JPS62193727U - - Google Patents
Info
- Publication number
- JPS62193727U JPS62193727U JP8239486U JP8239486U JPS62193727U JP S62193727 U JPS62193727 U JP S62193727U JP 8239486 U JP8239486 U JP 8239486U JP 8239486 U JP8239486 U JP 8239486U JP S62193727 U JPS62193727 U JP S62193727U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- substrate
- stirring rod
- molten solder
- make
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 5
- 239000008188 pellet Substances 0.000 claims description 4
- 238000003756 stirring Methods 0.000 claims description 3
- 239000010979 ruby Substances 0.000 claims description 2
- 229910001750 ruby Inorganic materials 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
Description
図面は本考案の実施例を示し、第１図は半導体
中間構体の一例を示す平面図、第２図は本考案実
施例を示し基板上の半田の撹拌工程を示す断面図
、第３図は半導体ペレツトの供給工程を示す断面
図である。 ２……基板、７……半導体ペレツト、１０……
半田、１１……撹拌棒、１３……ルビー。
中間構体の一例を示す平面図、第２図は本考案実
施例を示し基板上の半田の撹拌工程を示す断面図
、第３図は半導体ペレツトの供給工程を示す断面
図である。 ２……基板、７……半導体ペレツト、１０……
半田、１１……撹拌棒、１３……ルビー。
Claims (1)
- 加熱状態にある基板上に半田を供給し、溶融し
た該半田を前記基板に馴染ませるべく撹拌棒で前
記溶融半田を撹拌して後に、当該溶融半田上に半
導体ペレツトを供給して、前記半田を介して基板
上に半導体ペレツトをマウントするようにした半
導体装置の製造装置において、前記撹拌棒の少な
くとも半田と接触する部分をルビーで構成してあ
ることを特徴とする半導体装置の製造装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8239486U JPS62193727U (ja) | 1986-05-29 | 1986-05-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8239486U JPS62193727U (ja) | 1986-05-29 | 1986-05-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62193727U true JPS62193727U (ja) | 1987-12-09 |
Family
ID=30935009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8239486U Pending JPS62193727U (ja) | 1986-05-29 | 1986-05-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62193727U (ja) |
-
1986
- 1986-05-29 JP JP8239486U patent/JPS62193727U/ja active Pending