JPH0327043U - - Google Patents

Info

Publication number
JPH0327043U
JPH0327043U JP8752989U JP8752989U JPH0327043U JP H0327043 U JPH0327043 U JP H0327043U JP 8752989 U JP8752989 U JP 8752989U JP 8752989 U JP8752989 U JP 8752989U JP H0327043 U JPH0327043 U JP H0327043U
Authority
JP
Japan
Prior art keywords
collet
die
base
pellet
bonding equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8752989U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8752989U priority Critical patent/JPH0327043U/ja
Publication of JPH0327043U publication Critical patent/JPH0327043U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/753—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301—Bonding head
    • H01L2224/75302—Shape
    • H01L2224/75303—Shape of the pressing surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の実施例１を示す断面図、第２
図は実施例１におけるスクラブ時のダイミングチ
ヤート、第３図は本考案の実施例２を示す断面図
、第４図は実施例１におけるスクラブ時のタイミ
ングチヤートである。 １……マウント部、２……ベース、３……ヒー
ター、４……溶融半田、５……半導体ペレツト、
６……角錘コレツト、７……揺動機構、８，８ａ
，８ｂ……電磁弁、９……吸着管、１０……ガス
ブロー管、１１……多孔質セラミツク、１２……
平コレツト。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体ペレツトをベース上に半田を溶融させて
    ダイボンドするダイボンデイング装置において、
    コレツトで半導体ペレツトをベース上の溶融半田
    に押しつけ、揺動運動により半田付けを行うスク
    ラブ中に、コレツトの内部よりペレツトとコレツ
    トとの接触部に雰囲気ガスを吹き付ける構造を有
    することを特徴とするダイボンデイング装置。
JP8752989U 1989-07-26 1989-07-26 Pending JPH0327043U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8752989U JPH0327043U (ja) 1989-07-26 1989-07-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8752989U JPH0327043U (ja) 1989-07-26 1989-07-26

Publications (1)

Publication Number Publication Date
JPH0327043U true JPH0327043U (ja) 1991-03-19

Family

ID=31637173

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8752989U Pending JPH0327043U (ja) 1989-07-26 1989-07-26

Country Status (1)

Country Link
JP (1) JPH0327043U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009191466A (ja) * 2008-02-12 2009-08-27 Kawasaki Heavy Ind Ltd 圧縮空気を用いた鋼床版橋補強装置
JP2017108189A (ja) * 2012-12-19 2017-06-15 インテル コーポレイション 誘電性又は異方性導電性フィルム（ａｃｆ）ビルドアップレイヤーを有するパッケージ

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009191466A (ja) * 2008-02-12 2009-08-27 Kawasaki Heavy Ind Ltd 圧縮空気を用いた鋼床版橋補強装置
JP2017108189A (ja) * 2012-12-19 2017-06-15 インテル コーポレイション 誘電性又は異方性導電性フィルム（ａｃｆ）ビルドアップレイヤーを有するパッケージ

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