JPS61100995A - Chip part mounting apparatus - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention involves dropping electrical components (hereinafter referred to as chip components) without lead wires into a printed circuit board, such as resistors and capacitors, through a guide pipe. The present invention relates to a chip component mounting device for mounting a chip component in a predetermined position, and more particularly to a chip component mounting device that allows the chip component to fall without becoming stagnant in a guide pipe.

[Prior art]

The chip component mounting device is equipped with a plurality of chip component storage containers connected to guide pipes, and the chip components from each storage container are dropped into the respective guide pipes and installed at predetermined positions on the printed circuit board. Such a method is publicly known. In this case, static electricity may be generated due to friction with the pipe due to the chip component falling, or the chip component may not fall smoothly through the pipe due to clogging of minute particles in the pipe.

Therefore, in order to eliminate the above-mentioned drawbacks, the present applicant has invented a chip component mounting device as shown in FIGS. 5 and 6,
It was disclosed in Japanese Patent Application No. 55-176852.

FIG. 5 shows the overall structure of the chip component mounting device disclosed in the above-mentioned Japanese Patent Application No. 55-176852. In Figure 5, 1
is a plurality of hoppers arranged above this device, and this hopper 1 stores a large number of chip components C having electrodes Cd at both ends as shown in FIG. 6, and the chips are mounted on a printed circuit board. Prepared according to the number of parts.

Reference numeral 2 is a hopper located above this device and to which the hopper 1 is attached; 3 is a support member that fixes a positioning plate 4 to be described later to the hopper 2; 5 is a hollow guide pipe made of plastic; The pipe is formed to connect one hopper 2 and the alignment plate 4, so that the chip parts C sent out from the hopper 1 pass through this guide pipe 5 and fall to the alignment plate 4 side. ing.

6 is a support member for fixing one hopper 2 to the pace table 7;
9 is a movable feed belt, 9 is a base member placed on the feed belt 8, 10 is a lower plate placed on the base member 9, and 11 is an upper plate placed on the lower plate 10. Similarly to the alignment plate 4, the upper plate 11 and the lower plate 10 are provided with holes 11a and 1 at positions that match the mounting positions of chip components to be mounted on the printed circuit board.
0a is provided, and the upper plate 11 is formed of a thicker plate than the lower grate 10 so that it can be moved from above the lower plate 10. 12 is a power source for moving the lower plate 10, the upper plate 11, and the base member 9 toward the alignment plate 4 side.

Furthermore, a forced feeding device is provided for smoothly dropping the chip component C within the guide pipe 5 without stagnation. This forced feeding device is connected to each guide pipe 5.
A detection means 100, such as a photointerrupter, which is attached to the upper part and detects that the chip component C has passed through the guide pipe 5, a control circuit 102, a solenoid valve 103, a compressor 107 that is not connected to the solenoid valve, and a solenoid valve 103
Auxiliary pipes 5' connected to each guide pipe 5! : When the chip component C passes through the pipe, the detection means 100 sends a signal to the control circuit, and this signal then activates the electromagnetic valve 103 to open the valve. Compressed air is sent from a compressor 107 to the solenoid valve 103, and when the valve opens, the compressed air is sent into the guide pipe through the auxiliary pipe 5, forcing the chip component C to fall downward. ing.

Next, with reference to FIG. 7, the process up to attaching the chip component C that has fallen through the guide pipe to the printed circuit board will be explained.

First, the base member 9, the lower plate 10 and the upper plate 1
1 are stacked on top of each other, and as shown in FIG. 6(2), they are lifted by the power source 12 and stacked on the alignment plate 4, and the chip components are waited for to fall. Next, when the chip component C falls, the power source 12 is returned to its original position, and the upper plate 1
1. When the lower plate 10 and the base member 9 are placed on the feed belt 8 and the feed belt 8 is moved to give an image, the chip component C will open the hole 11a of the upper plate 11 and the hole 10a of the lower plate 10. After the chip component C is laid down sideways as a guide, the upper plate 11 is removed from the lower plate 10.

