JPH0317220B2 - - Google Patents

Info

Publication number
JPH0317220B2
JPH0317220B2 JP59011174A JP1117484A JPH0317220B2 JP H0317220 B2 JPH0317220 B2 JP H0317220B2 JP 59011174 A JP59011174 A JP 59011174A JP 1117484 A JP1117484 A JP 1117484A JP H0317220 B2 JPH0317220 B2 JP H0317220B2
Authority
JP
Japan
Prior art keywords
metal
resin
main surface
hole
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59011174A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60154543A (ja
Inventor
Eiji Hagimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP59011174A priority Critical patent/JPS60154543A/ja
Publication of JPS60154543A publication Critical patent/JPS60154543A/ja
Publication of JPH0317220B2 publication Critical patent/JPH0317220B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W76/157—
    • H10W76/47—
    • H10W70/682—
    • H10W72/07551—
    • H10W72/50—
    • H10W72/884—
    • H10W90/754—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP59011174A 1984-01-24 1984-01-24 合成樹脂基板を用いた半導体装置 Granted JPS60154543A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59011174A JPS60154543A (ja) 1984-01-24 1984-01-24 合成樹脂基板を用いた半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59011174A JPS60154543A (ja) 1984-01-24 1984-01-24 合成樹脂基板を用いた半導体装置

Publications (2)

Publication Number Publication Date
JPS60154543A JPS60154543A (ja) 1985-08-14
JPH0317220B2 true JPH0317220B2 (cg-RX-API-DMAC10.html) 1991-03-07

Family

ID=11770689

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59011174A Granted JPS60154543A (ja) 1984-01-24 1984-01-24 合成樹脂基板を用いた半導体装置

Country Status (1)

Country Link
JP (1) JPS60154543A (cg-RX-API-DMAC10.html)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62217645A (ja) * 1986-03-19 1987-09-25 Fujitsu Ltd 半導体装置の製造方法
JP2554059Y2 (ja) * 1988-02-18 1997-11-12 シャープ株式会社 半導体装置の実装構造
US5173766A (en) * 1990-06-25 1992-12-22 Lsi Logic Corporation Semiconductor device package and method of making such a package
US5455456A (en) * 1993-09-15 1995-10-03 Lsi Logic Corporation Integrated circuit package lid
US5798909A (en) * 1995-02-15 1998-08-25 International Business Machines Corporation Single-tiered organic chip carriers for wire bond-type chips
KR100206894B1 (ko) * 1996-03-11 1999-07-01 구본준 바지에이 패키지
EP0948047A3 (en) * 1998-03-20 1999-12-22 Caesar Technology Inc. Electronic component cooling arrangement
JP5673647B2 (ja) * 2012-10-12 2015-02-18 ダイキン工業株式会社 モジュール

Also Published As

Publication number Publication date
JPS60154543A (ja) 1985-08-14

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