JPH03157159A - Spinner device - Google Patents

Abstract

PURPOSE:To simultaneously form approximately uniform resin films on the plural surfaces of a plate substrate by holding the plate substrate so as to have a prescribed radius of rotation with the center of rotation and to extend the resin film forming surfaces toward the axial center of rotation and rotating the substrate around the axial center of rotation. CONSTITUTION:The plate substrate 4 is mounted to a substrate mounting means 13 so as to have the radius (l) of rotation between the axial center P of rotation and the center Q of the plate substrate and to provide the broad surfaces 4a, 4b of the plate substrate 4 with an inclination theta (a clockwise direction is shown by +theta and a counterclockwise direction by -theta) with the line connecting the axial center P of rotation and the center Q of the plate substrate 4. In addition, the substrate is so mounted that the resin film forming surfaces 4a, 4b, 4c, and 4d extend toward the axial center of rotation. A resin having flowability is then applied on the resin film forming surface 4a, 4b, 4c, or 4d. A motor 14 is then rotated and the substrate mounting means is rotated to splash the excess resin, by which the thin and uniform resin films are simultaneously formed on the 4a, 4b, 4c surfaces of the plate substrate 4.

Description

Detailed Description of the Invention: Industrial Field of Application The present invention (1) relates to a spinner device that can simultaneously form a thin, uniform resin film on at least two or more surfaces of a plate-shaped substrate in a semiconductor manufacturing process. Amo Conventional Structures and Their Problems The Development of Semiconductor Elements Technological advances in semiconductor manufacturing equipment have been so remarkable that we are now in the era of submicron technology.

The photolithography process is an indispensable step in the process of manufacturing semiconductors.Is it necessary to form a uniform, thin film of photosensitive resin, etc. on a substrate in the photolithography process? Development is actively underway.

A conventional apparatus used for forming a resin film will be described below.

Figure 1 is a diagram showing the formation of a resin film using a conventional spinner.a In Figure 1, 1 is a plate-shaped substrate, and the surface opposite to the 18th surface is vacuum-adsorbed by a conventional spinner device, and the surface shown by the arrow is A conventional method for forming a resin film using a spinner is shown in FIG. The plate-like substrate 1 shown in FIG. 2(a) is attached to a spinner device (not shown) by vacuum suction or the like so that the 18th side faces upward (the Ia side extends perpendicular to the rotating shaft). 2), apply fluid resin 2 to the 18th surface by spraying or dropping (Fig. 2(b)). Next, as shown in FIG. 2(c), the plate-shaped substrate 1 is rotated in the direction of the arrow using a spinner device to scatter excess resin and form a uniform resin film on 18 surfaces (see FIG. 2(d). )). As shown in FIG. 2(d), the method using the spinner device described above differs in film thickness between the resin film 2a at the peripheral part of the plate-shaped substrate and the resin film 2b at the central part, and the resin film 2a is thicker. Therefore, in the semiconductor process, when trying to form a photosensitive resin film on the 1a side and Ib side using the above-mentioned spinner to form a continuous pattern on the 18th side and 1b side, it is necessary to When exposed to the same light, the exposure conditions were different between the center and the periphery, making it impossible to form a uniform pattern.Furthermore, it was not possible to form a resin film on the 18th and LB sides at the same time. Figure 3 shows the formation of a resin film using a conventional roll coater.

