JPH09121096A - Electronic device holder - Google Patents

Abstract

PROBLEM TO BE SOLVED: To release an electronic device quickly from a holder for holding the electronic device with negative pressure. SOLUTION: A negative pressure source 153, a positive pressure source 154 or a part 155 communicates alternatively with the atmosphere by switching a solenoid direction switching valve 151, 152 or 158. A component passage 146 communicates with a large component holding head 90 for holding an electronic device under a state where the negative pressure source 153 communicates with the component passage 146. When the electronic device is released, the large component holding head 90 conventionally communicates immediately with the part 155 communicating the atmosphere, but it communicates temporarily with the pressure source 154 before communicating with the part 155 according to the invention. Consequently, the air pressure in the component passage 146, large component holding head 90, etc., is increased quickly and the electronic device is released quickly.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component holding device, and more particularly to a device for attracting and holding electronic components by negative air pressure.

[0002]

2. Description of the Related Art When a suction head and an electronic component are in contact with each other, a negative air pressure is supplied to a suction chamber, which is a space formed between the suction head and the electronic component. There is a parts holding device. The release of electronic components in this type of device has conventionally been performed by communicating the adsorption chamber with the atmosphere.

[0003]

However, it is desirable that the suction head that holds and moves the electronic components be as small and lightweight as possible, and the air pressure supply device that supplies atmospheric pressure or negative air pressure is the suction head. It is usually provided separately from. In this case, it takes a considerable time for the atmospheric pressure air to flow into the suction chamber and the electronic components are released from the suction head, which hinders the improvement of the efficiency of mounting the electronic components on the printed circuit board. . This is especially the case when the distance between the suction head and the air pressure supply device is large. In this case, it is necessary to lengthen the passage that connects the suction head and the air pressure supply device, and the volume of the space that should be negative pressure for suction / holding of the electronic component increases, so that the electronic component is released. This is because the amount of air inflow required for that is increased, and since the passage is long, the passage resistance is also increased. An object of the invention of claim 1 is to provide an electronic component holding device capable of releasing an electronic component more quickly than before. The invention of claim 2 has as its object to solve the problem of claim 1 with a structure as simple as possible.

[0004]

In order to solve the above problems, an electronic component holding device according to a first aspect of the present invention is a suction head for sucking and holding an electronic component by negative air pressure, and the suction head. An air pressure supply device that can selectively supply positive air pressure, negative air pressure, and atmospheric pressure to the head, and when releasing the electronic components to the adsorption head, turn the air pressure supply device from the negative air pressure supply state to a positive air pressure once. After setting the air pressure supply state of
It is configured to include a release control means for setting the atmospheric pressure supply state.

Further, in the electronic component holding device according to the second aspect of the present invention, the air pressure supply device includes a negative pressure source, a positive pressure source, an atmosphere communicating portion, the negative pressure source, the positive pressure source, and the atmosphere. A switching valve device that selectively communicates any one of the communication parts with the suction head.

[0006]

In the electronic component holding apparatus according to the first aspect of the present invention, when releasing the electronic component of the suction head, the air pressure supply device changes the atmospheric pressure from the negative pressure supply state in which negative air pressure is supplied to the suction head. Before the atmospheric pressure supply state, which is the supply state, is switched to the positive pressure supply state, which is the state in which positive air pressure is supplied. That is, it is possible to switch from the negative pressure supply state to the positive pressure supply state to the atmospheric pressure supply state. During the period in which the air pressure supply device is in the positive pressure supply state, air having a pressure higher than the atmospheric pressure is supplied to the adsorption head, so that the air pressure in the adsorption chamber changes from the negative pressure supply state to the direct atmospheric pressure supply state. It is raised faster than when it is released, and the release of electronic components is performed quickly.

In the electronic component holding apparatus according to the second aspect of the invention, any one of the negative pressure source, the positive pressure source and the atmosphere communicating portion is communicated with the suction head by the switching valve device. By making the adsorption head communicate with each of the negative pressure source, the positive pressure source, and the atmosphere communication unit, a negative pressure supply state,
The positive pressure supply state and the atmospheric pressure supply state are realized. As the switching valve device, for example, a general electromagnetic directional switching valve can be used. The positive pressure source is often already provided for another purpose in a device in which the electronic component holding device is used (for example, an electronic component mounting device that mounts electronic components on a print substrate). If available, the objective can be achieved at low cost.

[0008]

According to the first aspect of the present invention, the suction head can release the electronic component more quickly than in the conventional case, so that the efficiency of mounting the electronic component on the printed circuit board can be improved. Further, according to the invention of claim 2, the air pressure supply device according to the first invention can be easily configured.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION A case where an electronic component holding device, which is an embodiment common to the inventions of claims 1 and 2, is used for an electronic component mounting device will be described below as an example.

In FIG. 6, 10 is a base. A plurality of columns 12 are erected on the base 10, and an operation panel 16 and the like are provided on a fixed base 14 fixed on the columns 12. As shown in FIG. 8, a board conveyor 2 for transporting a printed circuit board 20 as a material to be mounted on the base 10 in the X-axis direction (the horizontal direction in FIGS. 6 and 8).
2 are provided. The printed circuit board 20 is transported by the board conveyor 22, and the printed circuit board 20 is positioned and supported at a predetermined position by a positioning and supporting device (not shown).

A cartridge type electronic component supply device 26 and a tray type electronic component supply device 28 are provided on both sides of the base 10 in the Y axis direction orthogonal to the X axis direction in the horizontal plane. In the cartridge type electronic component supply device 26, a large number of component supply cartridges 30 are arranged side by side in the X-axis direction. A taping electronic component is set in each component supply cartridge 30. The electronic component is accommodated in each of the component accommodating recesses formed at equal intervals in the carrier tape, and the openings of the component accommodating recesses are closed by a cover film affixed to the carrier tape. This prevents the electronic component from jumping out of the component accommodating recess during tape feeding. The carrier tape is fed in the Y-axis direction by a predetermined pitch, the cover film is peeled off, and the electronic component is fed to the component feeding position. Other configurations are the same as those of the parts supply cartridge described in Japanese Patent Application No. 4-185966 of the present applicant, and detailed description thereof will be omitted.

The tray type electronic component supply device 28 is
The electronic components are supplied and stored in a component tray 34 (see FIG. 2). The electronic components are accommodated one by one in a large number of component accommodating recesses 36 (see FIG. 5) provided in the component tray 34.
7 are provided. As shown in FIG. 7, the component tray 34 has a large number of component tray housing boxes 38 arranged vertically.
Each of them is piled up. Each of the component tray storage boxes 38 is supported by a support member (not shown), and is sequentially raised to a component supply position by an elevating device provided in the column 40. Above the component supply position, a component holding unit described later is provided. However, it is necessary to secure a space for taking out electronic components.

Therefore, the component tray storage box 38 that has finished supplying the electronic components is raised by the above-mentioned space at the same time as the next component tray storage box 38 is raised to the component supply position, and is moved to the upper retreat area. Evacuated. In the tray-type electronic component supply device 28, even when the component tray 34 has finished supplying the electronic components, the component tray housing box 38 is not lifted by one component tray, and the component supply position is increased as the component tray 34 is discharged. Is the same as that of the electronic component supply device described in Japanese Patent Publication No. 2-57719 except that is lowered by one sheet of the component tray 34, and the description is omitted. Note that the component tray housing box 38 is drawn out in the X-axis direction as shown by a two-dot chain line in FIG. 8 so that an operator can inspect the inside or the like.

These cartridge type electronic component supply devices 2
The electronic component 44 (see FIG. 1) supplied by the tray 6 and the tray-type electronic component supply device 28 is mounted on the printed circuit board 20 by an electronic component mounting device 46 provided on the base 10. As shown in FIG. 7, guide rails 48 extending in the X-axis direction are provided on both sides of the substrate conveyor 22 on the base 10 in the Y-axis direction, and an X-axis slide 50 is movably fitted in a guide block 52. ing.

The X-axis slide 50, as shown in FIG.
It has a length from the cartridge type electronic component supply device 26 to the tray type electronic component supply device 28 beyond the substrate conveyor 22 and has two nuts 54 (only one is shown in FIG. 1) each of which is a ball screw. The ball screws 56 are moved in the X-axis direction by being synchronously rotated by an X-axis servomotor 58, respectively.

