JPH03254174A - Metal base wiring board - Google Patents
Metal base wiring boardInfo
- Publication number
- JPH03254174A JPH03254174A JP5215190A JP5215190A JPH03254174A JP H03254174 A JPH03254174 A JP H03254174A JP 5215190 A JP5215190 A JP 5215190A JP 5215190 A JP5215190 A JP 5215190A JP H03254174 A JPH03254174 A JP H03254174A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- inorganic coating
- wiring board
- foil
- coating composite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 30
- 239000002184 metal Substances 0.000 title claims abstract description 30
- 229920005989 resin Polymers 0.000 claims abstract description 10
- 239000011347 resin Substances 0.000 claims abstract description 10
- 239000011888 foil Substances 0.000 claims abstract description 9
- 239000008199 coating composition Substances 0.000 claims description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 abstract description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract description 8
- 239000002131 composite material Substances 0.000 abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 5
- 238000000576 coating method Methods 0.000 abstract description 5
- 229910052742 iron Inorganic materials 0.000 abstract description 5
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 abstract description 5
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract description 4
- 239000000956 alloy Substances 0.000 abstract description 4
- 229910045601 alloy Inorganic materials 0.000 abstract description 4
- 229910052782 aluminium Inorganic materials 0.000 abstract description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 4
- 239000011248 coating agent Substances 0.000 abstract description 4
- 229910052802 copper Inorganic materials 0.000 abstract description 4
- 239000010949 copper Substances 0.000 abstract description 4
- 229910052759 nickel Inorganic materials 0.000 abstract description 4
- 229910052725 zinc Inorganic materials 0.000 abstract description 4
- 239000011701 zinc Substances 0.000 abstract description 4
- 239000000126 substance Substances 0.000 abstract description 3
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 abstract description 2
- 229910000831 Steel Inorganic materials 0.000 abstract description 2
- 230000007062 hydrolysis Effects 0.000 abstract description 2
- 238000006460 hydrolysis reaction Methods 0.000 abstract description 2
- 239000003960 organic solvent Substances 0.000 abstract description 2
- 229910000077 silane Inorganic materials 0.000 abstract description 2
- 239000010959 steel Substances 0.000 abstract description 2
- 239000004411 aluminium Substances 0.000 abstract 2
- 150000001875 compounds Chemical class 0.000 abstract 2
- 230000003449 preventive effect Effects 0.000 abstract 2
- 125000000217 alkyl group Chemical group 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 238000001029 thermal curing Methods 0.000 abstract 1
- 238000013518 transcription Methods 0.000 abstract 1
- 230000035897 transcription Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 9
- -1 boria motoimide Polymers 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000002265 prevention Effects 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電子機器、電気機器、コンピューター、通信機
器等に用いられる金属ベース配線基板に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a metal-based wiring board used in electronic equipment, electrical equipment, computers, communication equipment, etc.
従来の金属ベース配線基板は金属板の上面及び又は下面
に樹脂層を介し、金属箔を配設一体化してなり、その放
熱性を買われ多様な用途に用いられているが更に防錆性
を向上させたいという要望があった。Conventional metal-based wiring boards are made by integrally disposing metal foil on the upper and/or lower surfaces of a metal plate through a resin layer, and are used for a variety of purposes due to their heat dissipation properties. There was a desire to improve.
従来の技術で述べたように、従来の金属ベース配線基板
についてはその防錆性を向上させたいという要望が強い
。As described in the related art section, there is a strong desire to improve the rust prevention properties of conventional metal-based wiring boards.
本発明は従来の技術における上述の問題点に鑑みてなさ
れたもので、その目的とするところは防錆性に優れた金
属ベース配線基板を提供することにある。The present invention has been made in view of the above-mentioned problems in the prior art, and its object is to provide a metal-based wiring board with excellent rust prevention properties.
（問題点を解決するための手段）
本発明は無機質被覆組成物層を表面に設けた金属板の上
面及び又は下面に樹脂層を介して金属箔を配設一体化し
てなることを特徴とする金属ベース配線基板のため、無
機質被覆組成物により上記目的を達成することができた
もので、以下本発明の詳細な説明する。(Means for Solving the Problems) The present invention is characterized in that a metal foil is disposed and integrated with the upper and/or lower surfaces of a metal plate having an inorganic coating composition layer provided thereon via a resin layer. The above object can be achieved by using an inorganic coating composition for a metal-based wiring board, and the present invention will be described in detail below.
