JPH0322925Y2 - - Google Patents

Info

Publication number
JPH0322925Y2
JPH0322925Y2 JP1984146667U JP14666784U JPH0322925Y2 JP H0322925 Y2 JPH0322925 Y2 JP H0322925Y2 JP 1984146667 U JP1984146667 U JP 1984146667U JP 14666784 U JP14666784 U JP 14666784U JP H0322925 Y2 JPH0322925 Y2 JP H0322925Y2
Authority
JP
Japan
Prior art keywords
support plate
region
electrode
diode chip
external lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1984146667U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6161847U (h
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984146667U priority Critical patent/JPH0322925Y2/ja
Publication of JPS6161847U publication Critical patent/JPS6161847U/ja
Application granted granted Critical
Publication of JPH0322925Y2 publication Critical patent/JPH0322925Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/401—Disposition
    • H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
    • H01L2224/404—Connecting portions
    • H01L2224/40475—Connecting portions connected to auxiliary connecting means on the bonding areas
    • H01L2224/40491—Connecting portions connected to auxiliary connecting means on the bonding areas being an additional member attached to the bonding area through an adhesive or solder, e.g. buffer pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Rectifiers (AREA)
JP1984146667U 1984-09-28 1984-09-28 Expired JPH0322925Y2 (h)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984146667U JPH0322925Y2 (h) 1984-09-28 1984-09-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984146667U JPH0322925Y2 (h) 1984-09-28 1984-09-28

Publications (2)

Publication Number Publication Date
JPS6161847U JPS6161847U (h) 1986-04-25
JPH0322925Y2 true JPH0322925Y2 (h) 1991-05-20

Family

ID=30704901

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984146667U Expired JPH0322925Y2 (h) 1984-09-28 1984-09-28

Country Status (1)

Country Link
JP (1) JPH0322925Y2 (h)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0749745Y2 (ja) * 1988-01-28 1995-11-13 住友電気工業株式会社 ダイオード内蔵コネクタ
JP2566480Y2 (ja) * 1991-03-14 1998-03-25 新電元工業株式会社 ブリッジ型半導体装置
JP2009110981A (ja) * 2007-10-26 2009-05-21 Mitsubishi Electric Corp 半導体モジュール
JP6065501B2 (ja) * 2012-09-28 2017-01-25 サンケン電気株式会社 半導体装置
JP6065500B2 (ja) * 2012-09-28 2017-01-25 サンケン電気株式会社 半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5177341A (ja) * 1974-12-27 1976-07-05 Furukawa Electric Co Ltd Garasuhikaridensotaisogono setsuzokuhoho
JPS5320945U (h) * 1976-07-30 1978-02-22
JPS5432075A (en) * 1977-08-15 1979-03-09 Nec Corp Semiconductor device
JPS5660024A (en) * 1979-10-22 1981-05-23 Hitachi Ltd Composite type semiconductor device

Also Published As

Publication number Publication date
JPS6161847U (h) 1986-04-25

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