On the X-axis slide 50, the Y-axis slide 6
0 is provided so as to be movable in the Y-axis direction. As shown in FIG. 7, a ball screw 64 extending in the Y-axis direction is attached to the vertical side surface 62 of the X-axis slide 50, and the Y-axis slide 60 is screwed with a nut 66 (see FIG. 1). As the ball screw 64 is rotated by the Y-axis servomotor 68 shown in FIG. 8 via gears 70 and 72, the Y-axis slide 60 is guided by the pair of guide rails 74 and moved in the Y-axis direction.

On the vertical side surface 78 of the Y-axis slide 60,
As shown in FIGS. 1 and 2, the component holding unit 80 is mounted so as to be able to move up and down and rotatably, and the elevating device 82 that moves the component holding unit 80 up and down, and the electronic component 44 held by the component holding unit 80 is centered on the center line. A rotation device 84 for rotating the device around and a CCD camera 86 for picking up a reference mark provided on the printed circuit board 20 (FIG. 8)
And a CCD camera 88 for imaging the electronic component 44.
Is provided.

The component holding unit 80 has a component suction head 90 for sucking the electronic component 44, and the component suction head 9 thereof.
And a holder 92 for holding 0. Electronic component 4
There are small, large, and extra large 4 types, and the component suction head 90
The component suction head 90 is hereinafter referred to as a large component suction head 90, because it absorbs a large electronic component 44.

The holder 92 has a spline shaft 94 as shown in FIG. 2, and is fitted in a spline hole 98 of a sleeve 96. The sleeve 96 is rotatably and axially immovably held by an arm 100 projecting from a side surface 78 of the Y-axis slide 60.
A pair of gears 102 and 104 are provided at a lower end protruding from the gear 0 to remove backlash, and a gear 108 rotated by a rotation drive motor 106 of the rotating device 84 is provided.
Are engaged. Thereby, the spline shaft 94
Is rotated around its own axis with high precision by a rotation drive motor 106 via gears 102, 104, 108 and a sleeve 96, and the electronic component 44 held by the large component suction head 90 is rotated. The rotation drive motor 106 is also a servo motor.

As shown in FIG. 1, the CCD camera 88 for picking up the image of the electronic component 44 is the projecting end of the arm 100, and the position in the Y-axis direction is the component holding unit 8.
It is provided downward at a position corresponding to 0.

As shown in FIG. 2, the spline shaft 9
An engaging member 110 made of metal is attached to the upper end of 4 so as to be relatively rotatable and relatively immovable in the axial direction, and
Engaging piece 11 horizontally extended from the engaging member 110
2 is supported by the solenoid 114 from below. The solenoid 114 is attached to an elevating slide 120 as an elevating member of the elevating device 82. The large component suction head 90 is supported from below by the elevating slide 120 via the solenoid 114 and the engaging member 110.

The elevating slide 120 is a Y-axis slide 60.
Ball screw 12 vertically attached to the side surface 78 of the
2, the ball screw 122 is rotated by a lifting motor 130 via pulleys 124, 126, and a belt 128, so that the lifting slide 120 is raised and lowered.
The large component suction head 90 is moved up and down via the solenoid 114 and the engagement member 110. Since the large component suction head 90 is supported from below by the elevating slide 120, the elevating slide 120 follows and descends when descending, and rises and ascends when ascending. The elevating motor 130 is a servomotor, and the amount of rotation of the elevating motor 130 is detected by an encoder 132, so that the elevating distance of the elevating slide 120 and, consequently, the large component suction head 90 can be known.

The solenoid 114 has a yoke around which a coil is wound. The yoke is attached to the elevating slide 120 while being electrically insulated, and the upper surface thereof is brought into contact with the lower surface of the engaging piece 112 of the engaging member 110. Therefore, when an exciting current is supplied to the coil and a magnetic field is formed, the engaging member 110 is attracted to the yoke and fixed to the elevating slide 120. The solenoid 114 is
A component holding head attracting means for applying an attractive force to attract the large component suction head 90 which is the suction head to the elevating slide 120 which is the elevating member is configured. The timing at which the solenoid 114 applies the attraction force will be described later.

Further, the yoke of the solenoid 114 and the engaging member 110 are respectively connected to a power source (not shown), and when the yoke is in contact with the engaging member 110, the two are electrically connected, and when separated from each other, they are not electrically connected. Composite material 1
A contact detection switch 134 (see FIG. 9) for detecting whether or not 10 is in contact with the solenoid 114 is configured.

At the lower end of the spline shaft 94 of the holder 92, a resin ring 136 is fixed as shown in FIG. The ring 136 has a larger diameter than the spline shaft 94, but the lower surface of the ring 136 is the lower end surface 1 of the spline shaft 94.
It is a short distance from 38. A metal adsorbent 140 is fixed outside the ring 136. Adsorbent 14
The lower surface 142 is located in the same plane as the lower surface 138 of the spline shaft 94, and the lower surface 138 and the lower surface 142 constitute a suction surface 144.

In the spline shaft 94, as shown in FIGS.
As shown in the figure, a component passage 146 extending in the axial direction and a head passage 148 as a negative pressure supply passage are provided in parallel. The lower end of the component passage 146 is concentric with the axis of the spline shaft 94 as shown in FIG.
8 and a passage 148 for the head is formed in the ring 136.
The lower surface 149 is opened.

The component passage 146, as shown in FIG.
Rotary joint 15 formed integrally with the engaging member 110
0, a negative pressure source 15 via piping connected thereto and electromagnetic directional valves 151, 152 provided in the middle of the piping.
3. The positive pressure source 154 and the atmosphere communication unit 155 are selectively communicated. The head passage 148 includes a rotary joint 156 integrally formed with the engaging member 110, a pipe connected to the rotary joint 156, and an electromagnetic directional control valve 158 provided in the middle of the pipe to connect the negative pressure source 153 and the atmosphere communicating portion 159.
And can be communicated with alternatively. The passage 146 for parts
However, the positive pressure source 154, the negative pressure source 153, and the atmosphere communication unit 15
The states communicated with 5 are the positive air pressure supply state, the negative air pressure supply state, and the atmospheric pressure supply state, respectively. Further, the electromagnetic direction switching valves 151, 152, 158 are examples of the switching valve device, and this switching valve device is the positive pressure source 15
4, the negative pressure source 153 and the atmosphere communication unit 155 constitute an air pressure supply device.

As shown in FIG. 3, the large component suction head 90 has a light emitting body 160, a diffusion plate 162, and a suction tube 164 as a component holding portion. The light-emitting body 160 is a ring-shaped printed circuit board 166 to which a large number of light emitting diodes 168 are attached. The inner peripheral portion of the printed circuit board 166 is fixed to a support plate 172 made of resin. The outer peripheral side portion is not fixed to the support plate 172 but can be brought into contact with or separated from the support plate 172.

The light emitting body 160 thus supported by the support plate 172 is fitted and fixed together with the support plate 172 into the protrusion 173 provided at the center of the diffusion plate 162, and is formed on the diffusion plate 162. It is housed in a circular annular recess 170. The light emitting body 160 and the support plate 17
2, a small gap 175 is provided between the light emitting diode 168 and the bottom surface of the recess 170 in a state fixed to the diffusion plate 162, respectively, and defines the outer peripheral edge of the support plate 172 and the recess 170 of the diffusion plate 162. A slight gap 177 is provided between the outer peripheral wall and the upper surface of the outer peripheral wall.

On the upper surface of the support plate 172, a metal disk 178 having a diameter slightly larger than the lower end surface 138 of the spline shaft 94, and a metal annular plate 180 having an outer diameter equal to the diameter of the support plate 172. And are concentrically fixed. Disk 1
The upper surface 182 of 78 and the upper surface 184 of the annular plate 180 are respectively projected above the upper surface of the support plate 172 and located in the same plane, and the suction surface 14
4 forms a closing surface 186 that is in close contact. Support plate 17
2 is provided with a plurality of through-holes penetrating in the center line direction at portions where the annular plate 180 and the circular plate 178 are fixed, and springs 174 and 176 are respectively accommodated therein. One end of 176 is the luminous body 1
60 electrical contacts on the printed circuit board 166,
The other end is in contact with the annular plate 180 and the disk 178. Further, through holes 188 are provided through the centers of the diffusion plate 162, the support plate 172, and the disk 178, and the suction tube 164 is fitted therein.

When the suction surface 144 and the closing surface 186 are in contact with each other, the suction pipe 164 is communicated with the component passage 146, and the head passage 148 has the disk 178, the annular plate 180, the support plate 172 and The space 190 surrounded by the adsorbent 140 is opened. Therefore, if a negative pressure is supplied to the component passage 146 in this state, the suction tube 164 sucks the electronic component 44, and if a negative pressure is supplied to the head passage 148, the suction surface 144 closes to the suction surface 144.
The large component suction head 90 is sucked and held by the holder 92 by negative pressure.

