JPH0319227Y2 - - Google Patents

Info

Publication number
JPH0319227Y2
JPH0319227Y2 JP1985043795U JP4379585U JPH0319227Y2 JP H0319227 Y2 JPH0319227 Y2 JP H0319227Y2 JP 1985043795 U JP1985043795 U JP 1985043795U JP 4379585 U JP4379585 U JP 4379585U JP H0319227 Y2 JPH0319227 Y2 JP H0319227Y2
Authority
JP
Japan
Prior art keywords
container
integrated circuit
hybrid integrated
circuit device
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1985043795U
Other languages
English (en)
Japanese (ja)
Other versions
JPS61162059U (en:Method
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985043795U priority Critical patent/JPH0319227Y2/ja
Publication of JPS61162059U publication Critical patent/JPS61162059U/ja
Application granted granted Critical
Publication of JPH0319227Y2 publication Critical patent/JPH0319227Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1985043795U 1985-03-28 1985-03-28 Expired JPH0319227Y2 (en:Method)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985043795U JPH0319227Y2 (en:Method) 1985-03-28 1985-03-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985043795U JPH0319227Y2 (en:Method) 1985-03-28 1985-03-28

Publications (2)

Publication Number Publication Date
JPS61162059U JPS61162059U (en:Method) 1986-10-07
JPH0319227Y2 true JPH0319227Y2 (en:Method) 1991-04-23

Family

ID=30555788

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985043795U Expired JPH0319227Y2 (en:Method) 1985-03-28 1985-03-28

Country Status (1)

Country Link
JP (1) JPH0319227Y2 (en:Method)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013069959A (ja) * 2011-09-26 2013-04-18 Nissan Motor Co Ltd パワーモジュールの冷却構造

Also Published As

Publication number Publication date
JPS61162059U (en:Method) 1986-10-07

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