JPH0315835B2 - - Google Patents

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention involves dropping electrical parts (hereinafter referred to as chip parts) without lead wires, such as resistors and capacitors, through a guide pipe to form printed circuit boards. This invention relates to a chip component mounting device for mounting a chip component in a predetermined position, and more particularly to a chip component mounting device that allows the chip component to fall without becoming stagnant in a guide pipe.

[Prior art]

The chip component mounting device is equipped with a plurality of chip component storage containers connected to guide pipes, and the chip components from each storage container are dropped into the respective guide pipes and installed at predetermined positions on the printed circuit board. Such a method is publicly known. In this case, static electricity may be generated due to friction with the pipe due to the chip component falling, or the chip component may not fall smoothly through the pipe due to minute particles clogging the pipe.

Therefore, in order to eliminate the above-mentioned drawbacks, the present applicant invented a chip component mounting device as shown in FIGS. 5 and 6, and disclosed it in Japanese Patent Application No. 176,852/1983.

FIG. 5 shows the overall structure of the chip component mounting device disclosed in the above-mentioned Japanese Patent Application No. 55-176852. In Fig. 5, reference numeral 1 denotes a plurality of hoppers arranged above this device, and this hopper 1 stores a large number of chip parts C having electrodes Cb at both ends as shown in Fig. 6, and prints them. They are prepared according to the number of chip parts that can be attached to the board.

Reference numeral 2 denotes a hopper stand located above this device to which the hopper 1 is attached; 3 a support member for fixing a positioning plate 4, which will be described later, to the hopper stand 2; 5 a hollow guide pipe made of plastic; It is formed to connect the hopper stand 2 and the alignment plate 4, and the chip parts C sent out from the hopper 1 pass through this guide pipe 5 and fall to the alignment plate 4 side.

Reference numeral 6 indicates a support member for fixing the hopper stand 2 to the base stand 7, 8 a movable feed belt, 9 a stand member placed on the feed belt 8, and 10 a lower side placed on the stand member 9. plate, 11 is the lower plate 1
Similarly to the alignment plate 4, the upper plate 11 and the lower plate 10 are provided with holes 11a and 11a, respectively, at positions that match the mounting positions of the chip components mounted on the printed circuit board.
10a, and an upper plate 11
is formed of a plate thicker than the lower plate 10 and can be moved from above the lower plate 10. 12 is a power source for moving the lower plate 10, the upper plate 11, and the base member 9 toward the alignment plate 4 side.

Furthermore, a forced feeding device is provided to allow the chip C to fall smoothly within the guide pipe 5 without becoming stagnant. This forced feeding device is attached to the upper part of each guide pipe 5, and includes a detection means 100 such as a photointerrupter for detecting that the chip component C has passed through the guide pipe 5, a control circuit 102, a solenoid valve 103, and the solenoid valve 103. It consists of a compressor 107 connected to a valve and an auxiliary pipe 5' connected from the solenoid valve 103 to each guide pipe 5. When the chip part C passes inside the pipe, a signal is sent to the control circuit by the detection means 100,
Then, this signal causes the solenoid valve 103 to operate and open the valve. Compressed air is sent from the compressor 107 to the solenoid valve 103, and when the valve opens, the compressed air is sent into the guide pipe through the auxiliary pipe 5', forcing the chip part C to fall downward. It's summery.

Next, with reference to FIG. 7, the process up to attaching the chip component C that has fallen through the guide pipe to the printed circuit board will be explained.

First, the base member 9, the lower plate 10, and the upper plate 11 are placed one on top of the other, and as shown in FIG. . Next, when the chip part C falls, the power source 12 is returned to its original position, the upper plate 11, the lower plate 10, and the base member 9 are placed on the feed belt 8, and the feed belt 8 is moved to give vibration. The chip part C is laid down sideways using the hole 11a of the upper plate 11 and the hole 10a of the lower plate 10 as guides, and after the chip part C is laid down sideways, the upper plate 11 is removed from the lower plate 10.