The adsorbent 140 is connected to a power source through a switch by a lead wire (not shown), and the spline shaft 94
Is grounded. The plus circuit of the printed circuit board 166 and the annular plate 180 are electrically connected by a spring 174, and the minus circuit and the disk 178 are connected by a spring 176. Therefore, when the large component suction head 90 is suctioned by the holder 92, the suction body 140, the annular plate 180, the spring 174, the light emitting diode 168, and the spring 17
Current is supplied to an electric circuit including the disk 178 and the spline shaft 94, and the electronic component 44 sucked by the suction pipe 164 is irradiated.

The luminous body 160 is a printed circuit board 166.
The inner peripheral portion of the spline shaft 94 is fixed to the support plate 172, and the outer peripheral portion of the spline shaft 94 can contact and separate from the support plate 172. Even if the lower end surface 138 and the circular plate 178 and the lower surface 142 of the adsorbent 140 and the circular plate 180 cannot be in contact at the same time, they can be brought into contact with each other to ensure the conduction.

For example, the lower end surface 1 constituting the suction surface 144
When 38 contacts the upper surface 182 prior to the lower surface 142 forming the suction surface 144, the support plate 172 is sucked by the negative pressure, so that the supporting plate 172 is separated from the printed board 166 and is bent concavely toward the spline shaft 94 side. The upper surface 184 is the lower surface 1
42.

On the other hand, when the lower surface 142 contacts the upper surface 184 before the lower end surface 138 contacts the upper surface 182, the support plate 172 is attracted by the negative pressure, so that the support plate 172 moves toward the spline shaft 94 side. The upper surface 182 is bent to be brought into contact with the lower end surface 138. The outer peripheral portion of the printed circuit board 166 is not fixed to the support plate 172, and
Of the light emitting diode 168
Since gaps 175 and 177 are provided between the base plate 172 and the bottom surface of the concave portion 170 of the diffusion plate 162 and between the outer peripheral edge of the support plate 172 and the outer peripheral edge of the diffusion plate 162, respectively, the bending of the support plate 172 is achieved. Is allowed, and the closing surface 186 is
Is reliably brought into contact with the suction surface 144 to ensure conduction.

Even if the support plate 172 is bent and attracted, the electrical connection between the plus side circuit of the printed circuit board 166 and the annular plate 180 and the electrical connection between the minus side circuit of the printed circuit board 166 and the disc 178 are performed. , And is maintained by the expansion and contraction of the springs 174 and 176. Further, the closed surface 1
Since the 86 is reliably brought into contact with the suction surface 144, leakage of negative pressure is prevented, and the large component suction head 90 is firmly held by the holder 92.

The component suction head is formed by the shape of the electronic component 44,
It is replaced with a different one according to the size and so on. For example, when the size of the electronic component 44 is small, the suction tube 164 and the luminous body 160 may be small, and both the suction tube 164 and the luminous body 160 have a small diameter as shown by the dashed line in FIG. A head 194 is used. It should be noted that such a small electronic component 44 is provided in the component supply cartridge 30.
And the suction tube 164 is short because the component receiving recess of the carrier tape is shallow.

When the electronic component 44 is relatively large, the diameter of the diffusion plate 162 is equal to that of the suction member 140 of the holder 92 and the suction pipe 164 is thick like the large component suction head 90 shown in FIG. A long large component suction head 90 is used. Large electronic components 44 are often supplied by the component tray 34, and the suction pipe 164 of the large component suction head 90 for large electronic components is the component tray housing box 3
The length is such that the electronic component 44 can be taken out from the component tray 34 accommodated in the lowermost stage of No. 8. The large component suction head 90 of this size is used for the component supply cartridge 30.
The electronic component 44 can also be taken out from the.

Further, when the electronic component 44 is extremely large, as shown by the solid line in FIG. 4, the luminous body 160 has a larger diameter than the suction body 140 of the holder 92, and the suction pipe 164 has a larger diameter. Head 196 is used.

The component tray 34 of the tray type electronic component supply device 28 needs to be ejected, for example, when all the electronic components 44 accommodated in the component tray 34 are mounted. Therefore, in this electronic component mounting apparatus, the holder 92 is made to hold the tray suction head 200 shown in FIG. 5 in place of the large component suction head 90, and the electronic component mounting apparatus 46 discharges the component tray 34. . In this case, the tray suction head 200 constitutes a tray holding head.

The tray suction head 200 has a cylindrical suction body 202 and an air supply body 204. Adsorbent 20
Reference numeral 2 denotes flanges 208 and 210 extending radially outward from both ends of the cylindrical portion 206 in the longitudinal direction. The diameter of the flange 208 is equal to the diameter of the adsorbent 140 of the holder 92 and the diameter of the flange 210
Is larger than the diameter of the flange portion 208 and is equal to the diameter of the diffusion plate 162 of the oversized component suction head 196.
A plurality of through holes 212 are formed at equal angular intervals in a portion of the cylindrical portion 206 adjacent to the flange portion 208.

Further, of the inner peripheral surface of the portion of the cylindrical portion 206 where the through hole 212 is formed and the flange portion 210, the portion adjacent to the through hole 212 is the flange portion 2.
A partial conical surface 214 whose inner diameter gradually decreases toward the 10th side, a portion following the partial conical surface 214 is a cylindrical surface 216, and a portion following the cylindrical surface 216 further includes a partial conical surface 218 whose inner diameter gradually increases toward the flange portion 210 side. Have been.

The air supply body 204 has a disc portion 222 having the same diameter as the flange portion 208, and a protrusion 224 projecting from the center of the disc portion 222, and the protrusion 224 is the cylindrical portion 20.
6 and the disk portion 222 is seated and fixed on the flange portion 208. Protrusion 22
4 is slightly retracted from the flange portion 210 and has a large diameter, and the outer peripheral surface of the protruding end portion 226 on the disk portion 222 side has a partial conical surface 228 whose diameter gradually increases toward the protruding end side. After the cylindrical surface 230 following the partial conical surface 228 is formed, the outer peripheral surface on the distal end side is a partial conical surface 232 whose diameter gradually decreases toward the distal end. Accordingly, in the annular space between the protruding end portion 226 and the cylindrical portion 206, a narrow annular passage 234 is provided between the portion on the through hole 212 side and the portion on the flange portion 210 side in the center line direction.
Are formed.

A bottomed air passage 238 opening to the disc portion 222 is formed in the protrusion 224, and a plurality of jet ports 240 opening to the partial conical surface 228 are formed in the protrusion end 226. It is formed obliquely toward the through hole 212. A sponge 242 is attached to the protruding end surface of the protruding end portion 226 and protrudes from the flange portion 210.

The tray suction head 2 constructed in this way
00 and the oversized component suction head 196 are used less frequently, and the large component suction head 90 and the small component suction head 194 are used more often. Therefore, when these heads are not in use, as shown in FIG.
The first head support 250 and the second head support 2 provided respectively at two locations separated in the substrate transport direction above
It is divided into 52 and supported.

The first head support 250 is for the large component suction head 90 and the small component suction head 194, and the second head support 252 is for the extra large component suction head 196 and the tray suction head 200, respectively. Five head fitting holes 254 and three head fitting holes 256 are provided as supporting portions. These head fitting holes 254 and 256 have the same structure except for a difference in size, and the head fitting holes 256 will be described as a representative.

The three head fitting holes 256 are formed in a zigzag shape by vertically penetrating the second head support 252 as shown in FIG. 8, and the dimension of the second head support 252 in the Y-axis direction. Is smaller and more compact than the case where three head fitting holes 256 are formed in line in the Y-axis direction. As shown in FIG. 4, the diameter of the upper surface side of each head fitting hole 256 is made equal to the diameter of the diffusion plate 162 of the oversized component suction head 196, and the diameter of the lower surface side is a stepped shape slightly smaller than that. , An upward supporting seat surface 260 is formed. Further, as shown in FIG. 8, the second head support 252 has a head fitting hole 256 and a second head support 252.
And a notch 262 having a width sufficient to allow the suction tube 164 to pass therethrough.