In FIG. 3, 3a and 3b are rotating rollers, which form a resin film on the rotating roller 3a and transfer it to the 1a side of the plate-like substrate 1 to form a uniform resin film on the 1a side of the plate-like substrate 1. Even when this roll coater is used, the state of the resin film on the 18 surfaces differs in thickness between the center and peripheral parts, as shown in FIG. 2(d), as in the case of the spinner described above. Therefore, the present invention has the same problem as the spinner.Object of the InventionThe present invention solves the above-mentioned conventional problems. An object of the present invention is to provide a spinner device capable of forming substantially uniform resin films on multiple surfaces. A spinner that can simultaneously form substantially uniform resin films on multiple surfaces of a plate-shaped substrate by extending the resin film forming surface in the direction of the rotation axis and rotating around the rotation axis for holding purposes. 4 is a diagram showing a spinner device used for forming a resin film of the present invention. In FIG. 4, 4 is a plate-shaped substrate (for forming a resin film), and 5 is a rotating An auxiliary board provided for balance. 6 is a lower rotating tape/lz, 7 is a board holder for attaching the plate-like board and the auxiliary board. 8 is a board that holds the plate-like board 4 and the auxiliary board 5 when applying rotational force. Attachment modification to prevent the board from jumping out from the substrate holder 7. Reference numeral 9 indicates an upper rotary table, and 10 indicates a connecting rod that connects the lower rotary table and the upper rotary table.

As shown in FIG. 5, the substrate holder 7 has a recess 7a into which the plate-like substrate 4 and auxiliary substrate 5 are inserted, and can be attached to the lower rotary table 6 and the upper rotary table 9 through the flange portion 7b. Mounting screws 8 A flange portion 8a is provided to prevent the plate-like substrate 4 and the auxiliary substrate 5 from popping out due to rotational force. The rotary upper table 9 has a connecting rod 10
Even if the substrate mount 7 is integrally connected to the lower rotary table 6 and is provided at a position corresponding to the mounting device of the substrate holder 7 on the lower rotary table 6, the substrate mount 7ζ rotates with the upper rotary table as described above. As shown in FIG. 4, the upper and lower ends of the plate-shaped substrate are held in the lower table 6, respectively.

The end 10a of the connecting rod 10 is rotatably mounted on the support plate 11 with a bearing 1.
2. As described above, the lower rotary table 6, the upper rotary table 9. Connecting rod 10. Board mounting means 13 with support plate 11°, board holding member 7, and mounting screws 8
It consists of

FIG. 6 is a diagram showing how the plate-shaped substrate 4 is attached to the substrate attachment means 13, and shows the resin film forming surfaces 4a, 4b, 4 of the plate-shaped substrate 4.
c Force length Indicates that it is installed with a predetermined radius relative to the rotation center and extends in the direction of the rotation axis. The lower rotary table 6 is screwed to and continuous with a motor shaft 14a of a motor 14, which is a rotational drive means. The board mounting means 13 is rotationally driven by the motor 14, and the plate-shaped board 4 is rotated with a predetermined rotation radius around the rotation axis 4.
Reference numeral 15 denotes a base on which a rotary drive means 14 consisting of a motor is attached, and a support shaft 16 of the support plate 11 is attached (and the substrate attachment means 13 is indirectly rotatably held).

The force for forming resin films on the surfaces 4a, 4b, and 4c of the plate-shaped substrate 4 (uniformity of the film thickness within the surface and on the surfaces 4a and 4O)
The corners of the planes 40 and 4b may be configured to have a curvature of radius R to form a uniform film thickness at the corners, or the opposing corners may also have a radius R. Even if you configure
(This is shown in FIG. 7.) FIG. 8 is a plan view showing a method of attaching the plate-shaped substrate 4 to the substrate attaching means 13 against rotation. The plate-like substrate 4 has a rotation radius 9 between the rotation axis P and the center Q of the plate-like substrate, and wide surfaces 4a and 4b of the plate-like substrate 4.
75<, and is attached to the substrate mounting means 13 with an inclination θ (clockwise direction is +θ1 and counterclockwise direction is 1θ) with respect to the line connecting the rotation axis P and the center of the plate-like substrate 4. a Also, the resin film forming surfaces 4a, 4b, 4cf & of the plate-shaped substrate 4
As shown in FIG. 1, it is configured to extend in the direction of the rotation axis. In the conventional method, as shown in FIG. 1, the resin film forming surface la of the substrate 1 is configured to extend in a direction perpendicular to the rotation axis.

