JPH08242070A - Solder ball mounting device and its solder ball supply device - Google Patents

Abstract

PURPOSE: To surely align solder balls and mount them on packages by sucking and aligning solder balls supplied from above in an array on a table and inverting them, dropping solder balls stored in an upper side of a table, transferring them to a supply container and collecting overflown excess balls. CONSTITUTION: Solder balls B stored in a supply container 41 are supplied to an alignment table 25 properly and are aligned in an array on the alignment table 25. Excess solder balls overflow from the alignment table 25 and are received by a collection container 42 and are transferred to the supply container 41 from the collection container 42 by a transfer means 43. Meanwhile, the alignment table 25 sucking aligned solder balls is inverted by an inversion mechanism 21 and solder balls are mounted on a printed board while they are aligned. Solder balls are supplied from the supply container 41 to the alignment table 25 by dropping and excess solder balls are received by the collection container 42 in a lower side of the alignment table 25. Therefore, a supply/ collection system can be made by a simple structure.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder ball mounting device for forming bumps with solder balls and a solder ball supply device for the same.

[0002]

2. Description of the Related Art Conventionally, a solder ball mounting device of this type is known, for example, as shown in FIG. As shown in the figure, the solder ball mounting apparatus 101 includes an aligning unit 102 for aligning and supplying the solder balls B, and a package P for aligning and supplying the solder balls B supplied from the aligning unit 102.
And a mounting unit 103 to be mounted (mounted) on. The mounting unit 103 includes a slide base 111 provided on a base so as to be movable back and forth, a reversing mechanism 112 fixed on the slide base 111, and a package mounting table 113 provided on the slide base 111 so as to be vertically movable. There is. The reversing mechanism 112 includes a support base 114 and the support base 1
A reversing arm 115 rotatably attached to 14;
Alignment table 11 fixed to the tip of the reversing arm 115
6, the alignment table 116 is provided with a large number of suction holes 116a that match the solder ball mounting pattern (generally in a matrix) of the package P. Solder balls B supplied from the alignment unit 102
Is sucked into the large number of suction holes 116a without leakage, and is rotated and transferred to the package P set on the package mounting table 113 by the rotation of the reversing arm 115, and the suction is released to be mounted on the substrate surface.

On the other hand, the alignment unit 102 conveys the holding container 121 for holding the solder balls B and the solder balls B in the holding container 121 to the above-mentioned alignment table 116 and collects the excess solder balls B from the alignment table 116. It is provided with various transfer devices 127, 128, 129 for carrying out the above, and an alignment head 122 for aligning the solder balls B supplied from the storage container 121 on the alignment table 116. The holding container 121 has a stock portion 123 for holding the solder balls B in the lower portion, a supply portion 125 having a fixed amount cup 124 in the middle portion, and an excess solder ball B and the stock portion 123 collected from the alignment head 122 in the upper portion. Quantitative cup 124 while dancing with the solder ball B supplied from
Each of the collecting units 126 is provided to send to.

The solder balls B in the stock section 123 are floated up by the air blown from the outside, and in this state, they are sent from the stock section 123 to the recovery section 126 by the internal transfer device 127. In the collecting unit 126, the stock unit 1
The solder balls B fed from 23 and the solder balls B collected are joined so as to be blown up, further fall, and are fed to the fixed amount cup 124 of the supply unit 125.
The solder balls B accumulated in the fixed amount cup 124 are floated up by the air blown from the outside, and in this state, they are conveyed by air to the alignment head 122 by the external conveying device 128. The alignment head 122 is provided with an alignment chamber 122a in close contact with the alignment table 116, and the solder ball B is agitated by the air blown into the alignment chamber 122a while being sucked into each suction hole 116a of the alignment table 116 by air suction. To be done. When it is confirmed by the alignment inspection that the solder balls B have been adsorbed by all the adsorption holes 116a, the surplus solder balls B are blown up again, and this time, the retrieving / conveying device 129 causes the retrieving unit 126 of the storage container 121. Is transported by air.