In the tray suction head 200, as shown in FIG. 4, the head fitting hole 25 is formed in the flange portion 210.
6 is seated on the support seat surface 260. Therefore, of the three head fitting holes 256, the front fitting side head fitting hole 25
6 is for the tray suction head 200, is provided below the head fitting hole 256 for the other oversized component suction head 196, and the upper surface of the flange portion 208 is the oversized component suction head 1.
It is located in the same plane as the upper surface of 96.
Thus, the holder 92 can hold and release the tray suction head 200 at the same vertical distance as when the oversized component suction head 196 is suctioned.

Two prisms 270 are fixed to the X-axis slide 50 as shown in FIGS. These two prisms 270 are attached to the X-axis slide 50.
At a position corresponding to the ball screw 56 that moves the X-axis slide 50 in the lower Y-axis direction, the cartridge-type electronic component supply device 26 and the printed circuit board 20.
And the tray-type electronic component supply device 28 and the printed circuit board 20.

The structures of these prisms 270 are the same. The casing 272 of the prism 270 is fixed to the X-axis slide 50 as shown in FIG.
70 is tilted at about 45 degrees with respect to a vertical plane including the center line of the large-component suction head 90 immediately below the movement path of the large-component suction head 90 in the Y-axis direction. Reflecting surface 274 whose end is located below
And a reflection surface 274 and a reflection surface 276 located symmetrically with respect to a vertical surface at a position directly below the movement path of the CCD camera 88 in the Y-axis direction. The outer surface of the reflecting surface 274 is subjected to a half-mirror process so as to reflect most of the light emitted from the large-component suction head 90 side while transmitting light emitted from below.

Also, the X-axis slide 5 of the casing 272
A shutter 280 is fixed to the outer surface opposite to the zero side. The size of the shutter 280 in the Y-axis direction is
4,276, and is projected upward from the casing 272, and the protruding end is the X-axis slide 50.
Bent horizontally to the side, reflecting surface 276 and CCD camera 88
And a shielding portion 282 protruding between them. A notch 284 is provided at the center of the shield 282 in the Y-axis direction. Therefore, when the Y-axis slide 60 moves, the CCD camera 88 moves on the shielding portion 282, and when passing through the cutout 284, the reflected light from the reflecting surface 276 is obtained, and the cutout 284 in the X-axis direction is obtained. The size is made large enough to allow the image forming light reflected from the reflecting surface 276 to pass, and the size of the notch 284 in the Y-axis direction is C.
The length vt is obtained by multiplying the moving speed v of the CD camera 88 in the Y-axis direction by the exposure time t.

As shown in FIG. 10, the reflected light from the reflecting surface 276 is inverted by the lens and enters the image pickup surface constituted by the image pickup element of the CCD camera 88, and the visual field range of the CCD camera 88 is shown by a solid line. The range is indicated by. When the CCD camera 88 moves in the Y-axis direction indicated by the arrow in the drawing, light from each corresponding position in the visual field range enters the imaging surface. Taking the upstream end in the moving direction of the imaging surface as an example, from the downstream end in the moving direction of the visual field range until the CCD camera 88 moves from the position indicated by the solid line to the position indicated by the dashed line in the figure. Reflected light enters through the notch 284 and exposes the image sensor. Therefore, notch 2
The length of the Y-axis direction 84 is the exposure time t of the CCD camera 88.
If the length is multiplied by the moving speed v, the electronic device 44 can be imaged by exposing the image sensor for the time required for image capturing.

The lengths of the reflecting surfaces 274 and 276 in the Y-axis direction are reflected by the reflected light from the reflecting surface 276 and enter the image pickup surface of the CCD camera 88. The length from the position where the incidence of light to the downstream end in the moving direction of the surface to the position where the incidence of light ends to the upstream end in the moving direction of the imaging surface ends as indicated by the dashed line. It is a minimum requirement and will be slightly longer than that. The length of the reflecting surfaces 274 and 276 in the Y-axis direction varies depending on the length of the notch 284 in the Y-axis direction and may be narrower than the field of view of the CCD camera 88, but in the present embodiment, it is wider than the field of view. ing.

As shown in FIG. 1, front lights 290 and 292 are attached to the lower and upper sides of the reflecting surface 274 of the prism 270 on the X-axis slide 50 by attaching members (not shown). The front light 290 below the reflection surface 274 is formed by fixing a large number of light emitting diodes 296 to a printed board 294, and is disposed horizontally. A front light 292 above the reflection surface 274 is provided with a large number of light emitting diodes 3 on an inner peripheral surface of a printed circuit board 298 whose inner and outer peripheral surfaces are tapered.
00 is fixed, and the large diameter side is provided at a position concentric with the component holding unit 80 when the component holding unit 80 is at the center position of the prism 270 in the Y-axis direction. These front lights 290 and 292 are used when the electronic component 44 is irradiated with light from below and an image (referred to as a surface image) formed by reflected light from the surface of the electronic component 44 is acquired. The image formed by the irradiation light of the above-mentioned issuer 160 is called a projected image.

The electronic component mounting apparatus is controlled by the control device 310 as the control means shown in FIG. The control device 310 includes a CPU 312, a ROM 314, and a RAM 31.
6 and a computer having a bus 318 connecting them. An image input interface 322 is connected to the bus 318, and the CCD camera 8
6,88 are connected. A servo interface 324 is connected to the bus 318, and the encoder 13
2, an X-axis servo motor 58, a Y-axis servo motor 68, a rotation drive motor 106, and a lifting / lowering motor 130 are connected. A digital input interface 326 is connected to the bus 318, and a contact detection switch 134 is connected to the bus 318. Further, a digital output interface 328 is connected to the bus 318, and the board conveyor 22 and the electromagnetic directional control valves 151, 152, and 158 are connected to the bus 318.

Next, the operation will be described. When mounting electronic components on the printed circuit board 20, the component holding unit 80
Moves to the component supply position of the cartridge type electronic component supply device 26 or the tray type electronic component supply device 28 by the movement of the X axis slide 50 and the Y axis slide 60, and holds the electronic component 44. Here, the large component suction head 90
Is held by the holder 92, and the large electronic component 44 supplied by the cartridge-type electronic component supply device 26 is mounted.

The component holding unit 80 moves to the component supply position of the component supply cartridge 30 which supplies the predetermined electronic component 44 according to the data designating the type of the electronic component 44 to be mounted. After the movement, it is lowered by the elevating device 82. As shown in the graph of FIG. 11, the descending speed is set to a constant high speed after being accelerated by a certain distance, and after being decelerated, the suction pipe 164 is moved. Immediately before contacting the electronic component 44, the speed is set to a constant low speed so that the suction tube 164 contacts the electronic component 44 with less impact. Solenoid 1
14 is excited at the time of acceleration, the engaging member 110 is attracted to the yoke and is integrally lowered, so that even if the lowering acceleration is greater than the gravitational acceleration, the component holding unit 80 is not separated from the lifting slide 120 by inertia. To be.

The solenoid 114 is demagnetized except during acceleration. Therefore, the suction tube 164 is connected to the electronic component 44.
When the solenoid 114 comes into contact with the
Is not adsorbed, and the descending distance of the elevating slide 120 is
The distance between the suction tube 164 and the electronic component 44 before the start of the descent is longer than the distance between the suction tube 164 and the electronic component 44 so that the suction tube 164 surely contacts the electronic component 44.
After contacting 4, the solenoid 114 separates from the engagement member 110 and the lifting slide 120 can descend an extra distance. Thus, the contact detection switch 134 detects that the solenoid 114 is separated from the engagement member 110 and the suction pipe 164 comes into contact with the electronic component 44.

Further, the solenoid 114 has the engaging member 110.
Since the electronic component 44 is separated from the component holding unit 8
Only a weight of 0 is added. The lifting slide 1
If the component holding unit 80 is supported from below by the solenoid 114 and the engagement member 110 is attracted by the excitation of the solenoid 114 so that the component holding unit 80 does not separate from the elevating slide 120, the solenoid 114 is attached to the elevating slide 120. In place of this, a support member is provided to support the engaging member 110 from below, and a rod is protruded from the support member so as to protrude above the engaging piece 112, and between the protruding end and the engaging piece 112. The load applied to the electronic component 44 can be reduced as compared with a case where a spring is disposed to press the engagement piece 112 against the support member so that the engagement member 110 does not separate from the elevating slide 120 when descending.

