JPH058070B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a resin film forming method for simultaneously forming a thin, uniform resin film on at least two or more surfaces of a plate-shaped substrate in a semiconductor manufacturing process. .

Conventional Structures and Their Problems In recent years, the development of semiconductor elements and the technological progress of semiconductor manufacturing equipment have been remarkable, and we have entered the era of submicron technology.

The photolithography process is an indispensable process in the process of manufacturing semiconductors.Due to the need to form a uniform and thin film of photosensitive resin, etc. on a substrate in the photolithography process, equipment and methods for forming resin films have been developed. Development is actively underway.

A conventional resin film forming method will be explained below.

FIG. 1 is a diagram showing a method of forming a resin film using a spinner. In FIG. 1, reference numeral 1 denotes a plate-shaped substrate, and a resin film such as a photosensitive resin is formed on the surface 1a. FIG. 2 shows a method of forming a resin film using a spinner.
The plate-like substrate 1 shown in FIG. 2a is attached to a spinner device (not shown) by vacuum suction or the like so that the 1a side faces upward (the 1a side is attached so as to extend perpendicularly to the rotation axis). ), a fluid resin 2 is applied to the surface 1a by spraying or dropping (FIG. 2b). Next, as shown in FIG. 2c, the plate-shaped substrate 1 is rotated in the direction of the arrow by a spinner device to scatter excess resin, thereby forming a uniform resin film on the surface 1a (FIG. 2d). In the method using the spinner device as described above, as shown in FIG.
However, there was a problem in that the film thicknesses were different and the resin film 2a became thicker. Therefore, in the semiconductor process, a photosensitive resin film is formed using the spinner described above.
When trying to form a continuous pattern on the 1a and 1b sides, the thickness will be different in the peripheral and central areas, and when the same exposure is performed, the exposure state will be different and uniform in the central and peripheral areas. It was not possible to form a pattern. Furthermore, it is not possible to form a resin film on the 1a side and the 1b side at the same time, which increases the number of steps and increases production costs.

FIG. 3 shows a conventional method of forming a resin film using a roll coater. In FIG. 3, 3a and 3b are rotating rollers, which form a resin film on the rotating roller 3a and transfer it to the surface 1a of the plate-shaped substrate 1.
It forms a uniform resin film on the surface.

In this method using a roll coater, the state of the resin film on the surface 1a differs in thickness between the center and peripheral parts, as shown in FIG. 2d, similar to the method using the spinner described above. Therefore, it had the same problem as the spinner.

Purpose of the invention The present invention solves the above-mentioned conventional problems.
It is an object of the present invention to provide a resin film forming method capable of forming a uniform resin film within the plane of a plate-shaped substrate and simultaneously forming substantially uniform resin films on a plurality of surfaces of the plate-shaped substrate.

Structure of the Invention The present invention provides a plate-shaped substrate with a predetermined radius of rotation relative to the center of rotation, a resin film forming surface extending in the direction of the rotation axis, and a fluid resin being applied to the resin film forming surface. This is a resin film forming method that can simultaneously form substantially uniform resin films on multiple surfaces of a plate-shaped substrate by coating and rotating the resin film around a rotation axis.

DESCRIPTION OF EMBODIMENTS FIG. 4 is a diagram showing a spinner device used in the resin film forming method of the present invention. In FIG. 4, 4 is a plate-shaped substrate (on which a resin film is formed), and 5 is an auxiliary substrate provided for rotational balance. 6 is a rotary lower table, 7 is a substrate holder for attaching the plate-shaped substrate and the auxiliary substrate, and 8 is a mounting for preventing the plate-shaped substrate 4 and the auxiliary substrate 5 from flying out from the substrate holder 7 when rotational force is applied. A screw, 9 is an upper rotary table, and 10 is a connecting rod that connects the lower rotary table and the upper rotary table.

As shown in FIG. 5, the substrate holder 7 is provided with a recess 7a into which the plate-like substrate 4 and the auxiliary substrate 5 are inserted, and is attached to the lower rotary table 6 and the upper rotary table 9 through flange portions 7b, respectively. Mounting screw 8
A flange portion 8a is provided to prevent the plate-like substrate 4 and the auxiliary substrate 5 from popping out due to rotational force. The upper rotary table 9 is integrally connected to the lower rotary table 6 by a connecting rod 10, and the substrate holder 7 is provided at a position corresponding to the mounting position of the substrate holder 7 on the lower rotary table 6. As described above, the substrate fixtures 7 are arranged on the upper rotary table 9 and the lower rotary table 6, respectively, and are configured to hold the upper and lower ends of the plate-shaped substrate, as shown in FIG.

The end 10a of the connecting rod 10 is rotatably attached to the support plate 11.
is held via a bearing 12. As described above, the lower rotary table 6, the upper rotary table 9, the connecting body 10, the support plate 11, the substrate holding member 7, and the mounting screws 8 constitute the substrate mounting means 13.

