double-sided copper-clad glass cloth base epoxy resin laminate to serve as an inner layer material, and 0.1 mm thick epoxy resin-impregnated glass cloth was placed on the top and bottom surfaces of the inner layer material. On the surface of the outermost resin-impregnated base material, two of each are stacked one on top of the other.
The inorganic coating M acid A was spray coated via an epoxy resin primer with a thickness of 10 microns so that the film thickness after curing would be 10 microns, then dried at 120°C for 10 minutes, and further dried at 160°C for 30 minutes. After curing by heating for minutes, a laminate with 35 micron copper foil with an adhesive layer placed on the upper and lower surfaces so that the adhesive layer faces the inorganic coating composition Ai was molded at a pressure of 40 kg/cdl at 165°C. Lamination was carried out for 90 minutes to obtain a four-layer wiring board.

[Comparative Example 1] A laminate was formed in which the epoxy resin-impregnated glass cloth of Example was provided with a 35-micron copper foil attached to an adhesive layer without the presence of a thermosetting resin primer or inorganic coating composition A layer. A four-dimensional wiring board was obtained by molding at a pressure of 40 kg/cA and 165°C for 90 minutes.

[Comparative Example 2] A four-layer wiring board was fabricated in the same manner as in the example except that the epoxy resin-impregnated glass cloth of the example was coated with an inorganic coating ia oxide layer without applying a thermosetting resin primer. Obtained.

The performances of the multilayer wiring boards of Examples and Comparative Examples 1 and 2 are shown in Table 1.

Chapter 1 Table 〔Effect of the invention〕

Claims (1)

[Claims] (1) Integrate a laminate in which a resin layer is arranged on the upper and/or lower surface of each inner layer material on which the required number of circuits are formed, and an outer layer material is arranged on the outermost side via a thermosetting resin primer and an inorganic coating composition. A multilayer wiring board characterized by being made of