The steps of the coating method of the present invention will be explained using the spinner device configured as described above. It is mounted so that the mounting angle θ is given and the resin film forming surfaces 4a, 4b, 4c and 4a extend in the direction of the rotation axis (Fig. 9(a) and 4).
As shown in the figure. ).

Next, the resin film forming surface 4 a, 4 b, 4 c, or 4
A resin A having fluidity is applied to the a side. Regarding the method of application (L) You can apply it manually with something like a syringe, or you can apply it automatically with a spray, etc. In this case, at least the forming surfaces 4a, 4b, 4c or 4a If the resin film is applied so as to cover the entire surface on which the resin film is to be formed, variations in the thickness of the resin film on the formation surface can be reduced, as shown in FIG. 9(b).

Next, the motor 14 is rotated and the circuit board attaching means is rotated as shown in FIG. 9 (b).
) By rotating in the direction of the arrow to scatter the excess resin A, a thin and uniform resin film can be simultaneously formed on the surfaces 4a, 4b, and 4c of the plate-shaped substrate 4.

As shown in FIG.
So that it has a certain curvature. ), it is possible to form a resin film so as to better connect surfaces including curvature surfaces.

The plate-shaped substrate 4 is as shown in Fig. 1O (9 width W is 16 mm,
The length is 140+nm, the thickness T is 3 mm, the angle between surfaces R′lJ<0°2~0.5mm (!l:L, the spinner rotation speed r is 200Orpm, and the rotation radius 2 is 60mm)
The results of resin film formation when the viscosity of the photosensitive resin is 35 cp, the environmental temperature is 25 degrees ± 3 degrees, and the mounting angle θ is changed are shown in the first table.
Figure 1 shows a diagram of the mounting angle θ and the film thickness t.9 From this result, it can be seen that the 4a plane and the 40 plane θ are rotated by 15 degrees -3
Set around 5° to 50° or around +10°,%
When forming a film with the same thickness on the 4b plane and the 4O plane, it
It may be better to set it around -10' to -20°.Also, when θ is around 130° to 150°, 4 a, 4
b, there is a certain stable state between the 40 planes, 4 a,
If a difference in thickness is allowed between the 4b plane and the 4O plane, a resin film can be formed on these three planes at the same time.

When the mounting angle θ is set counterclockwise (Fig. 8 - θ direction)
0° <θ≦60°, and when the mounting angle is clockwise (Fig. 8 - θ direction), it is 0° and θ≦4.
With an angle of 5°, resin films can be formed almost satisfactorily on multiple surfaces.9 FIG. 12 shows a plate-shaped substrate 4. The resin A conditions are the same as in Figure 1O, and the mounting angle θ is -45°, and the resin film formation state is shown as the relationship between the rotation speed r and the film thickness when the spinner rotation speed r is changed. Amo The results show that the film thickness tends to become thinner as the rotational speed r increases.The slope becomes smaller above 1500 rpm, indicating that it is possible to form a film with a stable film thickness. Conditions for resin film formation Conditions for resin film formation Conditions for resin film formation (Resin film formation conditions 1 rotation speed r 2 radius of rotation, mounting angle θ, resin material, resin viscosity 9, etc.) By selecting these conditions, the necessary resin film can be formed arbitrarily. However, by using the resin film forming method as described above, the plate-shaped substrate 4 shown in FIG. 10 ( Width W is 16~2
0+nm, length 140mm, 250mm, thickness t
is 2.5~3.0mm, and the angle R is 0°2~0.5ma+
Later. ) conductive metal B on 4a, 4b, 4c, 4d
(Au, Cu, Cr) etc. are deposited on the sono surface i.
, :.

