JPS6446942A - Manufacture of resin seal type semiconductor device - Google Patents

Manufacture of resin seal type semiconductor device

Info

Publication number
JPS6446942A
JPS6446942A JP63158577A JP15857788A JPS6446942A JP S6446942 A JPS6446942 A JP S6446942A JP 63158577 A JP63158577 A JP 63158577A JP 15857788 A JP15857788 A JP 15857788A JP S6446942 A JPS6446942 A JP S6446942A
Authority
JP
Japan
Prior art keywords
substrate retainer
thin
thickness
stripes
external lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63158577A
Other languages
Japanese (ja)
Other versions
JPH0325934B2 (en
Inventor
Hiroyuki Fujii
Kenichi Tateno
Mikio Nishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP63158577A priority Critical patent/JPS6446942A/en
Publication of JPS6446942A publication Critical patent/JPS6446942A/en
Publication of JPH0325934B2 publication Critical patent/JPH0325934B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To make it possible to control the thickness of a thin resin layer beneath a substrate retainer in a uniform thickness with high accuracy, by retaining a substrate retainer serving also as a heat radiating plate at least at three points, and performing resin sealing. CONSTITUTION:An external lead 6 is formed in a body with a substrate retainer 2. Two thin stripes 15, 16 unified in a body with the substrate retainer 2 extend from the opposite side to a side linking to the external lead 6 of the substrate retainer 2. These are linked with a second common connection stripe 17. The thickness of thin stripes 15, 16 is made thinner than that of the substrate retainer 2, and a step-difference is formed between the lower surface of the stripes and that of the substrate retainer 2. Therefore, the substrate retainer 2 is retained at three points by the external lead 6 and the two thin stripes 15, 16. Thereby, even if resin 30 is injected into gaps of metal molds 13, 14 with high pressure, inclination and tortion of the substrate retainer 2 do not generate, and the thickness of a resin layer just under the substrate retainer can be controlled very exactly so as to be thin and uniform.
JP63158577A 1988-06-27 1988-06-27 Manufacture of resin seal type semiconductor device Granted JPS6446942A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63158577A JPS6446942A (en) 1988-06-27 1988-06-27 Manufacture of resin seal type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63158577A JPS6446942A (en) 1988-06-27 1988-06-27 Manufacture of resin seal type semiconductor device

Publications (2)

Publication Number Publication Date
JPS6446942A true JPS6446942A (en) 1989-02-21
JPH0325934B2 JPH0325934B2 (en) 1991-04-09

Family

ID=15674729

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63158577A Granted JPS6446942A (en) 1988-06-27 1988-06-27 Manufacture of resin seal type semiconductor device

Country Status (1)

Country Link
JP (1) JPS6446942A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06139743A (en) * 1992-07-21 1994-05-20 Hitachi Maxell Ltd Tape cartridge

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06139743A (en) * 1992-07-21 1994-05-20 Hitachi Maxell Ltd Tape cartridge

Also Published As

Publication number Publication date
JPH0325934B2 (en) 1991-04-09

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