JPH03170933A - Plate like substrate for forming resin film - Google Patents

Abstract

PURPOSE:To simultaneously form a resin film continuous between surfaces by forming a surface having a curvature at the corner between the surfaces forming a resin film. CONSTITUTION:A resin film is formed on the surfaces 4a-4c of the plate like substrate 4. A radius R of curvature is imparted to the corner between the surfaces 4a and 4c and between the surfaces 4c and 4b to form the film uniform in thickness, and the radius R of curvature is also imparted to the opposed corners. Chamfering is applied in this way with a curve rather than a straight line, and the resin film is formed to excellently connect the surfaces including the rounded surfaces. Consequently, a continuous pattern is formed between the surfaces.

Description

DETAILED DESCRIPTION OF THE INVENTION Industrial Application Field of the Invention The present invention relates to a resin film type plate-like substrate on which thin and uniform resin films can be formed on two or more surfaces.

Conventional Structures and Their Problems Chikage Development of Semiconductor Elements Technological advances in semiconductor manufacturing equipment have been remarkable, and we are now in the age of submicrons.

Photolithography is an indispensable process in the process of manufacturing semiconductors, and it is necessary to form a uniform and thin film of photosensitive resin on a substrate in the photolithography process. Although the development of methods is actively being carried out, a conventional apparatus used for forming a resin film will be described below.

FIG. 1 is a diagram showing resin film formation using a conventional spinner.

In Fig. 1, numeral 1 is a plate-shaped substrate, and by vacuum suctioning the surface opposite to the LA surface using a conventional spinner device and rotating it in the direction of the arrow, a resin film such as photosensitive resin is formed on the LA surface. FIG. 2 shows a conventional resin film forming method using a swinner. The plate-like substrate 1 shown in FIG. 2(a) is attached to a subinner device (not shown) by vacuum suction or the like so that the la side faces upward (the la side extends in a direction perpendicular to the rotation axis). 2), apply fluid resin 2 to surface Ia by spraying or dropping (Fig. 2(b)). Next, as shown in Fig. 2(c), the plate-shaped substrate l is rotated in the direction of the arrow using a swinner device to scatter excess resin and form a uniform resin film on the la surface (Fig. 2(c)). d)). In the method using the swinner device as described above (as shown in FIG. 2(d), the resin film 2a at the peripheral part of the plate-shaped substrate and the resin film 2b at the central part have different film thicknesses, and the resin film 2a part is thicker. There is a problem
Therefore, in the semiconductor process, a photosensitive resin film is formed on the 1a side and lb side using the above-mentioned spinner.
When trying to form a continuous pattern on the 1b side and the 1b side, it is possible to form a uniform pattern with different thicknesses at the periphery and the center, and with the same exposure, the exposed state is different between the center and the periphery. Furthermore, it is not possible to form a resin film on the 1a side and the 1b side at the same time, which increases the number of steps and increases production costs.Also, the corner formed by the 1a side and 1b side of the plate-shaped substrate However, no special measures such as adding radii were taken. Figure 3 shows the formation of a resin film using a conventional roll coater.

In FIG. 3, 3a and 3b are rotating rollers that form a resin film on the rotating roller 3a and transfer it to the la side of the plate-like substrate 1 to form a uniform resin film on the 1a side of the plate-like substrate 1. It is something to do.

In the case of this roll coater, the condition of the resin film on the 1a side is the same as in the case of the spinner described above, as shown in Figure 2 (d), where there is a difference in film thickness between the center and the peripheral part. An object of the present invention is to provide a plate-like substrate for forming a resin film, which can form a continuous resin film substantially uniformly on a plurality of surfaces at the same time. Structure of the present invention (1) A resin film shape that can simultaneously form a continuous resin film on one surface by forming a surface having a curvature at the corner between the surfaces on which the resin film is formed. It is a plate-like board for precepts.

