JPH0470953B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a resin film forming apparatus that simultaneously forms thin and uniform resin films on multiple surfaces of a plate-shaped substrate.

Structure of conventional examples and their problems In recent years, the development of semiconductor devices has been remarkable, and in the process of manufacturing semiconductor devices, it is necessary to form a uniform and thin resin film such as a photosensitive resin film on the surface of a substrate. The development of equipment for forming resin films has been actively conducted.

A conventional resin film forming apparatus will be explained below.

FIG. 1 is a perspective view showing the principle of a conventional resin forming apparatus.

In FIG. 1, 1 is a sample stage, and 2 is a rotary drive motor, and the sample stage 1 is rotated by the rotary drive motor 2. In FIG. The substrate 3 is mounted and fixed on the sample stage 1 by a method such as vacuum suction (not particularly shown) so that the surface 3a of the substrate 3 on which the resin film is to be formed is perpendicular to the rotation axis. There is. and,
After pouring an appropriate amount of liquid photosensitive resin or the like onto the surface 3a of the substrate 3, when the sample stage 1 and the substrate 3 are rotated by the rotary drive motor 2, a thin resin film is formed on the surface 3a of the substrate 3. The thickness of this resin film can be arbitrarily determined by selecting the rotational speed of the sample stage 1 or the viscosity of the liquid resin.

However, in the above configuration, the substrate 3
A thick portion of several millimeters may occur around the surface 3a, and a resin film similar to that on the surface 3a cannot be formed on the opposite surface or side surface 3b at the same time as the surface 3a. had. Therefore, the problem with conventional resin film forming methods is that even if photo-etching is performed using a photosensitive resin film, it is not possible to form a fine pattern that continuously connects the surface 3a and the side surface 3b. It had

OBJECTS OF THE INVENTION The present invention solves the conventional problems as described above, and aims to provide a resin film forming apparatus that can simultaneously form substantially uniform resin films on multiple surfaces of a substrate.

Composition of the Invention In order to achieve this object, the present invention provides a plate-like substrate having a substantially rectangular cross section, which is spaced a predetermined distance from the main axis of rotation, and the longitudinal direction of the plate-like substrate is parallel to the main axis of rotation. The discontinuity between the end face of the plate-like substrate and the two side faces sandwiching it can be eliminated by having a mounting means for fixing and holding the plate-like substrate at both ends thereof, and by configuring the mounting means and a driving means for rotating the plate-like substrate around the rotational main shaft. This makes it possible to simultaneously form a substantially uniform resin film on multiple surfaces.

DESCRIPTION OF EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

FIG. 2 shows a side view (the shaded area is a cross section) of a resin film forming apparatus in one embodiment of the present invention. In FIG. 2, numeral 4 is a plate-shaped substrate on which a resin film is formed, and 5 is an auxiliary substrate provided to maintain rotational balance. 6 is a lower rotary table; 7 is a substrate holder for attaching the plate-shaped substrate 4 and the auxiliary substrate 5 to the lower rotary table 6 and the upper rotary table 9; 8;
When a rotational force is applied, the plate-like substrate 4 and the auxiliary substrate 5
A mounting screw 10 is used to prevent the substrate holder from jumping out from the substrate holder 7, and 10 is a rotating main shaft.

As shown in FIG. 3, the substrate holder 7 is provided with a recess 7a into which the plate-shaped substrate 4 and the auxiliary substrate 5 are inserted, and is attached to the lower rotary table 6 and the upper rotary table 9 through flange portions 7b, respectively. Further, the mounting screw 8 is provided with a flange portion 8a, and the plate-shaped substrate 4 and the auxiliary substrate 5 are provided with a flange portion 8a.
The structure is such that it prevents it from flying out due to rotational force. Further, as described above, the upper rotary table 9 is integrally connected to the lower rotary table 6 by the rotary main shaft 10, and the upper rotary table 9 is located at a position corresponding to the mounting position of the substrate holder 7 on the lower rotary table 6 side.
A side substrate holder 7 is provided. That is, the substrate holders 7 are provided at both ends of the upper rotary table 9 and the lower rotary table 6, respectively, and are configured to hold both ends of the plate-shaped substrate 4 and the auxiliary substrate 5 in the longitudinal direction. The upper end portion 10a of the rotating main shaft 10 is rotatably held on a support plate 11 via a bearing 12. The board mounting means 13 is configured as described above.

