JPH0325495B2 - - Google Patents
Info
- Publication number
- JPH0325495B2 JPH0325495B2 JP61214717A JP21471786A JPH0325495B2 JP H0325495 B2 JPH0325495 B2 JP H0325495B2 JP 61214717 A JP61214717 A JP 61214717A JP 21471786 A JP21471786 A JP 21471786A JP H0325495 B2 JPH0325495 B2 JP H0325495B2
- Authority
- JP
- Japan
- Prior art keywords
- less
- content
- alloy
- minutes
- properties
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Conductive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21471786A JPS6369933A (ja) | 1986-09-11 | 1986-09-11 | 電子・電気機器用銅合金とその製造法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21471786A JPS6369933A (ja) | 1986-09-11 | 1986-09-11 | 電子・電気機器用銅合金とその製造法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6369933A JPS6369933A (ja) | 1988-03-30 |
| JPH0325495B2 true JPH0325495B2 (enrdf_load_html_response) | 1991-04-08 |
Family
ID=16660455
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21471786A Granted JPS6369933A (ja) | 1986-09-11 | 1986-09-11 | 電子・電気機器用銅合金とその製造法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6369933A (enrdf_load_html_response) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6425929A (en) * | 1987-07-20 | 1989-01-27 | Furukawa Electric Co Ltd | Copper alloy for electronic equipment |
| JPH01219133A (ja) * | 1988-02-25 | 1989-09-01 | Mitsubishi Electric Corp | 電子部品用銅合金 |
| JP5107667B2 (ja) * | 2007-10-30 | 2012-12-26 | 株式会社デンソー | ろう付け用金属材料、ろう付け方法、および熱交換器 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6058783B2 (ja) * | 1982-01-20 | 1985-12-21 | 日本鉱業株式会社 | 半導体機器のリ−ド材用銅合金の製造方法 |
-
1986
- 1986-09-11 JP JP21471786A patent/JPS6369933A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6369933A (ja) | 1988-03-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |