JPH03205894A - 対象物を液体によつて処理するための方法及び装置 - Google Patents

対象物を液体によつて処理するための方法及び装置

Info

Publication number
JPH03205894A
JPH03205894A JP2260653A JP26065390A JPH03205894A JP H03205894 A JPH03205894 A JP H03205894A JP 2260653 A JP2260653 A JP 2260653A JP 26065390 A JP26065390 A JP 26065390A JP H03205894 A JPH03205894 A JP H03205894A
Authority
JP
Japan
Prior art keywords
liquid
flow
guide device
angle
outlet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2260653A
Other languages
English (en)
Japanese (ja)
Inventor
Horst Blaesing
ホルスト・ブレージング
Manfred Kallweit
マンフレート・カルヴアイト
Rolf Schroeder
ロルフ・シユレーダー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer Pharma AG
Original Assignee
Schering AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schering AG filed Critical Schering AG
Publication of JPH03205894A publication Critical patent/JPH03205894A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/14—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with multiple outlet openings; with strainers in or outside the outlet opening
    • B05B1/20—Perforated pipes or troughs, e.g. spray booms; Outlet elements therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/26—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with means for mechanically breaking-up or deflecting the jet after discharge, e.g. with fixed deflectors; Breaking-up the discharged liquid or other fluent material by impinging jets
    • B05B1/262—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with means for mechanically breaking-up or deflecting the jet after discharge, e.g. with fixed deflectors; Breaking-up the discharged liquid or other fluent material by impinging jets with fixed deflectors
    • B05B1/267—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means with means for mechanically breaking-up or deflecting the jet after discharge, e.g. with fixed deflectors; Breaking-up the discharged liquid or other fluent material by impinging jets with fixed deflectors the liquid or other fluent material being deflected in determined directions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • H05K3/0088—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor for treatment of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/26—Cleaning or polishing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Treatment Of Fiber Materials (AREA)
JP2260653A 1989-09-30 1990-10-01 対象物を液体によつて処理するための方法及び装置 Pending JPH03205894A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3932779A DE3932779A1 (de) 1989-09-30 1989-09-30 Verfahren zum behandeln von gegenstaenden mit einer fluessigkeit, sowie vorrichtung zur durchfuehrung des verfahrens
DE3932779.5 1989-09-30

Publications (1)

Publication Number Publication Date
JPH03205894A true JPH03205894A (ja) 1991-09-09

Family

ID=6390621

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2260653A Pending JPH03205894A (ja) 1989-09-30 1990-10-01 対象物を液体によつて処理するための方法及び装置

Country Status (10)

Country Link
EP (1) EP0421262A3 (enExample)
JP (1) JPH03205894A (enExample)
KR (1) KR910005930A (enExample)
CN (1) CN1019360B (enExample)
BG (1) BG50598A3 (enExample)
CA (1) CA2026517A1 (enExample)
CS (1) CS472790A3 (enExample)
DD (1) DD298066A5 (enExample)
DE (1) DE3932779A1 (enExample)
TW (1) TW221034B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE9116245U1 (de) * 1991-05-28 1992-05-14 Anton Müsing GmbH & Co. KG, 2957 Westoverledingen Vorrichtung zur Vergrößerung der Wassertiefe eines Gewässers
DE19722159A1 (de) * 1997-05-27 1998-12-03 Voith Sulzer Papiermasch Gmbh Verfahren und Vorrichtung zum direkten oder indirekten Auftragen eines flüssigen oder pastösen Auftragsmediums auf eine laufende Oberfläche
DE19827529A1 (de) * 1998-06-22 1999-12-23 Schmid Gmbh & Co Geb Einrichtung zur Behandlung von Gegenständen, insbesondere Leiterplatten
DE10232984A1 (de) 2002-07-19 2004-02-05 Steag Hamatech Ag Düsenanordnung zum Aufbringen einer Flüssigkeit auf ein Substrat
DE10358149B3 (de) * 2003-12-10 2005-05-12 Höllmüller Maschinenbau GmbH Verfahren und Vorrichtung zum berührungslosen Behandeln von ebenem Gut in Durchlaufanlagen
DE10358147C5 (de) * 2003-12-10 2007-11-22 Höllmüller Maschinenbau GmbH Verfahren und Vorrichtung zum Behandeln von ebenem Gut in Durchlaufanlagen
CN101412028B (zh) * 2007-10-19 2010-12-01 深圳市凯意科技有限公司 全气动钢版清洗系统
DE102014007057B3 (de) * 2014-05-15 2015-09-24 Atotech Deutschland Gmbh Verfahren und Vorrichtung zur Behandlung von empfindlichen plattenförmigen und flexiblen Werkstücken durch Führung der selbigen in einer Kanalströmung
DE102016220819B4 (de) * 2016-10-24 2018-09-20 Voith Patent Gmbh Rotierende Trommel

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3011061C2 (de) * 1980-03-21 1983-12-22 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Intensivierung von Spül- und Reinigungsprozessen für Perforationen in Formstücken in Spül- und Reinigungsautomaten
DE3102132A1 (de) * 1981-01-23 1982-08-26 Phoenix Ag, 2100 Hamburg Vorrichtung zum herstellen eines duennen beschichtungsfilmes auf gewebe
DE3620777A1 (de) * 1985-07-12 1987-01-22 Hoechst Ag Duesenkoerper zur fluessigkeitsbeschichtung von vertikal gefuehrten bahn- oder schlauchfoermigen koerpern
DE3528575A1 (de) * 1985-08-06 1987-02-19 Schering Ag Verfahren und einrichtung zur reinigung, aktivierung und/oder metallisierung von bohrloechern in horizontal gefuehrten leiterplatten

Also Published As

Publication number Publication date
TW221034B (enExample) 1994-02-11
EP0421262A3 (en) 1992-07-15
CN1050833A (zh) 1991-04-24
EP0421262A2 (de) 1991-04-10
KR910005930A (ko) 1991-04-27
DD298066A5 (de) 1992-02-06
BG50598A3 (en) 1992-09-15
CS472790A3 (en) 1992-02-19
CN1019360B (zh) 1992-12-09
CA2026517A1 (en) 1991-03-31
DE3932779A1 (de) 1991-04-11

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