FIG. 6 is a diagram showing a state in which the plate-shaped substrate 4 is attached to the substrate attachment means 13, and shows the resin film forming surface 4 of the plate-shaped substrate 4.
It is shown that a, 4b, and 4c are attached with a predetermined radius relative to the rotation center and extending in the direction of the rotation axis. The lower rotary table 6 is screwed to and continuous with a motor shaft 14a of a motor 14, which is a rotational drive means. The motor 14 drives the substrate mounting means 13 to rotate the plate-shaped substrate 4 about the rotation axis with a predetermined rotation radius.
Reference numeral 15 denotes a base on which the motor 14 is mounted and a support plate 1.
A supporting shaft 16 is attached to the substrate mounting means 13 to indirectly rotatably hold the board mounting means 13.

The plate-shaped substrate 4 has a resin film formed on each of the surfaces 4a, 4b, and 4c, but the film thickness is made uniform within the surface, and the resin film is formed on the corners of the 4a surface and 4c surface, and the corners of the 4c surface and 4b surface. In order to form a uniform film thickness also at the corners, it is configured to have a curvature of radius R. The opposite corners are also rounded (as shown in FIG. 7). FIG. 8 is a plan view showing a method of attaching the plate-shaped substrate 4 to the substrate attaching means 13 against rotation. The plate-shaped substrate 4 has a rotation radius l between the rotation center P and the center Q of the plate-shaped substrate, and further has a wide surface 4 of the plate-shaped substrate 4.
a and 4b have an inclination θ (clockwise direction is +θ and counterclockwise direction is indicated as −θ) with respect to the line connecting the rotation axis P and the center of the plate-shaped substrate 4, and the board mounting means 13 It is installed on. Further, the resin film forming surfaces 4a, 4b, and 4c of the plate-shaped substrate 4 are configured to extend in the direction of the rotation axis as shown in FIG.
In the conventional method, as shown in FIG. 1, the resin film forming surface 1a of the substrate 1 is configured to extend in a direction perpendicular to the rotation axis.

The procedure for the coating method of the present invention will be explained using the spinner device configured as described above.

The plate-shaped substrate 4 is attached to the substrate mounting means 13 so as to have a predetermined rotation radius l with respect to the center of rotation as described above and a mounting angle θ, and the resin film forming surface 4a,
It is attached so that the surfaces 4b, 4c and 4d extend in the direction of the rotational axis (as shown in FIGS. 9a and 4).

Next, resin A having fluidity is applied to the resin film forming surface 4a, 4b, 4c, or 4d. As for the method of application, it may be applied manually using a syringe or the like, or it may be applied automatically using a spray or the like. In this case, if the coating is applied so as to cover at least the entire surface of the resin film formation surface on which the resin film is to be formed, such as the formation surface 4a, 4b, 4c or 4d, the variation in the thickness of the resin film on the formation surface can be reduced. can do. It is shown in FIG. 9b.

Next, the motor 14 is rotated to rotate the substrate mounting means in the direction of the arrow in FIG. can be formed simultaneously.

As shown in FIG. 7, chamfers R are formed at the corners of the surfaces of the plate-like substrate 4, but the more the chamfers are formed with curves (having a certain curvature) than with straight lines, the more the curvature surface A resin film can be formed so as to connect surfaces well, including surfaces.

A resin film is formed as described above, and an example thereof will be shown below.

As shown in FIG. 10, the plate-shaped substrate 4 has a width W of 16
mm, length L is 140 mm, thickness T is 3 mm, angle R between surfaces is 0.2 to 0.5 mm, and spinner rotation speed r is
2000 rpm, rotation radius l is 60 mm, viscosity of photosensitive resin
The results of resin film formation when the mounting angle θ was varied at 35 cp and the environmental temperature was 25 degrees ± 3 degrees are shown in FIG. 11 as a diagram of the mounting angle θ and the film thickness t. As can be seen from this result, the 4a plane and 4c plane θ are around -5°, -35°
When setting around ~50° or around +10° and forming a film with the same thickness on the 4b and 4c sides, -
It turns out that it is best to set it around 10° to -20°.

Also, when θ is around -30° to -50°, 4a, 4
There is a certain stable state between planes b and 4c, and 4
If a difference in thickness is allowed between the a and 4b surfaces and the 4c surface, the resin film can be formed on these three surfaces at the same time. In addition, for Toki with the mounting angle θ counterclockwise (Fig. 8 - θ direction), even if 0°<θ≦60°, when the mounting angle is set clockwise (Fig. 8 + θ direction).
(direction), it was possible to form a resin film almost satisfactorily on multiple surfaces even when 0°<θ≦45°.