本発明に用いる金属板としてはアルミニウム、鋼、鉄、
銅、亜鉛、ニッケル等の単独、合金、複合板を用いるこ
とができ、厚みは０．１〜１０ｍｍであることが好まし
く、更に金属板表面を物理処理、化学処理で活性化、粗
面化した層間接着性を向上させることもできる。無機質
被覆組成物としては熱硬化性を有し有機溶媒中にゾル状
に分散された状態のものを用いるもので、アルキルトリ
アルコキシシランの部分加水分解物、メチルトリアルコ
キシシランとフェニルトリアルコキシシランの部分加水
分解物、アルキルトリアルコキシシランとテトラアルコ
キシシランの部分加水分解物、アルキルトリアルコキシ
シランの部分加水分解物、アルキルトリヒドロキシシラ
ンとコロイダルシリカ、アルキルトリアルコキシシラン
とテトラアルコキシシランとシランカンプリング剤の部
分加水分解物等である。無機質被覆組成物には必要に応
じて硬化剤、硬化促進剤、レベリング剤、増粘剤、安定
化剤、着色剤等を添加することもできる。Metal plates used in the present invention include aluminum, steel, iron,
Single, alloy, or composite plates of copper, zinc, nickel, etc. can be used, and the thickness is preferably 0.1 to 10 mm, and the metal plate surface is further activated or roughened by physical treatment or chemical treatment. It is also possible to improve interlayer adhesion. The inorganic coating composition used is one that has thermosetting properties and is dispersed in the form of a sol in an organic solvent. Partial hydrolyzate, partial hydrolyzate of alkyltrialkoxysilane and tetraalkoxysilane, partial hydrolyzate of alkyltrialkoxysilane, alkyltrihydroxysilane and colloidal silica, alkyltrialkoxysilane and tetraalkoxysilane and silane camping agent partial hydrolyzate etc. A curing agent, a curing accelerator, a leveling agent, a thickener, a stabilizer, a coloring agent, etc. can also be added to the inorganic coating composition as required.
金属板への塗布はハケ塗り、スプレー、ディッピング、
フローコート、転写等の任意塗布方法で行なうことがで
きる。樹脂層としてはフェノール樹脂、クレゾール樹脂
、エポキシ樹脂、ポリイミド、ポリブタジェン、ポリア
ミド、不飽和ポリエステル樹脂、メラミン樹脂、ボリア
もトイミド、ポリスルフォン、ポリフェニレンサルファ
イド、ポリフェニレンオキサイド、ポリブチレンテレフ
タレート、ポリエチレンテレフタレート、弗化樹脂等の
単独、変性物、混合物等の塗布層、樹脂含浸基材層、樹
脂シート層等の単独、複合層が用いられるが好ましくは
樹脂層厚を均一化しやすい樹脂含浸基材を用いることが
望ましい。Application to metal plates can be done by brushing, spraying, dipping,
Any coating method such as flow coating or transfer can be used. The resin layer includes phenolic resin, cresol resin, epoxy resin, polyimide, polybutadiene, polyamide, unsaturated polyester resin, melamine resin, boria motoimide, polysulfone, polyphenylene sulfide, polyphenylene oxide, polybutylene terephthalate, polyethylene terephthalate, fluorinated resin. Single or composite layers such as single, modified or mixed coating layers, resin-impregnated base material layers, resin sheet layers, etc. are used, but it is preferable to use resin-impregnated base materials that can easily make the resin layer thickness uniform. .
金属箔としては銅、アルミニウム、鉄、ニッケル、亜鉛
等の単独、合金、複合箔を用いることができ、厚みは０
．０１８〜０．０７ｍｍであることが好ましい。更に接
着面を物理処理や化学処理で表面処理しておくことが望
ましい。一体化手段としてはプレス、多段プレス、マル
チロール、ダブルヘルド等による加圧下積層成形や無圧
積層成形の各れでもよく、特に限定するものではない。As the metal foil, single, alloy, or composite foils of copper, aluminum, iron, nickel, zinc, etc. can be used, and the thickness is 0.