FIG. 4 shows the state in which the plate-shaped substrate 4 is attached to the substrate attachment means 13. The lower end of the plate-shaped substrate 4 is inserted into the recess 7a of the substrate holder 7, and the flange 8a of the mounting screw 8 is attached to the plate-shaped substrate 4. The board 4 is locked. Further, the lower rotary table 6 is driven by a motor 14 which is a rotational driving means.
The circuit board mounting means 13 is connected to a motor shaft 14a, and the board mounting means 13 is rotated by the motor 14. This motor 14 is fixed to a base 15. Reference numeral 16 denotes a support rod for fixing the support plate 11 to the base 15. 17 is a protective cover that protects the motor 14 and its drive circuit (not particularly shown), etc., and 18 is a protective cover that protects the motor 14 and its drive circuit (not particularly shown), etc.; A cylindrical resin receiving cover that catches splashes and is removably attached to the device.

FIG. 5 is a diagram illustrating how the plate-shaped substrate 4 is attached to the substrate attachment means 13 with respect to rotation. That is, the plate-shaped substrate 4 has a rotation radius l between the rotation axis P and the center Q of the plate-shaped substrate 4, and the wide surfaces 4a and 4b of the plate-shaped substrate 4 are arranged so that the rotation axis P and the plate-shaped It is attached to the substrate attachment means 13 with an inclination θ relative to a line connecting the center Q of the substrate 4. Further, the wide surfaces 4a, 4b of the plate-like substrate 4 and the narrow surfaces 4c, 4d connecting them are shown in FIGS.
As shown in the figure, it is configured to extend in the direction of the rotation axis.

In the conventional case, as shown in Figure 1,
The surface on which the resin film is to be formed extends in a direction perpendicular to the rotation axis.

Next, operations for forming a resin film on the plate-shaped substrate 4 will be described.

The plate-shaped substrate 4 is attached to the substrate attachment means 13 as described above, and the resin film of the plate-shaped substrate 4 is to be formed.
a, 4b, 4c plane (may be formed on 4d plane)
A resin is applied manually or mechanically using a spray, dispenser, etc. (not shown), and as shown in FIG. By rotating the plate substrate 4, necessary resin films can be formed on the surfaces 4a, 4b, and 4c of the plate-shaped substrate 4, respectively. 6th
The figure is a perspective view showing a plate-like substrate 4, in which chamfers R are formed at the corners of the surfaces. By configuring R between the surfaces in this manner, a uniform resin film including the chamfered portions can be formed. The more the chamfer is configured to have a constant curvature than a straight line, the better the resin film can be formed to connect the surfaces.

FIG. 7 is a diagram showing the relationship between the thickness of the resin film, t, and θ when a resin film is formed on the plate-like substrate 4 using the resin film forming apparatus. , the 4b plane is shown as a square, and the 4c side is shown as a black circle.

In this case, the direction of rotation is set as counterclockwise as shown in FIG. This is a case where it is changed.

Here, the shape of the plate-like substrate 4 used is as shown in FIG.
The corner with the b-plane is chamfered with a curvature of 0.2 to 0.5 mm. Further, the conditions of the resin film forming apparatus were that the rotation speed was set to 2000 rpm, the rotation radius l was set to 60 mm, and the resin was a photosensitive resin with a viscosity of 35 cp. As can be seen from Figure 7, when forming a resin film with the same thickness on the 4a and 4c surfaces, θ is 5° or 35° to 50°.
It can be seen that if the thickness is set close to 10° to 20° to form the same thickness on the 4b and 4c surfaces, it is sufficient. In addition, when θ is around 30° to 50°, there is a certain stable state between planes 4a, 4b, and 4c, and if the difference in thickness between planes 4a, 4b, and 4c is allowed, It is also possible to form resin films on these three surfaces at the same time.

Figure 9 shows the plate-shaped substrate 4, the resin is under the same conditions as above, the rotation radius of the resin film forming device is 60 mm, and θ is 45°.
It is a diagram showing the relationship between the rotation speed and the resin film t when the resin film is formed by changing the rotation speed under the following conditions. As can be seen from FIG. 9, the thickness t of the resin film tends to decrease as the rotational speed increases, but it can be seen that a substantially constant thickness can be obtained at approximately 1500 rpm or higher. Note that when the angle θ was set in a counterclockwise direction, resin films could be formed almost satisfactorily on multiple surfaces even when 0°<θ≦60°. As mentioned above, the conditions for forming a resin film and the state of resin film formation have been described. These conditions can be selected to form the required resin film.