DESCRIPTION OF THE EMBODIMENTS FIG. 4 is a diagram showing a swinner device that forms resin films on multiple surfaces at the same time. In FIG. 4, numeral 4 is a plate-shaped substrate (forming a resin film), and 5 is an auxiliary substrate provided for rotational balance. 6 is a rotary lower table groove; 7 is a board holding screw for attaching the plate-like board and the auxiliary board; 8 is a mounting screw to prevent the board-like board 4 and the auxiliary board 5 from flying out from the board holder 7 when rotational force is applied. Reference numeral 9 denotes an upper rotary table groove, 10 a connecting rod that connects the lower rotary table and the upper rotary table, and the substrate holder 7 has a recess 7a into which the plate-shaped substrate 4 and the auxiliary substrate 5 are inserted, as shown in FIG. (Na, even if it is attached to the lower rotary table 6 and the upper rotary table 9 by the flange portion 7b, the mounting screw 8 is provided with the flange portion 8a,
It is designed to prevent the plate-shaped substrate 4 and the auxiliary substrate 5 from popping out due to rotational force. The rotary upper table 9 is connected to the connecting rod 1
0, and the substrate mount 7 is provided at a position corresponding to the mounting device of the substrate holder 7 on the lower rotary table 6.
．． As mentioned above, the upper rotary table 9 and the lower rotary table 6
As shown in FIG. 4, the upper and lower ends of the plate-like substrate are held at the upper and lower ends.

The end 10a of the connecting rod 10 is rotatably mounted on the support plate 11 with a bearing 1.
As described above, the lower rotary table 6, the upper rotary table 9, the connecting rod 10. The base plate 11 , the board holding member 7 , and the board mounting means 13 with the mounting screws 8
It consists of

FIG. 6 is a diagram showing a state in which the plate-shaped substrate 4 is attached to the substrate attachment means l3, and shows the resin film forming surface 4a of the plate-shaped substrate 4. 4 b, 4
c Force length Even if it indicates that it is installed with a predetermined radius with respect to the rotation center and extending in the direction of the rotation axis, the lower rotary table 6 is screwed to the motor shaft 14a of the motor 14, which is the rotation driving means. Continuous. The board mounting means 13 is rotationally driven by the motor 14 to rotate the plate-shaped board 4 with a predetermined rotation radius around the rotation axis center.
5 is a base on which the rotation drive means 14 consisting of a motor is attached, and the support shaft l6 of the support plate 11 is attached (na, board attachment means l).
3 is indirectly rotatably held, the plate-shaped substrate 4C side surface 4a. Claws that form resin films on surfaces 4b and 4c. Uniform film thickness within the plane and between surfaces 4a and 4.
The corners of the c-plane, 4c-plane and 4b-plane are configured to have a curvature of radius R in order to form a uniform film thickness also at the corners. The opposing corners are also rounded.

(It is shown in FIG. 7.) FIG. 8 is a plan view showing a method of attaching the plate-shaped substrate 4 to the substrate attachment means l3 against rotation.
The plate-shaped substrate 4 has a rotation radius Q between the rotation axis P and the center Q of the plate-shaped substrate, and further has a wide surface 4a. 4
b) Mounted on the board mounting means 13 with an inclination θ (clockwise direction is +θ, counterclockwise direction is shown as θ) with respect to the line connecting the rotation axis P and the center of the plate-shaped substrate 4. There is. Also, the resin film forming surfaces 4a, 4b, 40c of the plate-like substrate 4; &
As shown in FIG. 1, it is configured to extend in the direction of the rotation axis. In the conventional method, as shown in FIG. i, the resin film forming surface 1a of the substrate 1 is configured to extend in a direction perpendicular to the rotation axis.

The procedure for the coating method of the present invention will be explained using the spinner device configured as described above. It is mounted so that the mounting angle θ is rounded and the resin film shaped facets 4a, 4b4c and 4d extend in the direction of the rotational axis (as shown in FIGS. 9(a) and 4).

Next, resin film forming surface 4 a, 4 b, 4 c, or 4
Apply resin A having fluidity to the d side. As for how to apply it, you can apply it manually with something like a syringe or (
You can apply it automatically with a spray etc. 1 In this case, apply it so as to cover at least the entire surface of the resin film forming surface on which the resin film is to be formed on the surface 4 a, 4 b, 4 c or 4 d. By doing so, variations in the thickness of the resin film on the forming surface can be reduced. It is shown in FIG. 9(b).

Next, the motor 14 is rotated and the circuit board attaching means is rotated as shown in FIG. 9 (b).
) Rotate in the direction of the arrow to scatter the excess resin A, and remove the plate-shaped substrate 4 from 4 a. A thin and uniform resin film can be simultaneously formed on the surfaces of the 4b and 4c surfaces.

As shown in Fig. 7, the chamfers R are formed at the corners of the plate-shaped substrate 4. The more the chamfers are formed with curves (having a certain curvature) than with straight lines, the more the curvature of the surface increases. The resin film can be shaped so as to have good surface-to-surface connection.An example of the method for forming the resin film as described above is shown below.