In order to prevent the component holding unit 80 from being separated from the elevating slide 120 by using the spring, it is necessary to set the set load F of the spring to a value that satisfies the expression (1). . (Α−g) m ≦ F (1) where α is the maximum descent acceleration of the elevating slide 120 g: gravitational acceleration m: mass of the component holding unit 80

Then, the suction pipe 1 of the large component suction head 90
64 contacts the electronic component 44, and then moves up and down the slide 1.
In order for 20 to descend, it is necessary to overcome the set load F of the spring and compress the spring, and the weight of the component holding unit 80 and the set load of the spring are applied to the electronic component 44. On the other hand, the engaging member 1
When the large component suction head 90 is attracted by the solenoid 114 and released when the large component suction head 90 comes into contact with the electronic component 44 so that the elevating slide 120 is separated from the component holding unit 80, the weight of the component holding unit 80 is included in the electronic component 44. Only mg is added, and the load is small.

When the component holding unit 80 is lowered, the descending speed is controlled as follows. Electronic components 4
4 so that the distance at which the component holding unit 80 can be lowered at a constant low speed is 0.3 mm even if the size of the component holding unit 80 and the position of the bottom surface of the component receiving recess formed on the carrier tape of the component supply cartridge 30 vary. It is done. There are variations in the size of the electronic component 44 and the position of the bottom surface of the component housing recess, and the lower end surface of the suction pipe 164 and the electronic component 44 are different.
If the actual distance of the upper surface of the component holding unit 8 is shorter than when there is no variation, the component holding unit 8 is not sufficiently decelerated.
0 comes into contact with the electronic component 44, causing a large shock, and
If the actual distance is longer than when there is no variation, the descent time at a constant low speed becomes long, and it takes a long time to pick up the component. Therefore, speed control is performed without increasing the impact and without decreasing the descent time.

First, when the suction of the electronic component 44 is started, the initial setting is performed so that the distance at which the suction pipe 164 is lowered at a constant low speed immediately before contacting the electronic component 44 is approximately 2 mm. Acceleration distance and the deceleration distance is constant, a constant low speed descending stroke lowering speed after the acceleration by adjusting the distance L ₁ to a constant speed is to be made to be 2 mm. Then, the component holding unit 80 is lowered, and the speed switching timing from deceleration to a constant low speed, the contact timing of the suction tube 164 with the electronic component 44 detected by the contact detection switch 134 and the detection value of the encoder 132 at each timing are obtained. As shown in FIG. 11, the actual distance L _R descending at a constant low speed is calculated, and the difference between this distance L _R and 0.3 mm is added to the distance L ₁ descending at a constant high speed. Thus, when the distance L _R is longer than 0.3 mm, the distance L _R
1 becomes longer, and when the distance L _R is shorter than 0.3 mm, the distance L ₁ becomes shorter, so that the distance at which the suction tube 164 descends at a constant low speed just before coming into contact with the electronic component 44 is 0.1 mm.
3 mm.

As described above, the descending distance at a constant low speed is 0.
Distance L for 3 mm₁ Correction of parts supply cartridge
It is performed every 30 days. At this time, the dimensions of the electronic component 44
Due to the difference in the size of the component accommodating recess,
If the heights are different, the distance L is set at the initial setting.₁ Is electronic
The distance is set according to the height of the upper surface of the component 44. Electronic
The distance between the upper surface of the component 44 and the lower end surface of the suction tube 164 is set in advance.
I know, distance L ₁ According to the height of the electronic component 44
It can be set to a distance.

Then, the distance L ₁ is stored in the RAM 316 in association with the type of the component supply cartridge 30, and when the electronic component 44 is next taken out from the same component supply cartridge 30, the distance L ₁ is read from the RAM 316, In the component holding unit 80, 0.3 mm immediately before the suction tube 164 contacts the electronic component 44 is lowered at a constant low speed. Also at the time of taking out the second and subsequent electronic components 44 from the same component supply cartridge 30, the timing at which the suction tube 164 comes into contact with the electronic components 44 is detected by the contact detection switch 134, and the actual distance _LR is calculated and fixed. descending stroke at low speed the distance L ₁ so that 0.3mm is corrected. Accordingly, even if there is an error in the dimensional error of the electronic component 44 or in the height of the bottom surface of the component accommodating recess, the suction pipe 164 can be brought into quick contact with the electronic component 44 with less impact.

The component holding unit 80 is the electronic component 4
The constant low speed descent speed immediately before touching 4 is, for example,
It is determined by the magnitude of the impact force when the component holding unit 80 contacts the electronic component 44 and the weight of the component holding unit 80.

After the suction pipe 164 is brought into contact with the electronic component 44 in this way, a negative pressure is supplied to the component passage 146 and the suction pipe 164 sucks the electronic component 44. After the suction, the component holding unit 80 is raised by lifting the lifting slide 120. Thereafter, the component holding unit 80 moves the component supply position of the component supply cartridge 30 and the printed circuit board 2.
0 is moved to the component mounting position along a straight line connecting the component mounting position.
Pass over the prism 270 fixed at a position between the component supply position and the component mounting position.

The cartridge type electronic component supply device 28 and the printed circuit board 20 are located at the component supply position and the component mounting position.
In any of the above positions, in order for the component holding unit 80 to move from the component supply position to the component mounting position,
It moves on the X-axis slide 50 in the Y-axis direction and passes through a portion between the cartridge type electronic component supply device 26 and the printed circuit board 20. Therefore, the prism 27 is located on the portion of the X-axis slide 50 located between the component supply position and the component mounting position.
If 0 is fixed, the component holding unit 80 always passes over the prism 270. In this way, it is not necessary to bypass the component holding unit 80 to the image capturing position specially provided for capturing an image of the electronic component, and the component holding unit 80 can be moved from the component supply position to the component mounting position in the shortest distance.
Further, the prism 270 is provided, for example, in the component holding unit 8
Since it is not necessary to make the length 0 sufficient to intersect the entire path of movement of 0 and the size can be reduced, it is easy to accurately obtain the flatness and parallelism, the device cost is low, and the cleaning is easy. It can be carried out.

At this time, as shown in FIG.
The light that is emitted from 0 and forms the projected image of the electronic component 44 is reflected by the reflecting surface 274 and then reflected upward by the reflecting surface 276. When the component holding unit 80 passes over the prism 270, the electronic component 44 receives the reflection surface 27.
4, the CCD camera 88 passes over the reflection surface 276, and the notch 2 formed in the shielding portion 282 of the shutter 280.
The electronic component 44 is imaged by the image forming light that enters the imaging surface through 84.

The CCD camera 88 is a component holding unit 80.
Together with the component holding unit 80
When the electronic component 44 and the CCD camera 88 pass over the prism 270, the image forming light reflected by the reflection surface 276 follows the CCD camera 88 when the electronic component 44 and the CCD camera 88 pass over the prism 270. That means CC
The D camera 88 can capture an image of the electronic component 44 in the same state as stationary. As described above, the shutter 28
The length of the 0 notch 284 in the Y-axis direction is a length obtained by multiplying the exposure time of the CCD camera 88 by the moving speed, and the image sensor is sufficiently exposed to image forming light to image the electronic component 44. Therefore, as the CCD camera 88 in the present embodiment, it is possible to employ a camera whose image pickup performance is not so high, such as a relatively slow shutter speed, and the electronic component mounting apparatus 46 can be constructed at a lower cost.

The data of the picked-up image is compared with the normal image data having no holding position error in the control device 310,
The center position errors ΔX and ΔY and the rotational position error Δθ are calculated. In addition, the horizontal position error Δ
X ′ and ΔY ′ are calculated by previously imaging the reference mark provided on the printed circuit board 20 by the CCD camera 86, and based on these errors before moving to the component mounting position, the moving distance of the electronic component. Is corrected, and the electronic component 44 is rotated by the rotation device 84 to correct the rotational position error Δθ, and the electronic component 44 is mounted in the component mounting position on the printed circuit board 20 in a proper posture.

The component holding unit 80 is the printed circuit board 20.
Then, the electronic component 44 is lowered by the elevating device 82 to mount the electronic component 44 on the printed circuit board 20. At this time, as in the case where the electronic component 44 is taken out from the component supply cartridge 30, the descending speed is the same as that in FIG.
As shown in FIG. 1, after acceleration, the speed is set to a constant high speed, and after deceleration, the speed is set to a constant low speed immediately before the electronic component 44 contacts the printed circuit board 20. When accelerating, the solenoid 1
14 is excited to attract the engaging member 110, and even if the descending acceleration is greater than the gravitational acceleration, the component holding unit 80 is lowered integrally with the elevating slide 120. Printed circuit board 20
After being placed on the electronic component 44, the lifting slide 120 is allowed to descend excessively in the same manner as when the electronic component 44 is sucked.