Figure 12 shows the state of resin film formation when the plate-shaped substrate 4 is used, the resin A conditions are the same as in Figure 10, the mounting angle θ is -45°, and the spinner rotational speed r is varied. It is a line diagram shown as a relationship with.
This result shows that the film thickness tends to become thinner as the rotational speed r increases, but the slope becomes smaller at approximately 1500 rpm or higher, indicating that the film thickness can be formed stably.

As mentioned above, the resin film formation conditions and the resin film formation state have been described, but the resin film formation conditions include the resin film formation conditions, rotation speed r, rotation radius l, mounting angle θ,
Alternatively, it can be changed depending on the resin material, resin viscosity, etc., and by selecting these conditions, a necessary resin film can be formed as desired.

Furthermore, using the resin film forming method as described above, the plate-shaped substrate 4 shown in FIG. Surfaces with R of 0.2 to 0.5 mm, 4a, 4b, 4
A conductive metal B (Au, Cu, Cr), etc. is deposited on the surfaces c and 4d, and a photosensitive resin film (photoresist) is formed on the surface by the above method, and exposed and etched to form the pattern shown in Fig. 13. As in, 4a or 4b
It was confirmed that it was possible to form a continuous pattern on the 4c plane and the 4c plane. However, the width of the conductor metal pattern was 105 μm, and the width between the conductor metals was 20 μm. By using the resin film forming method as described above,
The thickness of the resin film within the plane of the plate-like substrate can be made substantially uniform, and the resin film can be simultaneously formed on multiple faces of the plate-like substrate.

Effects of the Invention In the resin film forming method of the present invention, the plate-like substrate has a predetermined radius of rotation with respect to the rotation center, and the resin film forming surface extends in the direction of the rotation axis so that the rotation axis is centered. It is possible to form a resin film on two or more surfaces at the same time by rotating it, and it is also possible to form a continuous resin film on multiple surfaces almost uniformly, and it is possible to form a continuous pattern on multiple surfaces. It also makes it possible to form a carbonaceous substance, and its industrial effects are great.

[Brief explanation of drawings]

Fig. 1 is a perspective view showing a conventional method for forming a resin film using a spinner, Fig. 2 is a perspective view showing a procedure for forming a resin film using a spinner, and Fig. 3 is a perspective view showing a method for forming a resin film using a conventional roll coater. 4 is a side view showing a spinner device used in the resin film forming method of the present invention, FIG. 5 is a perspective view showing a substrate holding member and mounting screw of the same device, and FIG. 6 is a substrate holding member of the same device. FIG. 7 is a partial perspective view of the plate-like substrate, and FIG. 8 is a plan view showing the attachment relationship between the plate-like substrate and the spinner device in the device. Fig. 9 is a diagram showing the resin film forming procedure, Fig. 10 is a perspective view of the same plate-like substrate, and Fig. 11 is a characteristic diagram showing the relationship between the mounting angle θ of the plate-like substrate to the spinner and the resin film forming thickness. , FIG. 12 is a characteristic diagram showing the relationship between the rotation speed and the resin film formation thickness, and FIG. 13 is a partial perspective view showing a conductive pattern formed on a plate-like substrate using the resin film forming method of the present invention. be. 1, 4...Plate substrate, 1a, 4a, 4b, 4c
... Resin film forming surface, 13 ... Board attachment means, 14
... Motor, θ ... Board mounting angle, P ... Center of rotation, l ... Radius of rotation, A ... Resin, r ... Rotation speed, B ... Conductor metal.

Claims (1)

[Scope of Claims] 1. The plate-like substrate has a predetermined radius of rotation with respect to the rotation center of the substrate attachment means, and the plate-like substrate is attached to the substrate attachment means so that its resin film-formed surface is in the direction of the rotation axis of the substrate attachment means. A fluid resin is applied to the resin film forming surface of the plate-shaped substrate, and the substrate attachment means is rotationally driven by a driving means, so that the plate-shaped substrate is attached to the attachment means together with the attachment means. A method for forming a resin film, comprising rotating the plate-shaped substrate around a rotation axis to form a resin film on two or more surfaces of the plate-shaped substrate. 2. The mounting angle θ is given so that the wide surface of the resin film forming surface of the plate-shaped substrate is at an angle with respect to the line connecting the center of the cross-section in the direction perpendicular to the rotation axis of the plate-shaped substrate and the rotation center. 2. The resin film forming method according to claim 1, wherein the shaped substrate is attached to substrate attachment means. 3. The resin film forming method according to claim 1 or 2, characterized in that a resin having fluidity is applied so as to cover at least the entire surface of the resin film forming surface on which the resin film is to be formed. 4 When the rotation direction of the board mounting means is counterclockwise, the mounting angle θ is counterclockwise and 0°<θ≦60°
A resin film forming method according to claim 2, characterized in that: 5. The resin film forming method according to claim 2, wherein the mounting angle θ is clockwise when the rotation direction of the substrate mounting means is counterclockwise and satisfies 0°<θ≦45°.