KR860003760A - Chip part mounting device - Google Patents

Chip part mounting device Download PDF

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Publication number
KR860003760A
KR860003760A KR1019850002788A KR850002788A KR860003760A KR 860003760 A KR860003760 A KR 860003760A KR 1019850002788 A KR1019850002788 A KR 1019850002788A KR 850002788 A KR850002788 A KR 850002788A KR 860003760 A KR860003760 A KR 860003760A
Authority
KR
South Korea
Prior art keywords
chip
receiving
guide
mounting device
chip component
Prior art date
Application number
KR1019850002788A
Other languages
Korean (ko)
Other versions
KR890004550B1 (en
Inventor
도모오 고세끼
Original Assignee
가다오까 가쓰다로오
알프스덴기 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가다오까 가쓰다로오, 알프스덴기 가부시기가이샤 filed Critical 가다오까 가쓰다로오
Publication of KR860003760A publication Critical patent/KR860003760A/en
Application granted granted Critical
Publication of KR890004550B1 publication Critical patent/KR890004550B1/en

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Abstract

내용 없음No content

Description

칩부품의 취부장치Chip part mounting device

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제1도 및 제2도는 본 발명의 칩부품의 취부장치의 중요부 설명도,1 and 2 are explanatory diagrams of important parts of the mounting device for a chip component of the present invention;

제3도는 본 발명의 칩부품의 취부장치에 의한 칩부품의 설치 설명도.3 is an explanatory diagram of the chip component installation by the chip component mounting apparatus of the present invention.

도면의 주요부분에 대한 부호의 설명Explanation of symbols for main parts of the drawings

1:호퍼 4:위치맞춤판 5:안내파이프 8: 이송벨트 21:대부재 21a: 공기흡입구 21b: 홈 21d:수납대 22: 칩안내판 22a: 안내돌기 t:공극(空隙) C:칩부품 P:프린트기판 S:접착제DESCRIPTION OF SYMBOLS 1: Hopper 4: Positioning plate 5: Guide pipe 8: Transfer belt 21: Large member 21a: Air inlet 21b: Groove 21d: Storage rack 22: Chip guide plate 22a: Guide protrusion t: Air gap C: Chip part P : Printed board S: Adhesive

Claims (2)

복수의 호퍼내에 각각 수납된 칩부품을 상기 호퍼에 일단이 접속된 안내 파이프속으로 낙하시키고, 낙하한 칩부품을 프린트기판의 소정위치에 부착하는 칩부품의 취부장치에 있어서, 상기 낙하한 칩부품을 받아 고정시키는 받음대를 형성한 대부재와, 이 대부재에 고정되고 상기 안내 파이프에 통함과 동시에 상기 받음대상에 낙하한 칩부품을 안내하는 안내구멍이 형성된 칩안내 플레이트를 갖추고, 상기 칩안내 플레이트와 받음대와의 사이에 칩부품의 두께보다 좁은 공극을 설치하여, 이 공극을 거쳐 칩부품의 낙하와 함께 상기 복수의 안내 파이프중의 공기를 공통적으로 흡인되게 한 것을 특징으로 하는 칩부품의 취부장치.A chip component mounting apparatus for dropping chip components respectively housed in a plurality of hoppers into a guide pipe having one end connected to the hopper, and attaching the dropped chip components to a predetermined position on a printed board. And a chip guide plate having a receiving member for receiving and fixing a receiving stand, and a guide hole fixed to the receiving member and guide holes guided through the guide pipe and guiding chip parts dropped on the receiving object. A gap narrower than the thickness of the chip component is provided between the plate and the receiving stand so that the air in the plurality of guide pipes is commonly sucked together with the drop of the chip component through the gap. Mounting device. 제1항에 있어서, 상기 대부재의 받음대의 전주위에 홈을 형성한 것을 특징으로 하는 칩부품의 취부장치.The device for mounting a chip part according to claim 1, wherein a groove is formed around the periphery of the receiving stand of the large member. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019850002788A 1984-10-22 1985-04-25 Chip part mounting apparatus KR890004550B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP59-221749 1984-10-22
JP59221749A JPS61100995A (en) 1984-10-22 1984-10-22 Chip part mounting apparatus
JP221749 1984-10-22

Publications (2)

Publication Number Publication Date
KR860003760A true KR860003760A (en) 1986-05-28
KR890004550B1 KR890004550B1 (en) 1989-11-13

Family

ID=16771611

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019850002788A KR890004550B1 (en) 1984-10-22 1985-04-25 Chip part mounting apparatus

Country Status (2)

Country Link
JP (1) JPS61100995A (en)
KR (1) KR890004550B1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6429899U (en) * 1986-11-17 1989-02-22
JPH0770860B2 (en) * 1988-04-23 1995-07-31 太陽誘電株式会社 Method and apparatus for mounting chip-shaped electronic component

Also Published As

Publication number Publication date
JPH0315835B2 (en) 1991-03-04
JPS61100995A (en) 1986-05-19
KR890004550B1 (en) 1989-11-13

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