Even when the electronic component 44 is mounted on the printed circuit board 20, the electronic component 44 is mounted on the printed circuit board 20 as in the case where the component holding unit 80 holds the electronic component 44.
0.3mm down at a constant low speed just before contacting
The descending speed is controlled so that Initialization is performed when worn started after a certain falling distance at low speed is set the distance L ₁ so as to 2mm with the electronic component 44 is mounted on the PCB 20, the descending stroke at a constant low speed 0.3
distance L ₁ is corrected so that the mm. By controlling the descending speed in this manner, even if the printed board 20 has irregularities due to production errors or post-manufacture distortion, the electronic component 44 can be moved without increasing the descending time and with less impact. Can be attached to

When the electronic component 44 is mounted on the printed circuit board 20, the component holding unit 80 is moved down from the raised end position to the printed circuit board 20. Depending on the size of the electronic component 44, the electronic component 44 and the printed circuit board 20 may be separated from each other. The distance is different. Types of electronic components 44 to be mounted, since the dimensions known, the distance L ₁ is the initial setting, the electronic components 44
Each time is set to a different value so that the descent distance at a constant low speed immediately before contacting the printed circuit board 20 is 2 mm.

The distance L ₁ is associated with the type of electronic component 44 and the electronic component mounting position of the printed circuit board 20 in the RAM.
136. Then, the next time the same type of electronic component 44 is mounted on the same type of printed circuit board 20 at the same component mounting position, it is read from the RAM 136, and a fixed low level occurs just before 0.3 mm when the electronic component 44 comes into contact with the printed circuit board 20. It is made to descend at a speed. The distance L ₁ is corrected every time the electronic components 44 are mounted on the PCB 20.

Further, when the mounting program is changed, the type of electronic component 44 to be mounted, the printed circuit board 20.
Speed immediately before even type and the component mounting position is the same, the distance L ₁ in such a case the component supplying cartridges 30 and parts tray 34 has been exchanged is initialized, the electronic component 44 in contact with the printed circuit board 20 Is corrected after the distance at which is constant is 2 mm.

In this way, the electronic component 44 is mounted on the printed circuit board 2
Also, when the electronic component 44 is mounted on the printed circuit board 20, the lifting slide 120 supports the component holding unit 80 from below through the solenoid 114 and can be lowered at a constant low speed in the final stage. When the electronic component 44 is placed on the electronic component 44 and separated from the engagement member 110, the electronic component 44 is pressed against the printed circuit board 20 with an appropriate pressing force determined by the weight of the component holding unit 80.
After the electronic component 44 is placed on the printed circuit board 20, when the component holding unit 80 separates from the printed circuit board 20, the electromagnetic directional control valve 152 is switched to cut off the supply of the negative pressure to the component passage 146. On the other hand, a positive pressure is supplied for a short time to release the holding of the electronic component 44 by the large component suction head 90, and after the release, the component passage 146 is communicated with the atmosphere. This series of operations is controlled by the control device 310, and the control device 310 constitutes a release control means. As described above, the electronic component holding device according to the present embodiment includes the large component suction head 90 as the suction head, the negative pressure source 153 as the air pressure supply device, and the positive pressure source 15.
4, the atmosphere communication unit 155 and the like, and the control device 310 that constitutes the release control means.

Next, replacement of the suction head will be described.
When it becomes necessary to replace the suction head due to a change in the type of the electronic component 44 mounted on the printed circuit board 20 or damage to the suction head, the component holding unit 80 first uses the current holder. The suction head held by 92 is supported on the head support base. Here, since the holder 92 holds the large component suction head 90 for the large electronic component 44, the component holding unit 80 is moved to the first head support 250. At this time, the component holding unit 80 has been moved to the rising end position. At this rising end position, the component holding unit 80 is X
Large component suction head 90 that does not interfere with the shaft slide 50
The suction pipe 164 has a height that interferes with the first head support base 250, and the component holding unit 80 allows the suction pipe 164 to pass through the notch 262 of the empty head fitting hole 254 so that the suction pipe 164 is inserted into the head fitting hole 254. After being entered, the diffusing plate 162 is lowered until it is seated on the support seat surface 260. After descending, the head passage 148 is released to the atmosphere and is held by the holder 92.
The holding of the large component suction head 90 due to is released.

Next, the holder 92 is raised and moved to the suction head which is to be held next. Here, it is assumed that the small component suction head 194 supported by the first head support base 250 is held. The holder 92 is moved down onto the small component suction head 194 and then lowered.
The suction surface 144 is the closing surface 186 of the small component suction head 194.
And a negative pressure is supplied to the head passage 148 to suck the small component suction head 194. After the suction, the holder 92 is slightly lifted, the diffusion plate 162 of the small component suction head 194 is lifted from the support seat surface 260, and then moved in the X-axis direction, and the suction pipe 164 passes through the notch 262 to move the head. It is pulled out from the fitting 254. Then, the small electronic component 44 is taken out by moving to the cartridge type electronic component supply device 26, and the printed circuit board 2
Attach to 0.

In this way, the component suction heads 90, 194,
196 and, as will be described later, if the holder 92 sucks and holds the tray suction head 200 by negative pressure,
While the component holding unit 80 is moving, the component suction head 90,
Even if 194, 196 and the tray suction head 200 collide with some obstacle, horizontal relative movement occurs between the holder 92 and the heads 90, 194, 196, 200 to allow movement of the holder 92. Therefore, the first and second moving devices that move the component holding unit 80 are not unduly loaded, and damage is avoided.

The first and second head support bases 25 may be damaged due to damage to the suction head or change in the type of electronic components to be mounted.
When replacing the suction head supported by 0,252, an operator may replace it, or an automatic replacement device may be provided to automatically replace it.

When the electronic component 44 is taken out from the tray type electronic component supply device 28 and mounted, if the electronic component 44 in the component tray 34 is exhausted, the suction head is replaced with the tray suction head 200, and the component tray 34 is replaced with the electronic component 44. It is conveyed and discharged by the mounting device 46. Since the electronic component mounting device 46 also serves as a tray discharge device, there is no need to provide a dedicated tray discharge device.

At the time of discharging the component tray, the component holding unit 80 first moves to the first head supporting base 250 or the second head supporting base 252 to support the suction head held by the holder 92. Then, the second head support 25
It is moved to the tray suction head 200 supported by 2 and held by suction. As shown in FIG.
0 is brought into contact with the disk portion 222 of the tray suction head 200, and a negative pressure is supplied to the head passage 148 to suck it. Further, in this state, the air passage 238 provided in the tray suction head 200 communicates with the component passage 146.

Then, the tray suction head 200 is moved to the predetermined holding position of the component tray 34 by the movement of the X-axis slide 50 and the Y-axis slide 60, and is then lowered, so that the flange portion 210 is attached to the component. Tray 3
4. The flange 210 contacts the portion defining the component receiving recess 36 and the sponge 24
2 closes the through hole 37 formed in the component receiving recess 36. Which part of the component tray 34 is held by the tray suction head 200 is set in advance in consideration of a holding balance or the like, and is closed by the sponge 242 when there is a through hole 37 at the holding position. -ing

In this state, the electromagnetic directional control valves 151, 152
Is switched, and compressed air is supplied to the component passage 146. The compressed air passes through the ejection port 240 and passes through the projection 22.
It spouts into the space between 4 and the cylindrical part 206,
Since the ejection speed is high, a negative pressure is generated around the outlet of the ejection port 240. Negative pressure is generated around the upper opening of the narrow annular passage 234 between the projection 224 and the cylindrical portion 206, and air in the space on the component tray 34 side is sucked out from the annular passage 234 by the negative pressure. Then, the pressure in the space becomes negative pressure, and the component tray 34 is sucked. Since the through hole 37 formed in the electronic component housing concave portion 36 is closed by the sponge 242, no air enters between the component tray 34 and the tray suction head 200, and the component tray 34 is suctioned by negative pressure. It is done. Further, the inner peripheral surface of the cylindrical portion 206 and the outer peripheral surface of the protruding end portion 228 are formed as partial conical surfaces 214, 218, 228, and 232, and do not obstruct the flow of the air, and guide the air to the annular passage 234 and penetrate therethrough. It leads to the hole 212 side.

The tray suction head 200 is a component tray 34.
After being sucked, it is moved above a shooter (not shown) provided adjacent to the tray-type electronic component supply device 28,
The component tray 34 is discarded, and the component tray 34 is discharged by the shooter.

