JPH03278444A - 半導体ウエハーのダイシング方法 - Google Patents

半導体ウエハーのダイシング方法

Info

Publication number
JPH03278444A
JPH03278444A JP2238755A JP23875590A JPH03278444A JP H03278444 A JPH03278444 A JP H03278444A JP 2238755 A JP2238755 A JP 2238755A JP 23875590 A JP23875590 A JP 23875590A JP H03278444 A JPH03278444 A JP H03278444A
Authority
JP
Japan
Prior art keywords
ultraviolet
dicing
sensitive adhesive
film
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2238755A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0542138B2 (https=
Inventor
Hideo Kuroda
黒田　秀雄
Masao Taniguchi
谷口　正雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bando Chemical Industries Ltd
Original Assignee
Bando Chemical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bando Chemical Industries Ltd filed Critical Bando Chemical Industries Ltd
Priority to JP2238755A priority Critical patent/JPH03278444A/ja
Publication of JPH03278444A publication Critical patent/JPH03278444A/ja
Publication of JPH0542138B2 publication Critical patent/JPH0542138B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Adhesive Tapes (AREA)
  • Dicing (AREA)
JP2238755A 1990-09-07 1990-09-07 半導体ウエハーのダイシング方法 Granted JPH03278444A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2238755A JPH03278444A (ja) 1990-09-07 1990-09-07 半導体ウエハーのダイシング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2238755A JPH03278444A (ja) 1990-09-07 1990-09-07 半導体ウエハーのダイシング方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP60196542A Division JPS6254937A (ja) 1985-02-14 1985-09-04 半導体ウエハ−のダイシング方法

Publications (2)

Publication Number Publication Date
JPH03278444A true JPH03278444A (ja) 1991-12-10
JPH0542138B2 JPH0542138B2 (https=) 1993-06-25

Family

ID=17034784

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2238755A Granted JPH03278444A (ja) 1990-09-07 1990-09-07 半導体ウエハーのダイシング方法

Country Status (1)

Country Link
JP (1) JPH03278444A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130092475A (ko) * 2012-02-09 2013-08-20 린텍 코포레이션 반도체 웨이퍼 가공용 시트

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5038524A (https=) * 1973-08-07 1975-04-10
JPS51117730A (en) * 1975-04-10 1976-10-16 Oosakafu Pressure sensitive adhesives
JPS53121832A (en) * 1977-04-01 1978-10-24 Hitachi Chem Co Ltd Method of protecting surface
JPS58173179A (ja) * 1982-04-06 1983-10-12 Nhk Spring Co Ltd 粘着剤付発泡シ−ト体
JPS5921038A (ja) * 1982-07-27 1984-02-02 Nec Home Electronics Ltd ペレツト剥離方法
JPS60196956A (ja) * 1984-03-12 1985-10-05 Nitto Electric Ind Co Ltd 半導体ウエハ固定用接着薄板
JPS6128572A (ja) * 1984-07-19 1986-02-08 F S K Kk 半導体ウエハー用粘着シートの使用法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5038524A (https=) * 1973-08-07 1975-04-10
JPS51117730A (en) * 1975-04-10 1976-10-16 Oosakafu Pressure sensitive adhesives
JPS53121832A (en) * 1977-04-01 1978-10-24 Hitachi Chem Co Ltd Method of protecting surface
JPS58173179A (ja) * 1982-04-06 1983-10-12 Nhk Spring Co Ltd 粘着剤付発泡シ−ト体
JPS5921038A (ja) * 1982-07-27 1984-02-02 Nec Home Electronics Ltd ペレツト剥離方法
JPS60196956A (ja) * 1984-03-12 1985-10-05 Nitto Electric Ind Co Ltd 半導体ウエハ固定用接着薄板
JPS6128572A (ja) * 1984-07-19 1986-02-08 F S K Kk 半導体ウエハー用粘着シートの使用法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130092475A (ko) * 2012-02-09 2013-08-20 린텍 코포레이션 반도체 웨이퍼 가공용 시트
JP2013165128A (ja) * 2012-02-09 2013-08-22 Lintec Corp 半導体ウエハ加工用シート

Also Published As

Publication number Publication date
JPH0542138B2 (https=) 1993-06-25

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