JPH03254176A - Metal base wiring board - Google Patents

Abstract

PURPOSE:To improve heat resistance by providing a metal foil, in which a resin layer is integrally arranged on the surface and/or the rear surface of a metal board, and an inorganic coating composite layer is arranged on the outermost side through a thermocuring resin primer. CONSTITUTION:A metal foil, in which a resin layer is integrally arranged on the surface and/or the rear surface of a metal board, and an inorganic coating composite layer is arranged on the outermost side through a thermocuring resin primer, is provided. Aluminium and steel can be used as the metal board. An applied layer with phenol resin, resin fluoride and a resin-impregnated base material layer is used as the resin layer, and that having a thermocuring property and in a state of sol dispersed in an organic solvent is used as the inorganic coating composite. Further, a single, alloy and compound foil is desirably used as the metal foil. Thereby, heat resistance is improved.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a metal-based wiring board used in electronic equipment, electrical equipment, computers, communication equipment, etc.

[Conventional technology]

Conventional metal-based wiring boards are made by integrally disposing metal foil on the upper and/or lower surfaces of a metal plate via a resin layer, and are used for a variety of purposes due to their heat dissipation properties. There was a desire to improve.

[Problem that the invention seeks to solve]

As described in the related art section, there is a strong desire to improve the heat resistance of conventional metal-based wiring boards.

The present invention has been made in view of the above-mentioned problems in the prior art, and its object is to provide a metal-based wiring board with excellent heat resistance.

[Means for solving problems]

The present invention is characterized in that a resin layer is disposed on the upper and/or lower surface of a metal plate, and a metal foil having an inorganic coating composition layer disposed on the outermost side via a thermosetting resin primer is arranged and integrated. The above object can be achieved by using an inorganic coating composition for a metal-based wiring board, and the present invention will be described in detail below.

Metal plates used in the present invention include aluminum, steel, iron,
Single, alloy, or composite plates of copper, zinc, nickel, etc. can be used, and the thickness is preferably 0.1 to 10 mo. Furthermore, the surface of the metal plate is activated and roughened by physical treatment or chemical treatment to form an interlayer Adhesion can also be improved. The resin layer includes phenolic resin, cresol resin, epoxy resin, unsaturated polyester resin, melamine resin, polyimide, polybutadiene, boria dando, polyamideimide, polysulfone, polyphenylene sulfide, polyphenylene oxide, polybutylene terephthalate, polyethylene terephthalate, fluoride. Single resin, modified product, etc.
Single or composite layers such as a coating layer such as a mixture, a resin-impregnated base material layer, a resin sheet layer, etc., or a composite layer may be used, but it is preferable to use a resin-impregnated base material that can easily make the resin layer thickness uniform.

Thermosetting resin primers include alkyl etherified melamine resin, phenolic resin, modified phenolic resin,
These include unsaturated polyester resins, epoxy resins, thermosetting acrylic resins, melamine/alkyd resins, acrylic/melagon resins, acrylic/urethane resins, and composite resins of organic resins and silicon compounds. Multiple types can be used in combination. In addition, in order to dry and cure the primer after applying it more efficiently and in an energy-saving manner, we have developed resins that harden by irradiation with light energy such as ultraviolet rays, and resins that harden using light energy and heat. Resins can also be used.

When applying a primer, it can be applied by any method such as brushing, spraying, dipping, flow coating, or transfer by dissolving or dispersing the primer in a suitable organic solvent, and drying and curing it. Although the thickness of the cured film is not particularly limited, it is preferably 0.1 to 55 chrome. That is, if the thickness is less than 0.1 micron, the adhesion strength is unstable, and if it exceeds 5 microns, cracks will occur in the inorganic coating composition. It is preferable for the primer to have a pencil hardness of IH or higher because of its adhesive properties.

The inorganic coating composition used is one that has thermosetting properties and is dispersed in the form of a sol in an organic solvent. Partial hydrolyzate, partial hydrolyzate of alkyltrialkoxysilane and tetraalkoxysilane, partial hydrolyzate of alkyltrialkoxysilane, alkyltrihydroxysilane and colloidal silica, alkyltrialkoxysilane and tetraalkoxysilane and silane coupling agent These include partial hydrolysates of A curing agent, a curing accelerator, a leveling agent, a thickener, a stabilizer, a coloring agent, etc. can also be added to the inorganic coating composition as required. As the metal foil, it is preferable to use single, alloy, or composite foils of copper, aluminum, iron, -ykel, zinc, etc., with a thickness of 0°018 to 0.07+m+, and the adhesive surface may be subjected to physical or chemical treatment as necessary. However, it is necessary to provide the above-mentioned inorganic coating composition layer on the adhesive surface. Application to the adhesive surface can be carried out by any application method such as brushing, spraying, dipping, flow coating, or transfer. The integration means may be laminated under pressure or pressureless laminated using a press, multi-stage press, multi-roll, double belt, etc., and is not particularly limited.

The present invention will be explained below based on examples.

〔Example〕

After polishing one side of a 1m thick iron plate with sandpaper, the thickness is 0.
．． After spraying an inorganic coating composition on one side of a 35ξcm thick copper foil via two 1mm epoxy resin-impregnated glass cloths and a 105cm thick epoxy resin primer so that the cured film thickness would be 10 microns. , 120
Dry at °C for 10 minutes and then heat-cure at 160 °C for 30 minutes. Layer the copper foil coated with an inorganic coating composition layer at 30k acid pressure.
The lamination process was carried out at g/d and 165° C. for 90 minutes to obtain a metal base wiring board. The inorganic coating composition used at this time was stored in a hydrolysis vessel equipped with a reflux condenser with isopropyl alcohol 6
8 parts by weight (hereinafter simply referred to as parts), 38 parts of tetraethoxysilane, 72 parts of methyltriethoxysilane, 0.05 parts
A partial hydrolyzate of alkyltrialkoxysilane and tetraalkoxysilane was obtained by adding 36 parts of N-hydrochloric acid and reacting with heating for 5 hours.

[Comparative Example 1] A metal-based wiring board was obtained in the same manner as in the example except that a 35 micron thick copper foil was not coated with the inorganic coating composition of the example.

[Comparative Example 2] A metal-based wiring board was obtained by processing in the same manner as in the example except that the epoxy resin primer of the example was removed.

The performance of the metal-based wiring boards of Examples and Comparative Examples 1 and 2 is shown in Table 1.

A metal-based wiring board having a bath bottom described in the first expression has the effect of improving heat resistance.

patent developer Matsushita Electric Works Co., Ltd.

Claims (1)

[Claims] (1) A resin layer is arranged on the upper and/or lower surface of a metal plate, and a metal foil with an inorganic coating composition layer arranged on the outermost side via a thermosetting resin primer is arranged and integrated. Metal-based wiring board.