As described above, the tray suction head 200 sucks the component tray 34 by negative pressure.
This is obtained by supplying positive pressure to the component passage 146 that supplies negative pressure when the suction head sucks the electronic component 44, and it is not necessary to provide a dedicated air passage for supplying positive pressure. , Positive pressure can be easily supplied. Further, the positive pressure source 154 is also already provided to supply the positive pressure to release the holding of the electronic component 44 by the suction tube 164. Since the positive pressure source 154 is used, the positive pressure can be easily supplied. Therefore, the device cost does not increase.

Even when the electronic component 44 is taken out from the component tray 34 of the tray type electronic component supply device 28, the descending speed is controlled in the same manner as when the electronic component 44 is taken out from the component supply cartridge 30. In this case,
Considering the distortion component supply tray 34, falling a distance L ₁ at a constant speed as descending stroke at a constant low speed in the initial setting is 4mm is set. Further, at the time of ordinary electronic component removal, the descending distance at a constant low speed immediately before the suction tube 164 comes into contact with the electronic component 44 is set to 0.5 mm.

Then, after the electronic component 44 is taken out with the descending distance at the constant low speed being 4 mm, the descending distance L ₁ at the constant high speed is corrected to be 0.5 mm.
While taking out the electronic component 44 from the same component tray 34, the distance L ₁ is sequentially corrected based on the actual descending distance at a constant low speed. Then, the electronic components 44 in the component tray 34
When the electronic component 44 is discharged and the electronic component 44 is taken out from the next component supply tray 34, the descending distance of the component holding unit 80 increases by one thickness of the component tray 34,
Distance L ₁ is descending stroke at a constant low speed is initially set to be 4 mm.

Further, when the projection image of the electronic component 44 is taken, the electronic component 44 is illuminated by the light emitting body 160 emitting light as described above. For example, the electronic component is viewed from the side surface of the main body. The tip of the extended lead wire is bent inward and overlaps the main body in the direction of the center line of the electronic component, and it is necessary to obtain a surface image (image viewed from below in FIG. 1). In this case, the front lights 290 and 292 irradiate the electronic component 44 with light. The light emitted by the front light 290 reflects the reflection surface 27.
4 and illuminates the electronic component 44, and the front light 2
The light emitted by 92 directly illuminates the electronic component 44. In any case, the reflected light from the electronic component 44 is reflected by the reflecting surface 274,
The surface image of the electronic component 44 is reflected by 276 and the CCD
The image is taken by the camera 88.

The electronic component mounting apparatus 46 of the present embodiment described above can be regarded as an electronic component mounting apparatus having the following configuration. That is, (1) a first moving member having a length spanning a component supply device that supplies electronic components and a mounting target material positioning and supporting device that positions and supports a mounting target material on which electronic components are mounted, and the first moving member. A first moving device having a first driving device for moving the component feeding device and the mounting target material positioning and supporting device in a first moving direction that intersects in a plane with a direction in which the mounting target material positioning and supporting device is lined up, and (2) on the first moving member Second movement having a second movement member provided in the second movement member and a second drive device for moving the second movement member in a second movement direction parallel to a direction in which the component supply device and the mounting target material positioning support device are arranged side by side. A device, (3) provided on the second moving member,
A component holding head for holding an electronic component, (4) an imaging system for capturing an image of the electronic component held by the component holding head, and (5) controlling the first driving device and the second driving device to control the component holding head. In an electronic component mounting apparatus including a control means for moving from a component supply position to a component mounting position, an image capturing apparatus of an image capturing system and an image capturing apparatus thereof in a portion located between a component supply apparatus of a first moving member and a mounting target material. It can be considered that at least one of the reflection device for reflecting the image forming light is fixed. Also,
Among the electronic component mounting apparatuses having such a configuration, it can be particularly regarded that the reflecting device of the imaging system is fixed to the first moving member and the imaging device is provided on the second moving member.

When considered in this way, the X-axis slide 50
Corresponds to the first moving member, and the X-axis direction corresponds to the first moving direction. Also, the nut 54 and the ball screw 5
6, the X-axis servomotor 58 and the like constitute the first driving device, and the first driving device and the X-axis slide 50 constitute the first moving device. Similarly,
The Y-axis direction corresponds to the second moving direction, and the Y-axis slide 60 as the second moving member, the ball screw 64, the nut 66,
The second moving device is configured by the second driving device configured by the Y-axis servo motor 68 and the like. The holder 92 is moved by the holder moving device configured by the first moving device and the second moving device. Also, a large component suction head 90 and a small component suction head 1 that are suction heads.
The 94 and the extra-large component suction head 196 correspond to a component holding head, and the CCD camera 88 corresponds to an imaging device. Further, the prism 270 corresponds to a reflecting device, and the prism 270 and the CCD camera 88 constitute an image pickup system.

In the embodiment described above in detail, the reflecting device is constituted by the prism 270, but it may be a mirror 350 provided horizontally on the X-axis slide 50 as shown in FIG. In this case, the mirror 350 reflects only the light forming the projection image of the electronic component 44 upward, so that the reflected light does not enter even if the CCD camera is provided in the vertical direction as in the above-described embodiment, and the imaging is performed. Can not do it. Therefore, two CCD cameras 352 are provided symmetrically and inclined with respect to a vertical plane including the axis of the component holding unit 80 and parallel to the Y-axis direction to acquire a stereoscopic image of the electronic component 44. When a front light is used, it is desirable that the mirror 350 be a half mirror and that the front light be provided behind the half mirror.

As described above, when the image pickup system has two image pickup devices and one reflecting device, it is possible to use the two image pickup devices properly. For example, it is possible to obtain both a projected image and a surface image of an electronic component, and
The image pickup magnifications may be set to different sizes and used properly according to the size of electronic components. Of the two image pickup devices, one of the image pickup device and the reflection device may be fixed to the first moving member, and the other image pickup device may be provided on the second moving member. In this case, The one imaging device images the moving electronic component, and the other imaging device images the electronic component based on the image forming light reflected by the reflecting device. Therefore, as the image pickup device fixed to the first moving member, a large number of image pickup elements are arranged in a straight line in the first movement direction, and one line of data is formed every time the electronic component moves by one pitch, A line sensor that obtains a two-dimensional image of an electronic component by reading the image linearly and moving the electronic component, or a camera that has a high shutter speed and can capture a moving electronic component in the same manner as a stationary state,
A device that can take an image even when an electronic component is moving is used.

Further, when the reflecting device is a mirror provided horizontally on the X-axis slide 50, a special mirror 360 as shown in FIGS. 13 and 14 may be used. Mirror 36
0 is provided with a large number of inclined mirror surfaces 362 that are gently inclined with respect to the horizontal plane, as shown in FIG. 14 in an enlarged manner. The light is reflected in a direction inclined with respect to a vertical plane including the center line of the component 44, and the CCD is parallel to the direction of the reflection.
By providing the camera 364, a front image of the electronic component 44 can be obtained.

In such a device having one image pickup device and one reflection device, it is possible to fix both to the first moving member. If the reflection device is provided, the installation position of the image pickup device can be changed by changing the reflection direction of the image forming light of the reflection device, and it is possible to provide it at a place where there is an installation space. There are advantages.
The imaging device will image the electronic component based on the image forming light from the reflecting device. Since the imaging device and the electronic component move relative to each other, the image of the electronic component also moves. Therefore, the image pickup device may include a line sensor, a camera with a high shutter speed, or the like.
A device is used that can take an image without stopping the movement of electronic components.

Further, the image pickup system may be provided with only the image pickup device attached to the first moving member, and the cost of the image pickup system can be reduced.
Even in such a case, the imaging device will image the moving electronic component when the electronic component passes through. Therefore, as the image pickup apparatus, the above-described line sensor, camera having a high shutter speed, or the like is used. In this case, since the second moving member is light and has a small inertia, the moving speed can be increased and the mounting speed can be improved. The inertia of the first moving member to which the imaging device is fixed is increased, but this is the same even when the imaging device is fixed to the second moving member, and if the inertia can be reduced only by the second moving member, it is more advantageous. is there. For example, when the moving distance in the second moving direction is larger than the moving distance in the first moving direction, there is a benefit if the inertia of the second moving member can be reduced and the moving speed can be increased. Since the imaging device is provided on the first moving member and only moves in the first moving direction, the effect that wiring is easier compared to the case where the imaging device moves in both the first moving direction and the second moving direction is also provided. can get.