On the other hand, the solder balls B are charged (static electricity) by friction due to transportation and adhere to the inner wall of the storage container 121 and the inner surfaces of various transportation hoses, which becomes a great obstacle in transportation. Therefore, in the above-described alignment unit 102, the storage container 121 is made of a metal container, and the solder balls B are blown up as the solder balls B are transported.

[0006]

In such a conventional solder ball mounting device, the solder balls B are arranged on the alignment table 11 as shown in FIG.
6, the alignment unit 102 has an extremely complicated configuration in order to supply the excess solder balls B and to collect the excess solder balls B, which causes a problem of cost increase. Further, since the supply / recovery system of the alignment unit 102 has a closed circuit configuration, there is a problem that the solder balls B cannot be replenished during the operation of the apparatus. Further, since the solder balls B are easily charged during transportation, even if the holding container 121 is made of a metal container, the countermeasure against static electricity is not sufficient.

The present invention makes it possible to replenish the solder balls during the operation of the apparatus, and also has a simple structure so that the solder balls can be surely aligned and can be surely attached to the package. The purpose is to provide a ball feeder.

[0008]

In order to achieve the above object, the present invention according to claim 1 is an alignment table which is arranged substantially horizontally and which arranges the solder balls for terminals supplied from the upper side in an array by suction. And an inversion mechanism that inverts the alignment table and mounts the solder balls adsorbed on the alignment table on the printed circuit board, and a solder ball that is arranged above the alignment table and that is stored and supplied to the alignment table by dropping. A container, a recovery container disposed below the alignment table for receiving the excess solder balls overflowing from the alignment table, and a transfer means for transferring the solder balls from the recovery container to the supply container. To do.

According to the first aspect of the present invention, the drop of the solder ball from the supply container to the alignment table is a free fall.
preferable.

The supply container is a hermetically sealed container, and the conveying means includes a vacuum suction device, a vacuum hose having one end connected to the vacuum suction device and the other end connected to the supply container, and one end. Preferably has a transport hose connected to the collection container and the other end inserted into the supply container.

In claim 3, it is preferable that the other end of the vacuum hose is connected to the upper end of the supply container and one end of the transfer hose is connected to the bottom of the recovery container.

According to any one of claims 1 to 4, a static electricity removing means for eliminating static electricity is further provided in a transfer path of the solder balls including the recovery container and the supply container and extending from the recovery container to the supply container. preferable.

In the sixth aspect of the present invention, the static electricity removing means is preferably a ground wire which is incorporated in at least the transfer hose of the recovery container, the transfer hose, and the supply container forming the solder ball transfer path.

In any one of claims 1 to 7, it is preferable that at least a part of the supply container is made of a transparent material that allows the stored solder balls to be visually recognized from the outside.

In claim 3, 4, 6, 7 or 8,
The supply container has a funnel-shaped lower part and an opening / closing gate for discharging solder balls at its lower end, which is vacuum-sucked prior to the opening / closing operation of the opening / closing gate and prior to the closing operation. It is preferable to further comprise control means for driving the device.

In any one of claims 1 to 9, it is preferable that a tilting mechanism for tilting the alignment table is further provided.

In any one of the first to tenth aspects, it is preferable to further include blow-off means for blowing off the excessive solder balls that have not been sucked from the alignment table.

In any one of the first to eleventh aspects, it is preferable that the edge portion of the collection container rises above the alignment table.

According to a thirteenth aspect of the invention, in a solder ball supply device of a solder ball mounting device for supplying a predetermined amount of the stored solder balls onto the alignment table by dropping, the solder balls are stored and the lower part is A supply container formed in a funnel shape, a vacuum suction unit connected to the upper portion of the supply container and capable of sucking air in the supply container to prevent the free fall of the solder balls, and driving the vacuum suction unit ON-O.
And a control means for FF.

In claim 14, the vacuum suction means is connected to the upper end of the upper part of the supply container,
preferable.

