JPH03234080A - Electric laminated board - Google Patents

Abstract

PURPOSE:To improve heat resistance, arc resistance, heat dissipation by so arranging metal foils with inorganic coating composition layers on the upper and/or lower surface of predetermined number of resin-immersed cloth that the metal sides are disposed outside, and integrating its laminate. CONSTITUTION:For example, after a copper foil is so spray-coated on one side surface with inorganic coating composition A of the state dispersed in sol in organic solvent and having thermosetting properties as to become a predetermined thickness after curing, then dried and further thermoset, the composition A layer is coated with epoxy resin adhesive. Then, a Kraft sheet is so impregnated with phenol resin varnish as to become a predetermined resin amount after drying, and dried to obtain a resin-impregnated base material. A laminate in which the composition A layers and the copper foils with the adhesive layers are so arranged on the upper and lower surfaces of the seven superposed materials that the foil sides are disposed outside, is laminated and molded under predetermined pressure at a predetermined temperature as an electric laminated board. Thus, heat resistance, arc resistance and heat dissipation properties can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electrical laminate used in electronic equipment, electrical equipment, computers, communication equipment, etc.

[Conventional technology]

Conventional electrical laminates are made by integrating a required number of resin-impregnated bases with metal foil on the top and/or bottom surfaces, but recent electrical laminates have a high heat resistance and arc resistance. Various needs are required such as performance, heat dissipation, etc., and the current situation is that it is not possible to meet these needs.

[Problem that the invention seeks to solve]

As mentioned in the section on conventional technology, conventional electrical laminates cannot meet a variety of needs. The present invention has been made in view of the above-mentioned problems in the prior art, and its purpose is to provide an electrical laminate having excellent heat resistance, arc resistance, and heat dissipation properties.

[Means for solving problems]

The present invention is an electrical laminate characterized by integrating a laminate in which a required number of resin-impregnated substrates are provided with a metal foil coated with an inorganic coating composition layer on the upper and/or lower surfaces with the metal side facing outward. The above object can be achieved because of the plate, and the present invention will be described in detail below.

Examples of resins for the resin-impregnated base material used in the present invention include phenolic resin, cresol resin, epoxy resin, unsaturated polyester resin, melamine resin, polyimide, polybutadiene, polyamide, polyamideimide, polysulfone,
Polyphenylene sulfide, polyphenylene oxide, polybutylene terephthalate, polyether ether ketone, fluorinated resin, etc. alone, modified products, mixtures, etc. are used, and if necessary, water, methyl alcohol, acetone, cyclohexanone, styrene, etc. are used to adjust the viscosity. The base material is woven fabric, non-woven fabric, mat, or paper made of inorganic fibers such as glass and asbestos, organic synthetic fibers such as polyester, polyamide, polyvinyl alcohol, and acrylic, and natural fibers such as cotton. Or a combination base material etc. of these. As the metal foil, a single, alloy, or composite foil of copper, aluminum, iron, nickel, zinc, etc. is used, and it is necessary to provide an inorganic coating composition layer on one side of the metal foil. The inorganic coating composition used is one that has thermosetting properties and is dispersed in the form of a sol in an organic solvent.
Partial hydrolyzate of alkyltrialkoxysilane, partial hydrolyzate of methyltrialkoxysilane and phenyltrialkoxysilane, partial hydrolyzate of alkyltrialkoxysilane and tetraalkoxysilane, partial hydrolyzate of alkyltrialkoxysilane, alkyl These include partial hydrolysates of trihydroxysilane, colloidal silica, alkyltrialkoxysilane, tetraalkoxysilane, and silane coupling agents. The inorganic coating composition may contain a curing agent, curing accelerator, leveling agent,
Thickeners, stabilizers, colorants, etc. can also be added.

Application may be carried out by spraying, transfer, etc., but is not limited thereto. After drying, curing is performed by heating at 120 to 200° C. for 10 to 60 minutes. In order to further improve adhesion, an adhesive layer may be provided on the inorganic coating composition layer. The lamination and integration means may be lamination molding under pressure or pressureless lamination molding using a press, multistage press, multi-roll, double belt, etc., and is not particularly limited.