Then, as shown in FIG. 7(B), the chip component C is positioned in the hole 10a of the lower plate 10, and a portion of the thin plate 1 protrudes from the upper surface of the lower plate 10.
When a printed circuit board P coated with adhesive S is placed on top of such a state, the chip component C is transferred onto the printed circuit board P by the adhesive S, and this The attachment of the chip component C to the printed circuit board P is completed by immersing the printed circuit board in the semicircular bath.

However, in this conventional example, the device for forcibly feeding out chip components used as a means to eliminate stagnation of chip components in the guide pipe 5 required the detection means 100 and the auxiliary pipe 5' to be provided for each guide pipe. This method has the disadvantage that the device becomes complicated and the chip component mounting device itself becomes expensive.

[Purpose of the invention]

It is an object of the present invention to eliminate the above-mentioned drawbacks and to eliminate stagnation when chip components are dropped with a simple structure without unnecessarily complicating the device.

[Structure of the invention]

In order to achieve the above object, the present invention includes a positioning plate in which a guide pipe is connected to a hole for determining a drop position of a chip component corresponding to a mounting position of the chip component on a printed circuit board;
A movable stand member that forms a pedestal for the fallen chip component, and a hole lζ of the alignment plate that is fixed to the stand member.
a chip guide plate having corresponding guide holes formed therein so that when the base member moves and overlaps the alignment plate, the guide holes match the holes in the alignment plate; A gap narrower than the diameter of the chip component is provided between the guide pipes so that the chip component falls through the gap and the air in the plurality of guide pipes is commonly sucked. The stagnation of chip parts in the area has been eliminated.

[Embodiments of the invention]

1 and 2 show embodiments of the present invention, M3 diagram, pJ
Figure E4 shows how a chip component is attached to a printed circuit board using the chip component attaching device of the present invention.

First, in FIG. 1, reference numeral 1 denotes a hopper for storing chip components C, and the hopper 1 is mounted on a single hopper 2, similar to the conventional example shown in FIG. 4 is a positioning plate, and a plurality of guide pipes 5 are connected between this positioning plate 4 and the hopper 1. Reference numeral 21 denotes a stand member for receiving the chip components that have fallen through the guide pipe 5. Although this stand member is not shown, the same power source 12 and feed belt 8 as shown in FIGS. It can move and vibrate.

This base member 21 has one side lζ as shown in FIG.
An air inlet 21a and a groove 2 connected to the air inlet 21a
1b is provided around the periphery, and an outer peripheral wall 21 is provided inside the groove.
A receiving portion 21d for the chip component is formed with a height slightly lower than that of c. The dimensional difference t between the height of the outer peripheral wall 21c and the height of the receiving part 21d is a value 6ζ that is slightly smaller than the diameter of the chip component.
Set. (See Figure 1) Also, the suction port 21 of the base member 21
Although not shown, a is connected to a vacuum pump through a pipe or the like.

Reference numeral 22 designates a chip guide plate that is thicker than the length of the chip component and is fixed on the base member 21. A hole 22a having a width sufficient to allow the chip component C to fall sideways is provided corresponding to the position (position). The inner surface of one of the holes is made to coincide with the inner surface of the guide pipe 5. When the chip guide plate 4 configured as described above is placed on the outer peripheral wall 21c of the base member 21, a gap having the above-mentioned dimension t is created between the grate 22 and the pedestal 21d of the base member 21. There is. At this time, the chip guide plate 21 and the outer peripheral wall 21c are fixed to each other while maintaining airtightness.

The manner in which chip components are mounted at predetermined positions on a printed circuit board using the chip component mounting apparatus of the present invention having the above-mentioned 6ζ configuration will be described below with reference to FIGS. 1 to 4.

