JPS6342526Y2 - - Google Patents

Description

[Detailed description of the invention] [Summary] Regarding a resist coating device, the purpose is to coat a resist film to a uniform thickness on a substrate, and it consists of a resist droplet nozzle and a substrate that is placed and rotated. The present invention includes a resist coating apparatus having a substrate mounting table, and a resist liquid suction port for sucking the resist liquid upwardly provided in proximity to the peripheral edge of the upper surface of the substrate.

[Industrial application field]

The present invention relates to a resist coating device.

There is a need for a resist coating device that coats a resist film to a uniform thickness on a substrate.

The present invention provides a resist coating device that meets such demands.

[Conventional technology]

It is well known that when forming semiconductor devices such as ICs and LSIs, fine resist film patterns using photolithography are used in the process of forming fine patterns.

For example, a conventional resist coating apparatus used when dropping a resist solution onto a substrate for forming a semiconductor element such as silicon (Si) and uniformly applying the resist solution onto the substrate to form a resist film. This will be explained using figures.

In the figure, a Si substrate 2, for example, is fixed on a substrate mounting table 1 having a chuck mechanism, and a resist liquid 3 is dropped onto the substrate 2 from a resist liquid dropping nozzle 4 using high pressure nitrogen or the like.

The substrate mounting table 1 is surrounded by a container 5 made of metal, and a lid 6 having a hole through which the dripping nozzle 4 passes is provided on the top surface of the container 5. is provided with an exhaust hole 7 and is connected to an exhaust duct (not shown) through a connecting pipe 8, so that the exhaust is constantly exhausted.

By rotating the substrate mounting table 1 by the motor 9, the above-mentioned dropped resist liquid 3 on the substrate 2 is spread to a uniform thickness and applied to the substrate 2.

However, due to surface tension, the resist film, which is spread and applied to a uniform thickness on the substrate 2 due to rotation, protrudes at the periphery of the upper surface of the substrate 2, as shown in the enlarged cross-sectional view of the main part in Fig. 2. Most of the resist liquid 3 dropped onto the substrate is scattered into the container 5 by rotation and is discharged from the exhaust hole 7 provided at the bottom of the container 5. will be done.

The non-uniformity of the resist film that occurs at the peripheral edge of the upper surface of the substrate has an adverse effect on the formation of a desired pattern in a subsequent process.

[Problem that the invention attempts to solve]

Therefore, there is a problem in developing a resist coating device that does not cause non-uniformity of the resist film on the peripheral edge of the upper surface of the substrate.

This invention was created in view of these problems.
An object of the present invention is to provide a resist coating device that achieves uniformity in resist film thickness.

[Means for solving problems]

It has a resist liquid dropping nozzle and a substrate mounting table that rotates on which a substrate is placed, and a resist liquid suction port that sucks the resist liquid upward is provided in proximity to the peripheral edge of the upper surface of the substrate. The above-mentioned problems can be solved by the resist coating apparatus characterized by the following.

[Effect]

Excess resist liquid deposited on the periphery of the top surface of the substrate is sucked through a resist liquid suction port provided close to the periphery of the top surface of the rotating substrate, thereby preventing the resist film from becoming convex at the periphery of the top surface of the substrate. It is prevented.

〔Example〕

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 3 is an enlarged sectional view of the main part of the resist liquid suction port of the resist coating apparatus of the present invention. As shown in the figure, a resist liquid suction port 10 is provided close to the peripheral edge of the top surface of the rotating substrate 2, and excess resist liquid deposited on the peripheral edge of the top surface of the substrate 2 is sucked upward from the resist liquid suction port 10. I try to do that.

According to this structure, the convex resist film on the peripheral edge of the upper surface of the substrate as shown in FIG.
It is possible to prevent the formation of a convex resist film 3' that is absorbed by the resist film 3'.

In addition, by providing the opening of the resist liquid suction port close to the top surface of the substrate and parallel to the substrate surface, the force to partially uniformly suck the peripheral edge of the top surface of the substrate can be strengthened.
It is possible to effectively make the film thickness on the substrate uniform.

[Effect of idea]

As explained above, the present invention prevents the formation of a convex resist film on the peripheral edge of the upper surface of the substrate,
It becomes possible to apply a resist film of uniform thickness on the substrate.

[Brief explanation of drawings]

FIG. 1 is a schematic diagram of a conventional resist coating device, FIG. 2 is an enlarged sectional view of main parts for explaining the conventional coating state, and FIG. 3 is a resist coating device of an embodiment of the present invention. FIG. 3 is an enlarged sectional view of a main part of a liquid suction port. In the figure, 1 is a substrate mounting table, 2 is a substrate, 3 is a resist solution, 4 is a nozzle for dropping the resist solution, and 10 is a resist solution suction port.

Claims (1)

[Scope of utility model registration request] It has a nozzle for applying the resist solution, and a substrate mounting table that rotates on which a substrate is placed, and a resist solution suction port that sucks the resist solution upward is provided in proximity to the periphery of the upper surface of the substrate. A resist coating device characterized by: