JPH0770860B2 - Method and apparatus for mounting chip-shaped electronic component - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a method and an apparatus for mounting chip-shaped electronic components housed in bulk at a predetermined position on a circuit board.

[Prior Art] Conventionally, when a chip-shaped electronic component is mounted at a predetermined position on a circuit board, it has been carried out in the following manner by an apparatus as shown in FIG. That is, the chip-shaped electronic components housed in bulk in the plurality of containers 1 are taken out one by one into the pipe-shaped chutes 21 and sent to the housing recess 61 of the template 6 to be received therein. The storage recess 61 is positioned in accordance with the position where each chip-shaped electronic component is mounted on the circuit board 9, and the suction unit 8 holds the chip-shaped electronic component in the circuit board 9 while keeping the position where the chip-shaped electronic component is mounted. Move to and arrange. As a result, the chip-shaped electronic components are mounted on the circuit board 9 at predetermined positions. In FIG. 2, reference numeral 7 denotes a conveyer for carrying the circuit board 8.

An adhesive is applied to the circuit board at the position where the chip-shaped electronic component is to be mounted, and the soldering step is performed in a state where the mounted electronic component is temporarily fixed with this adhesive.

FIGS. 5 and 6 show the chute 21 in the conventional device.
The connection part with the template 6 at the end of is shown. Shoot 21
Is connected to the joint 23 planted in the pattern base 3 in accordance with the position of the storage recess 61 of the template 6. Thereby, when the template 6 is inserted under the pattern base 3, the through hole end communicating with the chute 21 is located on the upper surface of the storage recess 61. At this time, the vacuum case 4 is placed under the template 6 and the vacuum chamber
41 is connected to the storage recess 61 through a through hole 62 formed in the bottom of the storage recess 61. The vacuum case 4 is connected to a pneumatic unit (not shown in FIGS. 5 and 6),
Air flows through the chute 21 from the container to the storage recess 61.

In this apparatus, the chip-shaped electronic component a conveyed by the chute 21 is forcibly conveyed by the air sucked from the vacuum case 4 and received in the storage recess 61 as shown in FIG. After that, the chip-shaped electronic component a received in the storage recess 61 in a standing state is laid down by the flow of the air, and is directed in a predetermined direction.

[Problems to be Solved by the Invention] The miniaturization of chip-shaped electronic components has been advancing year by year, and the thickness of each part constituting the chip-shaped electronic components has become thinner and thinner. As a result, in order to ensure the transport using the pipe-shaped chute 21, it is indispensable to use the forced transport means using air as described above.

However, when the above-mentioned air conveying means is used, the chip-shaped electronic component a moves through the chute 21 at a high speed and then hits the bottom of the storage recess 61 of the template 6,
It is received in the recess 61. At this time, the chip-shaped electronic component a
The impact on the chip-shaped electronic component a is often large, and the chip-shaped electronic component a is often damaged.

It is an object of the present invention to prevent the chip-shaped electronic component a from being damaged by an impact while allowing the chip-shaped electronic component a to be forcibly transported by gas.

[Means for Solving the Problems] That is, in order to achieve the above-mentioned object, a method for mounting a chip-shaped electronic component according to the present invention is such that the chip-shaped electronic component a is transferred from the container 1 in a bulk shape to the chip-shaped electronic component a. The electronic components a are sent one by one to the pipe-shaped chute 21 of the guide means 2 and are forcibly transported by the flowing gas, and the electronic components a of the same chip are positioned on the template 6 corresponding to the mounting position on the circuit board 9. Stored in the stored recess 61, and the chip-shaped electronic component a received in the stored recess 61.
Is moved to the circuit board 9 while being placed in the received position, and the chip-shaped electronic component a is mounted on the circuit board 9.
In mounting the chip-shaped electronic component a onto the pipe-shaped chute 21, the moving gas of the electronic component forcible transportation is sucked from the side surface of the portion near the end of the pipe-shaped chute 21 to temporarily stop or slow down the movement of the chip-shaped electronic component a. After that, the suction is stopped and the chip-shaped electronic component a is naturally dropped into the storage recess 61.