As shown in FIG. 10, the plate-shaped substrate 4 has a width W of 16 mm.
Length L is 140 mm, thickness T is 3 mm, angle R between surfaces
is 0.2 to 0.5+nm, and the number of rotations r of the subinner is 2
00 rpm, rotation radius Q is 60 mm, photosensitive resin viscosity is 35 cp, and the environmental temperature is 25 degrees ± 3 degrees. Figure 11 shows the resin film shape results when the mounting angle θ is changed. As can be seen from this result, planes 4a and 4c θ are rotated by -5 degrees, rotated by -35 degrees to 50 degrees, or set to around +10 degrees L,, planes 4b and 4C.
When forming a film of the same thickness on the surface! It can be seen that L should be set in the vicinity of -10° to -20°.

Also, when θ is around -30゛ to -50'', 4 a, 4
b. There is a certain stable state between the 4C planes, 4 a
, 4 If the difference in thickness is allowed between plane b and plane 4c, then
It is possible to form a resin film on these three surfaces at the same time, but when the mounting angle θ is set counterclockwise (Fig. 8 - θ direction), the mounting angle is 0° and θ≦60°, and the mounting angle is set clockwise. In the direction (10 direction in Fig. 8), 0゜〈θ≦45
12 shows that the resin film could be formed almost satisfactorily on multiple surfaces with the plate-like substrate 4, and the resin A conditions were the same as in FIG. FIG. 3 is a diagram showing the state of resin film formation as a relationship between the rotational speed r and the film thickness when changing . As a result, the film thickness tends to become thinner as the rotational speed r increases.At approximately 1500 rpm or higher, the slope becomes smaller, indicating that it is possible to form a film with a stable film thickness. Strength, which describes the film shape conditions and resin film formation state. Resin film formation state (can be changed depending on resin film formation conditions, rotation speed r, rotational radius, mounting angle θ, resin material, resin viscosity, etc.) By selecting these conditions, it is possible to form any desired resin film.

In addition, using the resin film forming method as described above, the plate-shaped substrate 4 shown in FIG. .0
mm, and the angle R is 0.2 to 0.5 mm. ) faction 4
a, 4 b, 4 c, 4. conductor metal B (Au,
A photosensitive resin film (photoresist) is formed on the surface using the above method, and exposed and etched (E4a or 4 as shown in Figure 13).
It was confirmed that a continuous pattern could be formed on the b-plane and the 4C-plane. However, the conductor metal pattern width was 105 μm.
By using the resin film forming method described above, the thickness of the resin film can be made almost uniform within the plane of the plate-shaped substrate, and the conductor metal width n20 μm can be used.
A continuous resin film can be formed on multiple surfaces of a plate-shaped substrate at the same time.

Effects of the Invention The resin film-formed plate-like substrate of the present invention (L) By forming a continuous resin film on multiple surfaces by giving R to the corners formed by the surfaces forming the resin film, It is now possible to form a continuous pattern between surfaces, and its industrial effect is due to the thick L1

[Brief explanation of the drawing]

Figure 1 is a perspective view showing the process of forming a resin film using a conventional spinner. Figure 2 is a perspective view showing the procedure for forming a resin film using a spinner. Figure 3 is a perspective view showing the process of forming a resin film using a conventional roll coater. Figure 4 is a side view showing a spinner device that forms resin films on multiple surfaces at the same time; Figure 5 is a perspective view showing the substrate holding member and mounting screws of the same device; Figure 7 is a perspective view of the main part showing the mounted state of the board.
Figure 8 is a plan view showing the attachment relationship between the plate-like substrate and the subinner device in the same device; Figure 9 is a plan view showing the resin film forming procedure in the same device; Figure 10 is a perspective view of the same plate-like substrate; Characteristics showing the relationship between the mounting angle θ of the plate-shaped substrate and the thickness of the resin film formation @ Figure 12 shows the characteristics showing the relationship between the rotation speed and the resin film formation thickness @ Figure 13 shows the relationship between the resin film formation thickness of the resin film formation of the present invention FIG. 2 is a partial perspective view showing a plate-shaped substrate on which a conductor pattern is formed using a plate-shaped substrate. 1. 4 --- Plate substrate, 1 a, 4 a, 4
b, 4 c -...=Resin film type kettle 13...Board mounting means, 14...Rotation drive means, θ...Board mounting angle, P...Rotating center notch\Q ...half rotation u
kA... Tree H house r... Rotation speed, B... Conductor metal shoe

Claims (1)

[Claims] (1) A plate-shaped substrate for forming a resin film, characterized in that a corner formed by two surfaces on which a resin film is formed is formed as a surface having curvature.