In Figure 7, the relationship between the 4b plane and the 4c plane is θ
is less than 40°, the 4b plane is formed thinner, but
As shown in FIG.
Conversely, the 4b surface can be formed thicker by making the angle θ with the surface 4b clockwise. (However, when the direction of rotation of the board mounting means is counterclockwise as shown by the arrow in Figure 5.) At this time, θ is 0° <
A resin film could be formed satisfactorily even when θ≦45°.

As described above, according to this embodiment, the resin film forming surface of the plate-shaped substrate extends in the direction of the rotation axis and the plate-shaped substrate is attached to the substrate mounting means and rotated with a predetermined rotation radius. , it is possible to simultaneously form substantially uniform resin films on multiple surfaces of a plate-shaped substrate.

Although only one plate-shaped substrate is attached in the above embodiment, the substrate attaching means may be configured such that a plurality of substrate holders are provided on the circumference and resin films are formed on a plurality of substrates at the same time. good.

Further, in the embodiment described above, the resin film forming surface of the plate-shaped substrate extends in the vertical direction, but it goes without saying that the substrate mounting means may be arranged horizontally rather than extending in the left-right direction.

Effects of the Invention The resin film forming apparatus of the present invention can be applied even to a substrate having a plurality of discontinuous surfaces, such as a plate-like substrate with a substantially rectangular cross section, at the end surface portion, both side surface portions, and the boundary between each surface. It is possible to form a resin film with a substantially uniform thickness including the edges, and its practical effects are great in fields such as electronic components that require a continuous wiring pattern from the end surface to the side surface.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing the principle of a conventional resin film forming apparatus, FIG. 2 is a partially sectional side view showing an embodiment of the resin film forming apparatus according to the present invention, and FIG. 3 is a side view of the same apparatus. A perspective view showing a board holder and mounting screws for explanation, FIG. 4 is a perspective view of the main part similarly showing the board mounting state, FIG. 5 is a diagram also explaining the board mounting state, and FIG. 6 is a plate-like A perspective view showing a board;
FIG. 7 is a diagram showing the relationship between the angle θ and the thickness t of the resin film, FIG. 8 is a perspective view showing the shape of the plate-like substrate, and FIG. 9 is a diagram showing the relationship between the rotation speed and the resin film thickness. It is a diagram showing the relationship with t. 4... Plate-shaped substrate, 4a, 4b, 4c... Resin film forming surface, 6... Lower rotating table, 7... Substrate holder, 8... Mounting screw, 9... Upper rotating table, 1
0... Connecting rod, 13... Board attachment means, 14...
Rotation drive means, P...rotation axis, l...rotation radius, θ...angle.

Claims (1)

[Claims] 1. A plate-shaped substrate 4 having a substantially rectangular cross section is rotated by a main shaft 10.
board mounting means 13 for fixing the plate-shaped substrate at both ends in the longitudinal direction so that the plate-shaped substrate has a predetermined rotation radius l and the longitudinal direction of the plate-shaped substrate is parallel to the rotation main axis 10;
and a rotation drive means 14 for rotating the substrate mounting means and the plate-shaped substrate fixed to the substrate mounting means at a predetermined rotational speed about a rotational main shaft. 2 When the rotation direction of the board mounting means is set as counterclockwise, the angle θ formed by the line connecting the center of the rotation axis and the center of the plate-shaped substrate and the wide surface forming the resin film of the plate-shaped substrate is set counterclockwise. 2. The resin film forming apparatus according to claim 1, wherein the substrate mounting means is configured to satisfy the relationship 0°<θ≦60°. 3. When the rotation direction of the board mounting means is counterclockwise, the angle θ formed by the line connecting the center of the rotation axis and the center of the plate-shaped substrate and the wide surface forming the resin film of the plate-shaped substrate is set in the clockwise direction. 2. The resin film forming apparatus according to claim 1, wherein the substrate attaching means is configured to satisfy the relationship 0°<θ≦45°.