．． It is preferable that it is 0.018 to 0.07 mm. Furthermore, it is desirable that the adhesive surface be surface-treated by physical or chemical treatment. The integration means may be laminated under pressure or pressureless laminated using a press, multi-stage press, multi-roll, double-held, etc., and is not particularly limited.
以下本発明を実施例にもとづいて説明する。The present invention will be explained below based on examples.
厚み１印の鉄板片面をサンドペーパーで研磨後、該表面
に無機質被覆組成物を硬化後の膜厚が１０ミクロンにな
るようにスプレー塗布後、１２０°Ｃで１０分間乾燥し
更に１６０″Ｃで３０分間加熱硬化した無機質被覆組成
物層付金属板に、厚み０゜１閣のエポキシ樹脂含浸ガラ
ス布２枚を重ね、更にその上に厚み３５ミクロンの銅箔
を重ね成形圧力３０ ｋｇ／ｃ＋ｆｌ、 ｌ ６５°Ｃ
で９０分間積層戒形して金属ベース配線基板を得た。こ
の時用いた無機質被覆組成物は、還流冷却器付の加水分
解容器にイソプロピルアルコール６８重量部（以下単に
部と記す）、テトラエトキシシラン３８部、メチルトリ
エトキシシラン７２部、０．０５ Ｎ塩酸３６部を入れ
５時間加熱反応してアルキルトリアルコキシシランとテ
トラアルコキシシランの部分加水分解物として得られた
ものである。After polishing one side of an iron plate with a thickness of 1 mark with sandpaper, spray coat the inorganic coating composition on the surface so that the film thickness after curing is 10 microns, dry at 120°C for 10 minutes, and then heat at 160"C. Two sheets of epoxy resin-impregnated glass cloth with a thickness of 0.1 mm were layered on a metal plate coated with an inorganic coating composition layer that had been heated and cured for 30 minutes, and then a copper foil with a thickness of 35 microns was layered on top of that, and the molding pressure was 30 kg/c+fl. l 65°C
A metal base wiring board was obtained by laminating the product for 90 minutes. The inorganic coating composition used at this time was 68 parts by weight of isopropyl alcohol (hereinafter simply referred to as parts), 38 parts of tetraethoxysilane, 72 parts of methyltriethoxysilane, and 0.05 N hydrochloric acid in a hydrolysis container equipped with a reflux condenser. A partial hydrolyzate of alkyltrialkoxysilane and tetraalkoxysilane was obtained by adding 36 parts of the mixture and heating for 5 hours.
［比較例］
実施例の無機質被覆組成物を塗布しない金属板を用いた
以外は実施例と同様に処理して金属ベース配線基板を得
た。[Comparative Example] A metal-based wiring board was obtained by processing in the same manner as in the example except that a metal plate not coated with the inorganic coating composition of the example was used.
実施例及び比較例の金属ベース配線基板の性能は第１表
のようである。Table 1 shows the performance of the metal-based wiring boards of Examples and Comparative Examples.
第
表
〔発明の効果〕
本発明は上述した如く構成されている。特許請求の範囲
に記載した構成を有する金属ベース配線基板においては
防錆性が向上する効果がある。Table 1 [Effects of the Invention] The present invention is constructed as described above. The metal base wiring board having the structure described in the claims has the effect of improving rust prevention.
Claims (1)
面及び又は下面に樹脂層を介して金属箔を配設一体化し
てなることを特徴とする金属ベース配線基板。(1) A metal-based wiring board characterized in that it is formed by integrally disposing metal foil on the upper and/or lower surfaces of a metal plate with an inorganic coating composition layer provided thereon via a resin layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5215190A JPH03254174A (en) | 1990-03-02 | 1990-03-02 | Metal base wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5215190A JPH03254174A (en) | 1990-03-02 | 1990-03-02 | Metal base wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03254174A true JPH03254174A (en) | 1991-11-13 |
Family
ID=12906865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5215190A Pending JPH03254174A (en) | 1990-03-02 | 1990-03-02 | Metal base wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03254174A (en) |
-
1990
- 1990-03-02 JP JP5215190A patent/JPH03254174A/en active Pending
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