Further, the chip-shaped electronic component mounting device adopted in the present invention is configured such that the container 1 in which the chip-shaped electronic components a are stored in a bulk shape and the storage positioned according to the mounting position of the chip-shaped electronic components a on the circuit board 9. The template 6 having the concave portion 61, the guide means 2 having the pipe-shaped chute 21 for separately supplying the chip-shaped electronic components a from the storing means to the storing concave portion 61 of the template 6, and the chute of the guiding means 2. A gas flow means for flowing a gas from the container 1 to the template 6 side in 21 and a chip-shaped electronic component a stored in the storage recess 61 of the template 6
Is arranged on the side surface of the portion close to the end of the pipe-shaped chute 21 through the opening 25a that prevents the chip-shaped electronic component a from passing through. The gas suction passage 26 is connected, and the suction passage 26 is provided with a valve 12 for sucking and stopping the flowing gas.

[Operation] According to the chip-shaped electronic component mounting method, the chute is
Before the chip-shaped electronic component a conveyed through the 21 is received in the storage recess 61 of the template 6, it is temporarily stopped or decelerated before that, and then suction is stopped and the last very short section is naturally dropped. The speed at which it is received in the storage recess 61 is reduced, and therefore the impact is also reduced, and damage to the chip-shaped electronic component a is prevented.

Furthermore, according to the chip-shaped electronic component mounting device,
By starting or stopping the suction of the circulating gas from the suction passage 26 by the valve 12, the chip-shaped electronic component a can be transported and stopped, and the stop can be released.

[Examples] Next, examples of the present invention will be described in detail with reference to the drawings.

As shown in FIG. 1, the guiding means 2 is connected to the accommodating means including the container 1 in which the chip-shaped electronic components a are accommodated in a bulk shape. This guide means 2 is a pipe-shaped chute 21.
And an escapement 22 for feeding the chip-shaped electronic components a one by one.

The upper end of the chute 21 is inserted into the lower part of the container 1, and the chip-shaped electronic components a in the container 1 are fed into the chute 21 in a line and temporarily stopped by the escapement 22. This escape surface and 22 are solenoid 24
The chip-shaped electronic component a is dropped one by one each time it is driven.

The lower end of the chute 21 is connected to the pattern base 3 via the joint 23.
It is connected to the. In addition, a pipe-shaped suction path is provided through a joint 25 provided on the side surface of the portion near the lower end of the chute 21.
26 is connected. The opening 25a of the joint 25, which serves as the starting point of the suction passage 26, opens on the side surface of the chute 21 and has a size that does not allow the chip-shaped electronic component a to pass through. Further, even when the wide opening 25a is formed, a screen or the like can be stretched there to prevent the chip-shaped electronic component a from passing through.

As described above, the template 6 having the accommodating recess 61 provided at the mounting position of the chip-shaped electronic component a on the circuit board is inserted under the pattern base 3 and connected to the joint 23 at this time. The end of the through hole that communicates with the chute 21 is disposed in each storage recess 61 of the template 6.

Furthermore, when the template 6 is inserted under the pattern base 3, the vacuum case 4 is applied below it,
The vacuum chamber 41 is connected to the storage recess 61 through a through hole 62 formed in the bottom of the storage recess 61. The lower end of the chute 21 connected to the upper part of the storage recess 61 and the through hole are provided so as to be displaced in the longitudinal direction of the storage recess 61, and the bottom surface of the storage recess 61 is from the former side to the latter side. It is inclined so that it gradually becomes lower as it goes.

The suction passage 26 and the vacuum case 4 connected to the chute 21 are connected to the pneumatic unit 11, respectively, and the flow path from the chute 21 to the pneumatic unit 11 via the storage recess 61 and the vacuum chamber 41 and the storage unit. A flow path is formed from the chute 21 to the pneumatic unit 11 via the suction passage 26 without passing through the recess 61. The valves 12 and 13 respectively provided in the flow paths leading to the pneumatic unit 11 are opened and closed by the controller 14 in conjunction with the solenoid 24 that drives the escapement 22.

