JPH03254193A - Multilayer wiring board - Google Patents

Abstract

PURPOSE:To improve heat resistance and heat dissipation by integrating a laminate wherein a resin layer is arranged at each upside and/or downside of a required number of inner layer material where circuits are formed, and outer layer materials are arranged at the outermost sides through an inorganic cover composition. CONSTITUTION:A laminate, wherein a resin layer is arranged at each upside and/or downside of a required number of inner layer materials where circuits are made, and outer layer materials are arranged at the outermost sides through an inorganic cover composition, is integrated. As the resin layer arranged at the upside and/or downside of the inner layer material, the application layer of resin, the base material layer impregnated with resin, or the like is used. Moreover, as the inorganic cover composition, the one, which has thermosetting properties and is in the condition of being dispersed in sol shape in an organic solvent, is used, and it is concretely the partial hydrolysate of alkyltrialkoxysilane, the partial hydrolysate of alkyltrialkoxysilane- tetraalkoxysilane coupling agent, etc. Hereby, heat resistance and heat dissipation improve.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a multilayer wiring board used in electronic/electrical equipment, computers, communication equipment, etc.

[Conventional technology]

Conventional multilayer wiring boards are made by integrating a laminated body in which a required number of circuit-formed inner layer materials are arranged, a resin layer is arranged on each upper and/or lower surface, and an outer layer material is arranged on the outermost side. Multilayer wiring boards require various needs such as heat resistance and heat dissipation, and the current situation is that they cannot fully meet these needs.

[Problem that the invention seeks to solve]

As mentioned in the section on conventional technology, conventional multilayer wiring boards cannot meet a variety of needs. The present invention has been made in view of the above-mentioned problems in the conventional technology, and its purpose is to provide an electrical laminate with excellent heat resistance and heat dissipation properties. [Means for achieving this] The present invention is formed by integrating a laminate in which a required number of circuit-formed inner layer materials are provided with a resin layer on each upper and/or lower surface, and an outer layer material is provided on the outermost side via an inorganic coating composition. This multilayer wiring board is characterized by the fact that the above object can be achieved by using an inorganic coating composition, and the inner layer material used in the present invention, which will be described in detail below, includes phenol resin, cresol resin, etc. , epoxy resin, unsaturated polyester resin, melamine resin, polyimide, polybutadiene, polyamide, boria ξ toimide, polysulfone,
Resins such as polyphenylene sulfide, polyphenylene oxide, polybutylene terephthalate, polyethylene terephthalate, fluorinated resins, etc. alone, modified products, and mixtures, and base materials such as paper, glass cloth, glass nonwoven fabric, synthetic fiber cloth, synthetic fiber nonwoven fabric, cotton, etc. An electric circuit is formed on a single-sided or double-sided metal foil-clad laminate made of single, alloy, or composite foil of copper, aluminum, iron, nickel, zinc, etc.
As the resin layer disposed on the upper surface and/or lower surface of the inner layer material, single or composite layers such as a coating layer of the above-mentioned resin, a resin-impregnated base material layer, a resin sheet layer, etc. are used, but preferably the resin layer thickness can be easily made uniform. It is desirable to use a resin-impregnated substrate. The inorganic coating composition used is one that has thermosetting properties and is dispersed in the form of a sol in an organic solvent. Partial hydrolyzate, partial hydrolyzate of alkyltrialkoxysilane and tetraalkoxysilane, partial hydrolyzate of alkyltrialkoxysilane, alkyltrihydroxysilane and colloidal silica, alkyltrialkoxysilane and tetraalkoxysilane coupling agent part Hydrolyzate etc. The inorganic coating composition may contain curing agents, curing accelerators, leveling agents, thickeners, stabilizers,
Coloring agents and the like may also be added. As the outer layer material, a single-sided metal foil clad laminate or metal foil is used, and the lamination integration method may be pressurized lamination molding or non-pressure lamination molding using a press, multi-stage press, multi-roll, double belt, etc. It is not particularly limited.

The present invention will be explained below based on examples.

〔Example〕

In a hydrolysis container equipped with a reflux condenser, add 68 parts by weight of isopropyl alcohol (hereinafter simply referred to as parts), 38 parts of tetraethoxysilane, 72 parts of methyltriethoxysilane, and 0.05 parts by weight.
36 parts of N-hydrochloric acid was added and the mixture was heated and reacted for 5 hours to obtain a partial hydrolyzate of alkyltrialkoxysilane and tetraalkoxysilane (hereinafter referred to as inorganic coating composition A). Separately, electric circuits are formed on both sides of a double-sided copper-clad glass cloth base epoxy resin laminate with a thickness of 0.8 ribs to serve as an inner layer material, and an epoxy resin-impregnated glass cloth with a thickness of 0.1 inch is placed on the upper and lower surfaces of the inner layer material. The above-mentioned inorganic coating composition A was spray applied to the surface of the outermost resin-impregnated base material of two stacked sheets each so that the film thickness after curing was 10 microns, and then dried at 120"C for 10 minutes, and then dried at 160"C for 10 minutes. After curing by heating at °C for 30 minutes, a laminate with a 35 micron thick copper foil with an adhesive layer placed on the upper and lower surfaces so that the adhesive layer faces the inorganic coating composition layer A was molded at a pressure of 40 kg/ cd, I Lamination molding was performed at 65°C for 90 minutes to obtain a four-layer wiring board.

Comparative Example A laminate in which the epoxy resin-impregnated glass cloth of Example was provided with a 35-micron-thick copper foil with an adhesive layer without the presence of the inorganic coating composition A layer was molded at a pressure of 40) cg/cJ.
, and laminated at 165° C. for 90 minutes to obtain a four-layer wiring board.

Table 1 shows the performance of the multilayer wiring boards of Examples and Comparative Examples.

Table 1 Note: Strength after being held on molten solder at 260°C for 10 seconds [Effects of the invention]

Claims (1)

[Claims] (1) It is characterized by being formed by integrating a laminate in which a required number of circuit-formed inner layer materials are provided with a resin layer on each upper and/or lower surface, and an outer layer is provided on the outermost side via an inorganic coating composition. Multilayer wiring board.