JPH0319227Y2 - - Google Patents

Description

[Detailed Description of the Invention] [Technical Field of the Invention] This invention relates to a hybrid integrated circuit device, and particularly improves a heat dissipation stand that includes a printed circuit board, a semiconductor element, and a lead attached to the printed circuit board.

[Background technology of the invention]

An example of a conventional hybrid integrated circuit device is shown in FIG. In the figure, 101 is a heat sink with a thickness of 2 to 3 mm.
A printed circuit board (hereinafter referred to as the board) 102 made of ceramic and a transistor 103 with large heat dissipation are soldered to the upper surface of the copper plate.
02 has a lead 10 for connecting to an external circuit.
4,104... are provided. Note that although circuit patterns, active elements, passive elements, etc. are provided on the substrate, since they are the same as those in general, their explanations are omitted, and their illustrations are also omitted in the drawings. Also,
105, 105... are bonding wires that electrically connect the circuit pattern on the substrate and the transistor 103 attached to the heat sink. Further, on the opposite side of the heat dissipation stand 101, there are attachment holes 101 for attaching it inside the container (FIG. 7 106).
a, 101a are provided, and are fastened to these with screws (107 in Fig. 7).

[Problems with background technology]

In the hybrid integrated circuit device having the above structure, the heat sink 10 is heated due to the heat generated by the operation of the transistor 103.
1 and the substrate 102 are heated. This temperature rise causes thermal stress due to the difference in thermal expansion coefficient between the heat sink and the substrate, which causes cracks in the substrate and impairs normal operation, which is a major problem. This problem is particularly problematic because the substrate is a flat plate.
It is easy to cause distortion such as warping, unevenness, etc., resulting in poor adhesion, reduced heat dissipation effect, and cracks in the board due to mechanical stress. Furthermore, as shown in FIG. 7, when mounting this hybrid integrated circuit device in a box-shaped container 106 for storing and mounting it, it can be mounted only on the bottom surface 106a of the inner wall of the container, so a large projected area is required. It had the disadvantage of being occupied.

[Purpose of invention]

This invention is aimed at eliminating the above-mentioned drawbacks and provides a hybrid integrated circuit device that is resistant to thermal and mechanical stress and allows for miniaturization of the product.

[Summary of the idea]

In the hybrid integrated circuit device according to this invention, the heat sink 1 has a flat surface 1a formed on a part of the side surface of the heat sink 1.
A mounting surface 106b on the inner wall of the container 106 is provided with a substrate 102, a transistor 103, and leads 104, 104 attached to the substrate, and a side surface other than the above-mentioned side surface for housing and mounting this hybrid integrated circuit device. Attachment molding surface 1b in close contact with 106c
-1c, one example of the heat sink 11 has a triangular prism shape, the substrate 102 etc. is attached to one side 11a, and the other two sides 11b-
Inner surface 106b, 1 of box-shaped container 106 at 11c
06c in close contact with the corners 106b-106c.

[Example of idea]

This invention will be explained below with reference to FIGS. 1 to 5 for a hybrid integrated circuit device according to an embodiment. It should be noted that other than the heat dissipation stand is the same as the conventional one, so the same reference numerals are attached to the drawings and the explanation thereof will be omitted.

The heat dissipation table 1 shown in FIG. 1A is a perspective view seen from the front and in FIG.
102, a transistor 103, etc. are attached. Further, on the side surface other than the flat portion 1a, there is provided a container (see Fig. 2, 1
06) mounting surface in (Fig. 2 106b, 10
6c) are provided with attachment molding surfaces 1b and 1c in close contact with each other. Further, the attachment molding surfaces 1b and 1c are provided in close contact with attachment surfaces 106b and 106c (which are orthogonal to each other) of the container, respectively. next,
Of course, the attachment molding surfaces 1b and 1c may intersect directly with each other as shown in the figure, but there are inward protrusions (butting portions) at the corners of the inner surface of the container.
Or, as shown in FIG. 2, many of them are bent and formed with a "roundness", so it is preferable to have both attachment molded surfaces intersect with a surface 1d of an arbitrary shape interposed therebetween. Furthermore, although the illustrated front plane 1a is formed to be slightly concave than the side surface, this has the advantage that the heat dissipation stand 1 can be brought close to the mounting molding surfaces 1b and 1c where heat dissipation is dominated. There is an advantage that the circuit wiring etc. on the substrate 102 are protected against mechanical shock. Next, attachment holes 1e and 1e are formed in both attachment molding surfaces 1b and 1c, and the container is fastened thereto with a screw (not shown) that penetrates the side surface of the container.

Next, in another embodiment shown in FIGS. 3 to 5, the heat dissipation table 11 is a triangular prism, and a substrate 102, a transistor 103, etc. are attached to a flat part 11a on one side, and other The two side surfaces are attachment molding surfaces 11b and 11c, respectively, and are perpendicular to each other, and as shown in FIG. The screws (not shown) passing through the side surface of the container are fastened to the mounting holes 11e and 11c.

In addition, Fig. 4a and b show the attachment molding surface 1 of the triangular prism.
An example of the intersection angle between 1b, 11c and the plane 11a is shown. Figure a intersects at 45°, and the top view is a right isosceles.
Figure b shows an example of intersection at 60° and 30°.
These angles are arbitrary, depending on ease of installation in the container,
It may be determined by taking into consideration the difficulty of wiring after installation, the space occupied, etc.

[Effect of idea]

According to this invention, a wider heat radiation area than a conventional heat radiation stand can be obtained, so that thermal stress due to the difference in coefficient of thermal expansion between the heat radiation stand and the substrate can be reduced, and cracks in the substrate can be prevented.

In addition, distortions such as warping, distortion, and unevenness that occur on the board are less likely to occur, so it is possible to avoid deterioration of the adhesion of the mounting, prevent a reduction in heat dissipation effect, and reduce mechanical stress, which can reduce the mechanical stress of the board. Cracks are prevented.

Furthermore, when mounting it on a container, it can be attached to the side corner of the inner wall of the container, as shown in Figures 2 and 5, so the corner of the container, which was not used in the past, can be effectively used, making the product more compact. There are many notable advantages, such as the ability to

[Brief explanation of the drawing]

Figures 1 and 2 show an embodiment of this invention, Figure 1a is a perspective view, Figure b is a perspective view from another direction, and Figure 2 shows the state in which it is mounted in a container. The perspective views and FIGS. 3 to 5 show another embodiment, FIG. 3 is a perspective view, and FIG. 4 is a top view of a heat sink, where figure a is an isosceles type and figure b is an isosceles type. Indicate each
Fig. 5 is a perspective view showing the mounting state in the container;
7 and 7 relate to a conventional example, FIG. 6 is a perspective view, and FIG. 7 is a perspective view showing a state in which it is mounted in a container.
It is. DESCRIPTION OF SYMBOLS 1, 11... Heat sink, 1a, 11a... Planar part of heat sink, 1b, 1c, 11b, 11c... Mounting surface of heat sink, 102... Substrate, 103... Transistor, 104, 104... ...Reed, 106
...Container, 106b, 106c... Attachment surface of the container.

Claims (1)

[Scope of utility model registration request] The heat dissipation stand in a hybrid integrated circuit device is approximately triangular prism-shaped, and one side of the heat dissipation stand is shaped like a printed circuit board, a semiconductor element,
and a lead attached to the printed circuit board, and the other two sides are attachment molding surfaces that are closely attached to the corners of the inner side of the container in which the hybrid integrated circuit device is housed and attached. hybrid integrated circuit device.