JPH0313740U - - Google Patents

Info

Publication number
JPH0313740U
JPH0313740U JP1989074751U JP7475189U JPH0313740U JP H0313740 U JPH0313740 U JP H0313740U JP 1989074751 U JP1989074751 U JP 1989074751U JP 7475189 U JP7475189 U JP 7475189U JP H0313740 U JPH0313740 U JP H0313740U
Authority
JP
Japan
Prior art keywords
lead frame
semiconductor pellet
heating means
wire bonding
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1989074751U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989074751U priority Critical patent/JPH0313740U/ja
Publication of JPH0313740U publication Critical patent/JPH0313740U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案のワイヤボンデイング装置を示
す概念図、第２図は従来のワイヤボンデイグ装置
を示す概念図である。 １，６……加熱手段、２……リードフレーム、
３……半導体ペレツト、４……キヤピラリー、５
……金属細線。

Claims (1)

    【実用新案登録請求の範囲】
  1. リードフレームに搭載された半導体ペレツトと
    該リードフレームのリードとを熱圧着法により接
    合するワイヤボンデイング装置において、リード
    フレームを介して半導体ペレツトを加熱する第１
    の加熱手段と、半導体ペレツトを直接加熱する第
    ２の加熱手段とを有することを特徴とするワイヤ
    ボンデイング装置。
JP1989074751U 1989-06-26 1989-06-26 Pending JPH0313740U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989074751U JPH0313740U (ja) 1989-06-26 1989-06-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989074751U JPH0313740U (ja) 1989-06-26 1989-06-26

Publications (1)

Publication Number Publication Date
JPH0313740U true JPH0313740U (ja) 1991-02-12

Family

ID=31614719

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989074751U Pending JPH0313740U (ja) 1989-06-26 1989-06-26

Country Status (1)

Country Link
JP (1) JPH0313740U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2483545B (en) * 2009-07-08 2013-09-18 Panasonic Corp Screen printing apparatus screen printing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2483545B (en) * 2009-07-08 2013-09-18 Panasonic Corp Screen printing apparatus screen printing method

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