JPH032670U - - Google Patents

Info

Publication number
JPH032670U
JPH032670U JP6252589U JP6252589U JPH032670U JP H032670 U JPH032670 U JP H032670U JP 6252589 U JP6252589 U JP 6252589U JP 6252589 U JP6252589 U JP 6252589U JP H032670 U JPH032670 U JP H032670U
Authority
JP
Japan
Prior art keywords
circuit board
electronic components
coated
hybrid integrated
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6252589U
Other languages
English (en)
Other versions
JP2506915Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989062525U priority Critical patent/JP2506915Y2/ja
Publication of JPH032670U publication Critical patent/JPH032670U/ja
Application granted granted Critical
Publication of JP2506915Y2 publication Critical patent/JP2506915Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Description

【図面の簡単な説明】
第１図は本考案による混成集積回路モジユール
の一実施例を示すもので、同図ａは回路部品を搭
載した回路基板の平面図、同図ｂは上記部品上に
外装樹脂を塗装した状態を示す模式断面図である
。第２図は従来の混成集積回路モジユールを示す
図で、同図ａは回路部品を実装後の平面図、同図
ｂはこれら部品を外装樹脂により塗装した状態を
示す模式断面図である。第３図は混成集積回路モ
ジユールにおいて回路部品を基板の両面に実装し
た比較例、第４図は同様に回路部品を基板の両面
に実装した本考案の他の実施例を示すものであり
、両図においてａは回路部品実装後の基板上面の
平面図、ｂは基板裏面の平面図、ｃは部品実装後
の基板の側面図、ｄは基板の樹脂塗装後の模式断
面図である。 符号の説明、１……絶縁基板、２……厚膜抵抗
体、３……厚膜導体、４……チツプ導体、５……
リード、６……外装樹脂、７……ダミー部品、８
……ダミー部品ランド。

Claims (1)

    【実用新案登録請求の範囲】
  1. 回路基板の表面または表裏両面に複数の電子部
    品を搭載するとともに外周面を絶縁性の樹脂で被
    覆してなる混成集積回路モジユールであつて前記
    回路基板面の電子部品非搭載部分に、前記搭載実
    装電子部品のいずれかと略同等の外形および寸法
    を有するダミー部品を適宜配置固着せしめ、その
    上に前記絶縁性樹脂を被覆し、回路基板表面から
    樹脂被覆層表面までの距離が回路基板面全体にわ
    たりほぼ等しくなるように構成したことを特徴と
    する混成集積回路モジユール。
JP1989062525U 1989-05-31 1989-05-31 混成集積回路モジュ―ル Expired - Lifetime JP2506915Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989062525U JP2506915Y2 (ja) 1989-05-31 1989-05-31 混成集積回路モジュ―ル

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989062525U JP2506915Y2 (ja) 1989-05-31 1989-05-31 混成集積回路モジュ―ル

Publications (2)

Publication Number Publication Date
JPH032670U true JPH032670U (ja) 1991-01-11
JP2506915Y2 JP2506915Y2 (ja) 1996-08-14

Family

ID=31591753

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989062525U Expired - Lifetime JP2506915Y2 (ja) 1989-05-31 1989-05-31 混成集積回路モジュ―ル

Country Status (1)

Country Link
JP (1) JP2506915Y2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002069217A1 (fr) * 2001-02-27 2002-09-06 Honda Giken Kogyo Kabushiki Kaisha Systeme de gestion generale d'un composant tube/flexible
JP2013026234A (ja) * 2011-07-14 2013-02-04 Mitsubishi Electric Corp 半導体装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022147618A (ja) 2021-03-23 2022-10-06 キオクシア株式会社 メモリシステム

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01156582U (ja) * 1988-04-20 1989-10-27

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01156582U (ja) * 1988-04-20 1989-10-27

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002069217A1 (fr) * 2001-02-27 2002-09-06 Honda Giken Kogyo Kabushiki Kaisha Systeme de gestion generale d'un composant tube/flexible
JP2013026234A (ja) * 2011-07-14 2013-02-04 Mitsubishi Electric Corp 半導体装置

Also Published As

Publication number Publication date
JP2506915Y2 (ja) 1996-08-14

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