[0021]

According to the solder ball mounting apparatus of the first aspect, the solder balls stored in the supply container are appropriately supplied to the alignment table and aligned in an array on the alignment table.
At that time, the excess solder balls overflow from the alignment table, are received by the collection container, and are transported (recovered) from the collection container to the supply container by the transport means. On the other hand, the alignment table on which the solder balls are attracted in the aligned state is inverted by the inversion mechanism, whereby the solder balls are mounted in the aligned state on the printed circuit board. In this case, the solder balls are supplied from the supply container to the alignment table by dropping from the upper side, and the excess solder balls at that time are received by the recovery container under the alignment table, so that the supply and recovery system can be simplified. Can have a different structure. Also, since this supply / recovery system has an open circuit structure that is open to the atmosphere,
By simply inserting the solder balls into the recovery container, the solder balls can be replenished without stopping the operation of the entire apparatus.

According to the solder ball mounting apparatus of claim 2,
Since the solder balls drop from the supply container to the alignment table by free fall, the structure can be further simplified as compared with the forced drop.

According to the solder ball mounting device of claim 3,
The transfer means includes a vacuum suction device, a vacuum hose having one end connected to the vacuum suction device and the other end connected to a supply container, and a transfer hose having one end connected to the collection container and the other end inserted into the supply container. By configuring with a hose, the air inside the supply container is evacuated by the vacuum suction device via the vacuum hose, so that the solder ball can be removed from the recovery container via the transfer hose without clogging. Can be transported to. Further, since the upper part of the recovery container is opened, the solder balls can be easily replenished in the supply container by inserting the solder balls from here.

According to the solder ball mounting apparatus of claim 4,
The other end of the vacuum hose is connected to the upper end of the supply container, and the one end of the transfer hose is connected to the bottom of the recovery container, so that the vacuum hose sucks up the solder balls in the supply container. In addition to being effectively prevented, the solder balls in the collection container can be efficiently sucked up (conveyed) by the transfer hose.

According to the solder ball mounting device of the fifth and sixth aspects, the static electricity removing means for eliminating static electricity is provided in the solder ball carrying path from the recovery container to the supply container including the recovery container and the supply container. Further, the charged solder balls can be eliminated, and clogging of the solder balls in the transport path, transport failure, supply failure, etc. can be easily eliminated.

According to the solder ball mounting apparatus of claim 7,
By configuring the static electricity removing means by a grounding wire that is included in at least the transport hose of the recovery container, the transport hose, and the supply container that configures the solder ball transport path, It is possible to eliminate the charge on the solder balls, and the charge on the solder balls can be removed efficiently and reliably. Moreover, this static electricity removing means can be achieved with an extremely simple structure. Further, if the tip of the ground wire is put into the solder ball in the supply container, it is not necessary to make the supply container a metal container.

According to the solder ball mounting apparatus of claim 8,
At least a part of the supply container is made of a transparent material that allows the stored solder balls to be visually recognized from the outside, so that the remaining amount of the solder balls in the supply container can be visually confirmed and the solder balls can be stabilized. Can be replenished. This, combined with the fact that the solder balls can be replenished during the operation of the device, works extremely effectively.

According to the solder ball mounting device of claim 9,
By providing a control means for driving the vacuum suction device prior to the opening operation of the opening / closing gate of the supply container and prior to the subsequent closing operation of the opening / closing gate of the supply container, the solder in the supply container is opened and closed during the opening and closing operations of the opening and closing gate. The ball can be slightly floated against gravity, and it is possible to prevent interference between the opening / closing gate and the solder ball, such as the solder ball being caught in the opening / closing gate. As a result, problems such as defective deformed solder balls being supplied to the alignment table can be solved without hindering the opening / closing operation of the opening / closing gate. Further, if the solder balls are prevented from dropping even if the opening / closing gate is opened, the dispensing of the solder balls can be controlled by turning the vacuum suction device on and off, and the vacuum suction device can function as the main gate. it can. That is, in a steady state, if the vacuum suction device is turned on with the opening / closing gate closed, the solder balls can be collected and replenished, and the vacuum suction device operates in conjunction with the opening / closing of the opening / closing gate. If it is turned on and off, an opening / closing gate for supplying solder balls can be configured without a barrier plate. The open / close gate in this case includes an open / close valve and an open / close cock.