Form a photosensitive resin film (photoresist) using the above method.
Exposure, etching and blowing 1Q4 as shown in Figure 13
It was confirmed that it was possible to form a continuous pattern on the a or 4b plane and the 40 plane.
By using the resin film forming method as described above, it is possible to make the thickness of the resin film approximately uniform within the plane of the plate-shaped substrate, and it is also possible to simultaneously form the resin film on multiple surfaces of the plate-shaped substrate. Effects of the Invention The spinner device of the present invention (top) is a spinner device in which a plate-shaped substrate is held at a predetermined radius of rotation with respect to the center of rotation, the resin film-formed surface extends in the direction of the rotation axis, and rotated. By rotating around the axis, it is possible to form a resin film on two or more surfaces at the same time, and it is also possible to form a continuous resin film almost uniformly on multiple surfaces. It also enables continuous pattern formation on multiple surfaces, and its industrial effects are significant.

[Brief explanation of the drawing]

Figure 1 is a perspective view showing the resin film formation method using a conventional spinner @ Figure 2 is a perspective view showing the steps of the resin film formation method using the spinner Figure 3 is a perspective view showing the resin film formation method using the conventional roll coater @ 4 Figure 5 is a side view showing the spinner device of the present invention. Figure 5 is a perspective view showing the substrate holding member and mounting screws of the same device. Figure 6 is a main part showing how the plate-shaped substrate is attached to the substrate holding member of the device. Fig. 7 is a partial perspective view of the same plate-like substrate; Fig. 8 is a plan view showing the attachment relationship between the plate-like substrate and the spinner device in the same device; Fig. 9 is a cross-sectional view showing the same resin film forming procedure; is a perspective view of the same plate-shaped substrate. Figure 11 is a characteristic showing the relationship between the mounting angle θ of the plate-shaped substrate to the spinner and the resin film formation thickness. Figure 12 is a characteristic showing the relationship between the rotation speed and the resin film formation thickness. FIG. 13 is a partial perspective view showing a conductive pattern formed on a plate-like substrate using the resin film forming method of the present invention. 1, 4---・plate-like group i% la, 4a, 4b, 4
C-'-・Resin film formation thickness 13... Board mounting method 14
... Rotation drive method θ ... Board mounting 9 P...
...Rotating I0\Q...Rotating ecology A...Resin r...Rotation speed B...Conductor Kinho

Claims (5)

[Claims] (1) A substrate mounting means that has a predetermined radius of rotation with respect to the rotation center and that holds the plate-shaped substrate by extending the resin film-formed surface of the plate-shaped substrate in the direction of the rotation axis; and the substrate mounting means. A spinner device comprising: a rotational drive means for rotationally driving the spinner device; (2) a connecting rod that integrally connects the substrate mounting means to a lower rotary table, an upper rotary table arranged at a predetermined distance from the lower rotary table, and the upper table and the lower table; A substrate holding member is arranged on opposite sides of the upper table and the lower table and has a predetermined rotation radius from the rotation centers of the upper table and the lower table, and holds a plate-shaped substrate. A spinner device according to claim 1, characterized in that: (3) The force of the substrate holding member of the substrate mounting means is applied between a line connecting the cross-sectional center of the plate-shaped substrate in a direction perpendicular to the rotation axis and the rotation center and the wide surface of the resin film-formed surface of the plate-shaped substrate. The spinner device according to claim 1 or 2, wherein the spinner device is configured to hold the plate-like substrate by giving an attachment angle θ to the spinner device. (4) When the board mounting means is rotated counterclockwise, the mounting angle θ is counterclockwise and 0°<
A spinner device according to claim 1, 2, or 3, characterized in that the spinner device is configured to hold a plate-like substrate at θ≦60°. (5) When the rotation direction of the board mounting means and the board mounting means is counterclockwise, the mounting angle θ is clockwise and 0°<θ
A spinner device according to claim 1, 2, or 3, characterized in that the spinner device is configured to hold the plate-like substrate at an angle of ≦45°.