As described above, at least one of the image pickup device and the reflection device of the image pickup system can be fixed to the first moving member originally required for moving the electronic component. This eliminates the need for a dedicated moving device or the like for positioning the imaging system in the movement path of the electronic component, and allows the electronic component to be mounted quickly and the electronic component mounting device to be inexpensive. Obtainable.

In each of the above embodiments, the component holding unit 80 can be moved to an arbitrary position within the horizontal plane by a combination of linear movement in the X-axis direction and linear movement in the Y-axis direction. , May be moved to an arbitrary position in the horizontal plane by a combination of rotation and linear movement.

For example, as shown in FIG. 15, a rotating arm 370 as a first moving member is provided rotatably around the axis of a vertical shaft 372, and a moving device (not shown) is provided on the rotating arm 370. A slide 374 as a second moving member that can be moved in the longitudinal direction of the rotating arm 370 is provided, and the component holding unit 37 is provided on the slide 374.
6 and a CCD camera 378 are provided.
And the slide 374 is moved to an arbitrary position in the horizontal plane.

The rotating arm 370 is used for the electronic component supplying device 3.
The length between the electronic component supply device 380 and the printed circuit board 20 is within a range of rotation between the electronic component supply device 380 and the printed circuit board 20. In addition, a prism 382 is provided between the electronic component supply device 380 of the rotation arm 370 and the printed circuit board 20.

When mounting electronic components, the component holding unit 3
76 is moved to each component supply position of the electronic component supply device 380 by the rotation of the rotation arm 370 and the movement of the slide 374 to suck the electronic component, and then moved to each component mounting position of the printed circuit board 20. And mount electronic components. At this time, the component holding unit 376 always passes over the prism 382 provided on the rotating arm 370, and
The D camera 378 captures an image of the electronic component as if it were stationary.

In the above embodiment, the electronic components are supplied by both the cartridge type electronic component supply device 26 and the tray type electronic component supply device 28.
Although two prisms 270 are provided, electronic components may be supplied by only one of the electronic component supply devices 26 and 28, and only one prism 270 may be provided.

Further, in the above embodiment, the tray suction head 200 sucks the component tray 34 by the negative pressure generated by the jet of the compressed air, but like the large component suction head 90, the negative pressure source. The component tray 34 may be sucked by the negative pressure supplied from. Further, it may be held by suction by a magnetic force of a magnet, gripping by a chuck, piercing by a skewer-like member, or the like.

Furthermore, in the above embodiment, the electronic component 4 is used.
In order to keep the distance of constant low speed movement just before holding or mounting 4, the acceleration pattern and the deceleration pattern were made constant, and the distance moved at a constant high speed was changed. ， By changing the deceleration pattern, the distance of constant low speed movement can be made constant. In particular, this is effective when the lower end position greatly changes, such as when electronic components are supplied from a component tray. For example, when the descending end position changes in a direction in which the descending distance becomes longer, the acceleration distance can be increased and the descending can be performed quickly.

Further, in the above embodiment, the solenoid 1
No. 14 is excited when the elevating slide 120 is accelerating to descend, and attracts the large component suction head 90 to the elevating slide 120, and is demagnetized to release the attraction force except when accelerating to descend. However, when the descending acceleration is smaller than the gravitational acceleration, it is not indispensable to pull it by excitation, and at least during the descending acceleration is larger than the gravitational acceleration, the component holding unit 80 is integrally lowered with the elevating slide 120 by exciting. You can Further, the solenoid 114 is provided at least when the large component suction head 90 comes into contact with the electronic component 44, and also when the electronic component 4 is used.
It suffices that the lifting slide 120 be separated from the large component suction head 90 by being demagnetized when 4 comes into contact with the printed circuit board 20. The component suction head attracting means exerts an attractive force that attracts the component suction head to the elevating member while at least the descending acceleration of the elevating member is greater than the gravitational acceleration, and cancels the attracting force at least temporarily during the other period. It should be done.

Further, the component suction head attracting means is not limited to the solenoid 114, and various means such as applying an attractive force by negative pressure can be adopted.

Further, in the above embodiment, the first and second head support bases 250 and 252 have the head fitting holes 254 and 25.
The component suction heads 90, 194, 196 and the like are fitted to and supported by the 6 in FIG. 6, but various types are possible, for example, by providing an openable / closable claw member on the head support to hold each component suction head or the like. Can be supported in the form of

Further, although the head supporting base is provided horizontally, it may be provided in another posture such as vertical, and it is movably provided on the substrate conveyor 22 and the head is supplied on the substrate conveyor 22. Supply position and board conveyor 22
You may make it move to the evacuation position withdrawn from the top.

In the above embodiment, the component suction heads 90, 194, 196, which are holding heads, are detachably held by the holder 92 and attached to the Y-axis slide 60 which is the second moving member. The holding head may be detachably held directly on the second moving member.

Further, in the above embodiment, the cartridge-type electronic component supply device 26 is provided in a fixed position, but the electronic component 44 is supplied by moving it in the X-axis direction, the Y-axis direction or both the X-axis and Y-axis directions. You may do it.

Further, in each of the above embodiments, only one holding head is provided on the second moving member, but a plurality of holding heads may be provided to form a multi-head. Also in this case, for example, the reflecting device is capable of reflecting light forming an image of all electronic components held by the multi-head, and
If the image pickup device is a CCD camera capable of capturing images of all the electronic components at a time or a line sensor capable of reading images of all the electronic components arranged in the first movement direction at a time, one holding head is used. It can be imaged in the same manner as.

Furthermore, the present invention can be carried out by a combination of the various embodiments described above. In addition, without departing from the scope of the claims, the present invention can be implemented in various modified and improved forms based on the knowledge of those skilled in the art.

[Brief description of the drawings]

FIG. 1 is a side view (partial cross-section) showing an electronic component holding device, which is an embodiment common to the inventions of claims 1 and 2, together with an imaging system.

FIG. 2 is a front view (partial cross section) showing a component holding unit of the electronic component holding device together with a lifting device and a rotating device.

FIG. 3 is a front sectional view showing a suction head and a holder of the component holding unit.

FIG. 4 is a front view (partially sectional view) showing a second head support base that supports the suction head.

FIG. 5 is a front sectional view showing a tray holding head provided in an electronic component mounting device together with the electronic component holding device.

FIG. 6 is a front view showing an electronic component mounting device including the electronic component holding device.

FIG. 7 is a side view showing the electronic component mounting apparatus.

FIG. 8 is a plan view showing the electronic component mounting apparatus.

FIG. 9 is a block diagram of a control device that controls the electronic component mounting device.

FIG. 10 is a diagram illustrating setting of a notch of a shutter and a length of a reflecting surface of a prism in a Y-axis direction which constitute an imaging system of the electronic component mounting apparatus.

FIG. 11 is a diagram illustrating control of the descending speed of the component holding unit when the electronic component mounting apparatus mounts an electronic component.

FIG. 12 is a front view showing an imaging system different from the imaging systems of FIGS. 1 and 10.

FIG. 13 is a front view showing still another imaging system.

FIG. 14 is an enlarged view showing a mirror which constitutes the imaging system shown in FIG.

FIG. 15 is a plan view showing an electronic component mounting apparatus different from the electronic component mounting apparatus.

[Explanation of symbols]

20: Printed circuit board 26: Cartridge type electronic component supply device 28: Tray type electronic component supply device 4
4: Electronic component 46: Electronic component mounting device 50: X
Shaft slide 54: Nut 56: Ball screw
58: X-axis servo motor 60: Y-axis slide 6
4: Ball screw 66: Nut 68: Y-axis servo motor 80: Component holding unit 88: CCD camera 90: Component suction head (large component suction head)
92: Holder 270: Prism 310: Controller 350: Mirror 352: CC
D camera 360: mirror 364: CCD camera 370: rotating arm 374: slide 37
6: Component holding unit 378: CCD camera 3
80: Electronic component supply device 382 Prism

Claims (2)

[Claims] 1. A suction head for sucking and holding an electronic component by negative air pressure, and an air pressure supply device capable of selectively supplying positive air pressure, negative air pressure, and atmospheric pressure to the suction head. When the suction head is caused to release the electronic component, the air pressure supply device is provided with a release control means for temporarily changing the negative air pressure supply state to the positive air pressure supply state and then to the atmospheric pressure supply state. Electronic component holding device. 2. The adsorption device, wherein the air pressure supply device selectively uses a negative pressure source, a positive pressure source, an atmosphere communicating portion, and any one of the negative pressure source, the positive pressure source, and the atmosphere communicating portion. The electronic component holding device according to claim 1, further comprising a switching valve device that communicates with the head.