Then, as shown in FIG. 7B, the chip part C is positioned by the hole 10a of the lower plate 10, and
A portion of the lower plate 10 of the thin plate 10 is now in a state of protruding from the upper surface, and on top of this state, adhesive S is applied in advance to the position where the chip part C will be attached.
When the printed circuit boards P coated with the above are stacked together, the chip components C are transferred onto the printed circuit board P by the adhesive S, and by immersing this printed circuit board in a solder bath, the chip components C can be attached to the printed circuit board P. is completed.

However, in this conventional example, the forced feeding device for chip parts used as a means to eliminate stagnation of chip parts in the guide pipe 5 required the provision of a detection means 100 and an auxiliary pipe 5' for each guide pipe. The disadvantage is that the device becomes complicated and the device for mounting the chip parts itself becomes expensive.

[Purpose of the invention]

The object of the present invention is to eliminate the above-mentioned drawbacks and to eliminate stagnation when chip parts are dropped with a simple structure without making the device unnecessarily complicated.

[Structure of the invention]

In order to achieve the above object, the present invention provides a positioning plate in which a guide pipe is connected to a hole for determining a dropping position of a chip component corresponding to a mounting position of the chip component on a printed circuit board, and a positioning plate that is movable and is used to drop the dropped chip. The base member is provided with a base member forming a holder for the component, and a chip guide plate fixed to the base member and forming a guide hole corresponding to the hole of the alignment plate, and the base member moves to connect with the alignment plate. When overlapping, make sure that the guide holes match the holes on the alignment plate,
A gap narrower than the diameter of the chip component is provided between the chip guide plate and the pedestal, and air in the plurality of guide pipes is commonly sucked through the gap as the chip component falls. and then
Eliminated stagnation of chip parts in the guide pipe.

[Embodiments of the invention]

1 and 2 show embodiments of the present invention, and FIG.
FIG. 4 shows how a chip component is attached to a printed circuit board using the chip component attaching apparatus of the present invention.

First, in FIG. 1, reference numeral 1 denotes a hopper for storing chip parts C, and the hopper 1 is mounted on a hopper stand 2, similar to the conventional example shown in FIG. Reference numeral 4 denotes an alignment plate, and a plurality of guide pipes 5 are connected between the alignment plate 4 and the hopper 1. Reference numeral 21 denotes a stand member that receives the chip parts that have fallen through the guide pipe 5. Although this stand member is not shown, it is connected to the same power source 12 and feed belt 8 as shown in FIGS. 5 and 6. This makes it possible to move and vibrate.

As shown in FIG. 2, this base member 21 is provided with an air inlet 21a on one side and a groove 21b connected to the inlet 21a, and the inner side of the groove is higher than the height of the outer peripheral wall 21c. A slightly lowered receiving portion 21d for the chip component is formed. The dimensional difference t between the height of the outer peripheral wall 21c and the height of the receiving portion 21d is set to a value slightly smaller than the diameter of the chip component.
(See FIG. 1) Although the suction port 21a of the base member 21 is not shown, it is connected to a vacuum pump through a pipe or the like.

Reference numeral 22 designates a chip guide plate which is thicker than the length of the chip component and is fixed on the base member 21, and this plate 22 has a guide plate 22 where the chip component is dropped (i.e., the guide pipe 5 is connected to the alignment plate 4). A hole 22a is provided with a width sufficient to allow the chip component C to fall sideways. One inner surface of this hole is made to coincide with the inner surface of the guide pipe 5. When the chip guide plate 22 configured in this manner is placed on the outer circumferential wall 21c of the base member 21, a gap having the above-mentioned dimension t is created between the plate 22 and the pedestal 21d of the base member 21. There is. At this time, the tip guide plate 21 and the outer peripheral wall 21c are fixed to each other while maintaining airtightness.

The manner in which a chip component is attached to a predetermined position on a printed circuit board using the chip component attaching apparatus of the present invention constructed as described above will be described below with reference to FIGS. 1 to 4.