First, the base member 21 on which the chip guide plate 21 is fixed is lifted by a power source (not shown) and placed on the alignment plate 4 from below. In this state, the hole 221L of the chip guide plate 22 matches the position of the guide pipe connected to the alignment plate 41ζ. Next, the chip components C in the hopper 1 are delivered to the guide pipe 5 by a known chip component delivery mechanism (not shown) provided in the hopper 1 (for example, the one disclosed in Japanese Patent Application No. 55-176852). At this time, air in the groove 21b of the first base member is sucked by a vacuum pump (not shown).

Then, since a large gap is also provided between the pedestal 21d inside the groove 21b and the chip guide plate 4, the air in the plurality of guide pipes 5 passes through the holes 22a, the gap t1, and the groove 21b to the external vacuum pump at the same time. will be attracted to.

Since the groove 21b is provided around the pedestal 21d, the suction force of the air in each guide pipe 5 is averaged. This suction of air allows the chip component C to fall without becoming stagnant within the guide pipe 5. When the chip component C falls, a power source (not shown) operates, and when the base member 21 is similarly placed on a feed belt (not shown) and vibrates by moving the feed belt, the component C falls into the hole 22a of the chip guide grate 22. It will fall on its side.

Next, as shown in Figure 3, hole 2 of the tip guide plate
Insert the vacuum chuck probe device prepared corresponding to position 2B into the hole 22a of the chip guide plate,
The chip component C in the hole 22a is vacuum chucked and taken out, and then, as shown in FIG. 4, the chip component is placed on the applied adhesive S on the printed circuit board P to which the chip component is attached and temporarily fixed. do. As a result, the chip components are transferred onto the printed circuit board P, and by immersing the printed circuit board P in a known semicircular tank or the like, the attachment of the chip components C to the printed circuit board P is completed.

〔Effect of the invention〕

As described above, according to the present invention, a gap is provided between the pedestal of the pedestal member that receives the chip components falling through the guide pipe and the guide plate of the chip component, and a plurality of guides are guided through the gap. Since the air in the pipes is sucked at the same time, the air in each guide pipe can be sucked with a simple configuration. In addition, since a groove is provided around the pedestal, air can be sucked in from all around the hole 22a, so air resistance can be lowered, and the suction force of the air in the multiple guide pipes is averaged, allowing the chip to The parts can be dropped without becoming stagnant in the guide pipe. Although the present invention has been explained using a cylindrical chip component as shown in FIG. 6, it goes without saying that the same effect can be achieved even when applied to a prismatic chip component.

[Brief explanation of drawings]

1 and 2 are explanatory diagrams of main parts of the chip component mounting apparatus of the present invention, FIGS. 3 and 4 are explanatory diagrams of the mounting of chip components by the chip component mounting apparatus of the present invention, and FIG. 7 shows a conventional chip component mounting device, and FIG. 6 shows the shape of a typical chip component. 1...Hopper 21b...Groove 4...Positioning plate 21d...Base 5...Guide pipe 22
...Chip guide plate 8...Feed belt 2
2a...Guide hole 9...Base member t...Gap]2...Power source C...Chip part 21...
- Base member P... Printed circuit board 21a... Air intake port S... Adhesive patent applicant Alps Electric Co., Ltd. $1 Diagram 4 Figure 5 Figure 6

Claims (2)

[Claims] (1) Attachment of chip components in which chip components stored in multiple hoppers are dropped through a guide pipe whose one end is connected to the hopper, and the dropped chip components are attached to a predetermined position on a printed circuit board. In the apparatus, a pedestal member having a pedestal for receiving the dropped chip component, and a guide hole fixed to the pedestal member and communicating with the guide pipe, and guiding the chip component that has fallen onto the pedestal, are formed. a chip guide plate, a gap narrower than the thickness of the chip component is provided between the chip guide plate and the pedestal, and as the chip component falls through the gap, the plurality of guide pipes A chip component mounting device characterized by a common suction of air inside. (2) The chip component mounting device according to claim 1, wherein a groove is formed around the entire periphery of the pedestal of the pedestal member.