The present invention will be explained below based on examples.

[Example 1] 68 parts by weight of isopropyl alcohol (hereinafter simply referred to as parts) was placed in a hydrolysis vessel equipped with a reflux condenser. 38 parts of tetraethoxysilane, 72 parts of methyltriethoxysilane, 0.05
36 parts of N-hydrochloric acid was added and the mixture was heated for 5 hours to obtain a partial hydrolyzate of alkyltrialkoxysilane and tetraalkoxysilane (hereinafter referred to as inorganic coating composition A). Next, the inorganic coating composition A was spray-coated on one side of a 35-micron thick copper foil so that the film thickness after curing was 10 microns, dried at 120°C for 10 minutes, and then heated and cured at 160°C for 30 minutes. An epoxy resin adhesive was applied to the inorganic coating composition A layer. Next, a resin-impregnated base material 7 obtained by impregnating phenol resin varnish with a resin amount of 50% by weight (hereinafter simply referred to as %) on 0.2 as kraft paper so that the resin amount becomes 50% after drying and drying. A laminate in which the above inorganic coating composition A layer and copper foil with an adhesive layer are placed on the upper and lower surfaces of the stacked sheets with the copper foil side facing outward is formed at a molding pressure of 1100c/cill.
An electrical laminate having a thickness of 1.6 mm was obtained by lamination molding at 160° C. for 60 minutes.

[Example 2] 0.2 parts of glacial acetic acid was added to 200 parts of an acidic aqueous colloidal silica dispersion containing 20% of silica with an average particle size of 10 microns.
After adding 90 parts of methylmethoxysilane and 50 parts of ethylmethoxysilane, the mixture was kept at 5°C for 2 hours with stirring, the pH was adjusted to 4 with an aqueous sodium acetate solution, and then a mixture of 90 parts of methylmethoxysilane and 50 parts of ethylmethoxysilane was added. 560 parts of alkyltrialkoxysilane were added to form a partial hydrolyzate of alkyltrialkoxysilane (
The inorganic coating composition B (hereinafter referred to as inorganic coating composition B) was obtained. Next, the inorganic coating composition B was spray-coated on one side of a 35-micron thick copper foil so that the film thickness after curing was 15 microns.
It was dried at 20°C for 10 minutes and further heat-cured at 16°C for 30 minutes. Next, a glass cloth with a thickness of 0.15 om is impregnated with a curing agent-containing epoxy resin so that the amount of resin becomes 45% after drying, and the above inorganic coating is applied to the upper and lower surfaces of nine sheets of the resin-impregnated base layer obtained by drying. A laminate in which composition B layered copper foil was arranged with the copper foil side facing outward was molded at a pressure of 40 kg/cm, 165
Laminate molding was carried out at ℃ for 120 minutes to obtain an electrical laminate having a thickness of 1.6 m.

[Comparative Example 1] On the upper and lower surfaces of the seven resin-impregnated substrates of Example 1, 35-micron copper foil with an adhesive and no inorganic coating composition A layer was placed.
The laminate with the P4 foil side facing outward was molded under a molding pressure of 100.
kg/cJ at 160° C. for 60 minutes to obtain an electrical laminate having a thickness of 1.6 mm.

[Comparative Example 2] A laminate in which copper foil with a thickness of 35 microns without the inorganic coating composition B layer was arranged on the upper and lower surfaces of the nine resin-impregnated base materials of Example 2 was formed at a molding pressure of 40 kg/cJ and a 165" Cr120 Lamination molding was carried out for 1 minute to obtain an electrical laminate having a thickness of 1.6 mm.

The performances of the electrical laminates of Examples 1 and 2 and Comparative Examples 1 and 2 are shown in Table 1.

Table 1 [Effects of the Invention] The present invention is constructed as described above. The electrical laminate having the structure described in the claims has the effect of improving heat resistance, arc resistance, and heat dissipation.

Claims (1)

[Claims] (1) On the upper and/or lower surfaces of the required number of resin-impregnated substrates,
An electrical laminate, characterized in that it is formed by integrating a laminate in which a metal foil coated with an inorganic coating composition layer is arranged with the metal foil side facing outward.