In this apparatus, the chip-shaped electronic component a supplied from the container 1 through the chute 21 is temporarily stopped by the escapement 22, and every time the solenoid 24 drives the chip-shaped electronic component a, one chip-shaped electronic component a is dropped. At this time, the valve
13 is closed, the valve 12 is open, and air flows in the flow path from the chute 21 through the suction path 26 to the pneumatic unit 11, whereby the chip-shaped electronic component a is forcibly transported in the chute 21. , As shown in FIG. 1, it temporarily stops at the opening 25a. After that, since the valve 12 is closed and the air flow is stopped, the chip-shaped electronic component a is
It naturally falls from the location 25a and is received in the storage recess 61 of the template 6 as shown in FIG. Then valve 13
Opens, and air circulates in a flow path from the chute 21 to the pneumatic unit 11 through the storage recess 61 and the vacuum chamber 41. As a result, the chip-shaped electronic component a falls down as shown in FIG.

After that, as shown in FIG. 2, the template 6 moves to the circuit board 9 side, and the suction unit 8 moves and distributes the chip-shaped electronic component a housed in the housing recess 61 to the circuit board 9 at the same position. Set up. Thereafter, by repeating this operation, the chip-shaped electronic components a are sequentially mounted at predetermined positions on the circuit board 9.

[Effects of the Invention] As described above, according to the present invention, when the chip-shaped electronic component a is forcibly conveyed by the flowing gas using the tube-shaped guiding means, the chip-shaped electronic component is stored in the storage recess 61 of the template 6. Stop a just before the storage recess 61,
Since it is naturally dropped in a very short section from there, it is possible to greatly reduce the speed at the time of receiving the chip-shaped electronic component a as compared with the conventional case. Therefore, it is possible to reduce damage to the chip-shaped electronic component.

[Brief description of drawings]

FIG. 1 is a sectional view of a main part showing an embodiment of the present invention, a pneumatic piping and control system diagram, FIG. 2 is an overall perspective view of an apparatus showing a conventional example, and FIGS. FIG. 5 and FIG. 6 are cross-sectional views of a main part showing an embodiment, and FIGS. 1 ... container, 2 ... guide means, 6 ... template, 9
...... Circuit board, 12 …… Valve, 21 …… Chute of guide means, 25a …… Aperture, 26 …… Suction path, 61 …… Template storage recess, a …… Chip-shaped electronic component

Continuation of the front page (56) References JP-A-61-100995 (JP, A) JP-A-56-66100 (JP, A) JP-A-63-47220 (JP, A)

Claims (2)

[Claims] 1. A container (1) accommodating a chip-shaped electronic component (a) in a bulk shape, one by one into the pipe-shaped chute (21) of a guide means (2). The storage recessed part (61), which is sent out and forcibly conveyed by the flowing gas, has the chip electronic component (a) positioned on the template (6) corresponding to the mounting position on the circuit board (9).
The chip-shaped electronic component (a) that has been received in the storage recess (61) is moved to the circuit board (9) at the position where it is received and disposed, and the chip-shaped electronic component is disposed. In the method of mounting a chip-shaped electronic component in which (a) is mounted on a circuit board (9), a flowing gas for forcibly transporting an electronic component is sucked from a side surface of a portion near the end of the pipe-shaped chute (21). A chip characterized by temporarily stopping or decelerating the movement of the chip-shaped electronic component (a) during transportation, and then stopping the suction to spontaneously drop the chip-shaped electronic component (a) into the storage recess (61). Method for mounting electronic components. 2. A container (1) in which a chip-shaped electronic component (a) is stored in a bulk shape, and a storage recess () which is positioned in accordance with the mounting position of the chip-shaped electronic component (a) on a circuit board (9). (6) having a template (6), and a guide means (21) having a pipe-shaped chute (21) for separately supplying the chip-shaped electronic components (a) from the storage means to the storage recess 61 of the template (6). 2) and this guide means (2)
Gas flow means for circulating gas from the container (1) to the template (6) side in the chute (21), and the chip-shaped electronic component (a) housed in the housing recess (61) of the template (6). ) Is moved to a circuit board (9) and arranged, and a chip-shaped electronic component (a) is provided on a side surface of a portion near the end of the pipe-shaped chute (21). A passage (26) for the circulating gas is connected through an opening 25 (a) which prevents the passage of the gas, and a valve (12) for sucking and stopping the circulating gas is provided in the suction passage (26). A chip-shaped electronic component mounting device characterized by the above.