JPH0322925Y2 - - Google Patents

Info

Publication number
JPH0322925Y2
JPH0322925Y2 JP1984146667U JP14666784U JPH0322925Y2 JP H0322925 Y2 JPH0322925 Y2 JP H0322925Y2 JP 1984146667 U JP1984146667 U JP 1984146667U JP 14666784 U JP14666784 U JP 14666784U JP H0322925 Y2 JPH0322925 Y2 JP H0322925Y2
Authority
JP
Japan
Prior art keywords
support plate
region
electrode
diode chip
external lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1984146667U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6161847U (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1984146667U priority Critical patent/JPH0322925Y2/ja
Publication of JPS6161847U publication Critical patent/JPS6161847U/ja
Application granted granted Critical
Publication of JPH0322925Y2 publication Critical patent/JPH0322925Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/60—Strap connectors, e.g. thick copper clips for grounding of power devices
    • H10W72/641—Dispositions of strap connectors
    • H10W72/646—Dispositions of strap connectors the connected ends being on auxiliary connecting means on bond pads, e.g. on a bump connector
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/766—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Rectifiers (AREA)
JP1984146667U 1984-09-28 1984-09-28 Expired JPH0322925Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984146667U JPH0322925Y2 (enExample) 1984-09-28 1984-09-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984146667U JPH0322925Y2 (enExample) 1984-09-28 1984-09-28

Publications (2)

Publication Number Publication Date
JPS6161847U JPS6161847U (enExample) 1986-04-25
JPH0322925Y2 true JPH0322925Y2 (enExample) 1991-05-20

Family

ID=30704901

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984146667U Expired JPH0322925Y2 (enExample) 1984-09-28 1984-09-28

Country Status (1)

Country Link
JP (1) JPH0322925Y2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0749745Y2 (ja) * 1988-01-28 1995-11-13 住友電気工業株式会社 ダイオード内蔵コネクタ
JP2566480Y2 (ja) * 1991-03-14 1998-03-25 新電元工業株式会社 ブリッジ型半導体装置
JP2009110981A (ja) * 2007-10-26 2009-05-21 Mitsubishi Electric Corp 半導体モジュール
JP6065501B2 (ja) * 2012-09-28 2017-01-25 サンケン電気株式会社 半導体装置
JP6065500B2 (ja) * 2012-09-28 2017-01-25 サンケン電気株式会社 半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5177341A (ja) * 1974-12-27 1976-07-05 Furukawa Electric Co Ltd Garasuhikaridensotaisogono setsuzokuhoho
JPS5320945U (enExample) * 1976-07-30 1978-02-22
JPS5432075A (en) * 1977-08-15 1979-03-09 Nec Corp Semiconductor device
JPS5660024A (en) * 1979-10-22 1981-05-23 Hitachi Ltd Composite type semiconductor device

Also Published As

Publication number Publication date
JPS6161847U (enExample) 1986-04-25

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