First, the base member 21 on which the chip guide plate 21 is fixed is lifted by a power source (not shown) and placed on the alignment plate 4 from below. In this state, the hole 22a of the tip guide plate 22 matches the position of the guide pipe connected to the alignment plate 4. Next, a known chip component feeding mechanism (not shown) provided in the hopper 1 (for example,
55-176852), the chip parts C in the hopper 1 are delivered to the guide pipe 5. At this time, air in the groove 21b of the base member is first sucked by a vacuum pump (not shown). Then, since a large gap is also provided between the pedestal 21d inside the groove 21b and the tip guide plate 22, the air inside the plurality of guide pipes 5 is transferred to the hole 22.
a, the gap t, and the groove 21b, and are simultaneously sucked into an external vacuum pump. Since the groove 21b is provided around the pedestal 21d, the suction force of the air in each guide pipe 5 is averaged. This suction of air allows the chip part C to fall without becoming stagnant within the guide pipe 5. When the chip component C falls, a power source (not shown) operates, and when the base member 21 is similarly placed on a feed belt (not shown) and vibrates by moving the feed belt, the component C falls into the hole 22a of the chip guide plate 22. It will fall on its side.

Next, as shown in FIG. 3, a vacuum chuck probe 23 prepared corresponding to the position of the hole 22a of the chip guide plate is inserted into the hole 22a of the chip guide plate, and the chip component C in the hole 22a is inserted. Then, as shown in FIG. 4, the chip parts are placed on the applied adhesive S on the printed circuit board P to which the chip parts are attached and temporarily fixed. As a result, the chip components are transferred onto the printed circuit board P, and by immersing the printed circuit board P in a known solder bath or the like, the attachment of the chip components C to the printed circuit board P is completed.

〔Effect of the invention〕

As described above, according to the present invention, a gap is provided between the pedestal of the base member for receiving the chip component falling in the guide pipe and the guide plate of the chip component, and a plurality of guides are guided through the gap. Since the air in the pipes is sucked at the same time, the air in each guide pipe can be sucked with a simple configuration. In addition, since a groove is provided around the pedestal, air can be sucked in from all around the hole 22a, so air resistance can be lowered, and the suction force of the air in the multiple guide pipes is averaged, allowing the chip to The parts can be dropped without becoming stagnant in the guide pipe. Although the present invention has been explained using a cylindrical chip part as shown in FIG. 6, it goes without saying that the same effect can be achieved even when applied to a prismatic chip part.

[Brief explanation of the drawing]

1 and 2 are explanatory diagrams of the main parts of the chip component mounting device of the present invention, FIGS. 3 and 4 are explanatory diagrams of the mounting of chip components by the chip component mounting device of the present invention, and FIG. 7 shows a conventional chip component mounting device, and FIG. 6 shows the shape of a typical chip component. 1... Hopper, 4... Positioning plate, 5... Guide pipe, 8... Feeding belt, 9... Base member, 12
...Power source, 21...Base member, 21a...Air inlet, 21b...Groove, 21d...Band, 22...
Tip guide plate, 22a...Guide hole, t
...Gap, C...Chip parts, P...Printed circuit board, S...Adhesive.

Claims (1)

[Claims] 1 Chip parts stored in a plurality of hoppers are dropped through a guide pipe whose one end is connected to the hopper, and the dropped chip parts are attached to a predetermined position on a printed circuit board. The chip component mounting device includes: a base member forming a pedestal for receiving the dropped chip component; and a guide hole fixed to the base member and communicating with the guide pipe and guiding the chip component that has fallen onto the pedestal. a chip guide plate having a chip formed therein, a gap narrower than the thickness of the chip component is provided between the chip guide plate and the pedestal, and as the chip component falls through the gap, A chip component mounting device characterized in that air in the plurality of guide pipes is commonly sucked. 2. The chip component mounting device according to claim 1, wherein a groove is formed around the entire periphery of the pedestal of the pedestal member.