JPH0325934B2 - - Google Patents
Info
- Publication number
- JPH0325934B2 JPH0325934B2 JP63158577A JP15857788A JPH0325934B2 JP H0325934 B2 JPH0325934 B2 JP H0325934B2 JP 63158577 A JP63158577 A JP 63158577A JP 15857788 A JP15857788 A JP 15857788A JP H0325934 B2 JPH0325934 B2 JP H0325934B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate support
- resin
- strips
- mold
- external lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63158577A JPS6446942A (en) | 1988-06-27 | 1988-06-27 | Manufacture of resin seal type semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63158577A JPS6446942A (en) | 1988-06-27 | 1988-06-27 | Manufacture of resin seal type semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6446942A JPS6446942A (en) | 1989-02-21 |
| JPH0325934B2 true JPH0325934B2 (enrdf_load_stackoverflow) | 1991-04-09 |
Family
ID=15674729
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63158577A Granted JPS6446942A (en) | 1988-06-27 | 1988-06-27 | Manufacture of resin seal type semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6446942A (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07107787B2 (ja) * | 1992-07-21 | 1995-11-15 | 日立マクセル株式会社 | テープカートリッジ |
-
1988
- 1988-06-27 JP JP63158577A patent/JPS6446942A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6446942A (en) | 1989-02-21 |