According to the solder ball mounting apparatus of the tenth aspect, by providing the tilting mechanism for tilting the alignment table, the excess solder balls other than the solder balls attracted to the alignment table among the solder balls supplied to the alignment table. Only the solder balls can be easily dropped into the recovery container.

According to the solder ball mounting apparatus of the eleventh aspect, the excess solder balls that are not adsorbed are blown off from the alignment table, and the excess solder balls on the alignment table are collected in the recovery container. It can be dropped easily. If the tilting mechanism is also used, only the excess solder balls on the alignment table can be reliably dropped into the recovery container.

According to the solder ball mounting apparatus of the twelfth aspect, since the edge portion of the recovery container rises above the alignment table, the solder balls bound on the alignment table at the time of supply by free fall. Does not fall out of the collection container, and during the above-mentioned blow-off,
The solder balls do not drop out of the collection container, and the solder balls can be collected without leakage.

According to the solder ball supply apparatus of the thirteenth aspect, when the control means turns on the drive of the vacuum suction means to suck the air in the supply container, the solder ball is prevented from falling against gravity. . On the other hand, when the drive of the vacuum suction means is turned off from this state, the solder balls drop from the supply container onto the alignment table due to their weight. That is, ON-OFF of the vacuum suction means functions as a gate, a valve, a cock or the like for controlling the supply of solder balls. This allows
A gate without a barrier plate (a valve without a valve seat, a cock) can be configured, the solder balls can be smoothly supplied, and the solder balls can be prevented from being damaged.

According to the solder ball supply device of the fourteenth aspect, since the vacuum suction means is connected to the upper end of the upper portion of the supply container, even if the suction force of the vacuum suction means is strong, vacuum suction is performed. The means can effectively prevent the solder balls in the supply container from being sucked up.

[0034]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A solder ball mounting device according to an embodiment of the present invention will be described below with reference to the accompanying drawings. In addition,
In order to facilitate understanding, a preferred example of a package (device) on which solder balls are mounted by the present device will be described first. FIG. 3 is a sectional view of this package, and FIG. 4 is a rear view thereof. As shown in both figures, this package P is a surface mount type BGA package, and an IC chip Pb is sealed on the surface of the printed circuit board Pa by a mold resin Pc. Printed circuit board P
A large number of solder bumps Pd which form terminals are mounted in a matrix on the back surface of a.
Is configured by mounting the solder balls B on the flux applied to each land of the printed circuit board Pa and reflowing the solder balls B.

Mounting patterns for mounting the solder bumps Pd in an array form include the matrix (lattice) type and the stagger (staggered) type, both of which are capable of multi-terminals and wide pitches, so-called recent multi-pin type. At Q
It is superior to FP (Quad Flat Package). Further, the mounting areas of the solder bumps Pd are arranged in the entire area of the printed board Pa as shown in FIG. 4 and arranged in the peripheral portion of the printed board Pa. The latter is particularly suitable for a cavity down type package. Has been adopted. In this explanation, plastic B
Although GA is taken as an example, BG adopting other package structure
It goes without saying that there are various types of A, for example, ceramic BGA and BGA based on TAB film.

In the solder ball mounting apparatus of the embodiment, the solder balls B forming the above-mentioned solder bumps Pd are mounted on a printed circuit board Pa to which flux is applied (actually, it is manufactured as a device at this time) Pa. (Mounting), the solder balls B having a predetermined number of pins (number of terminals) are arranged in advance in an array (matrix), and the solder balls B are collectively mounted on the printed circuit board Pa. . FIG. 1 is a side view showing the overall configuration of a solder ball mounting device of an embodiment, and FIG. 2 is an enlarged view of the main part thereof.

As shown in both figures, the solder ball mounting apparatus 1 includes an aligning unit 2 for aligning and supplying the solder balls B.
A mounting unit 3 for mounting the solder balls B aligned and supplied from the alignment unit 2 on the printed circuit board Pa of the package P, and a vacuum suction unit (vacuum suction device) 4 appropriately connected to the alignment unit 2 and the mounting unit 3.
A compressed air supply unit (compressed air supply device) 5 connected to the mounting unit 3 and these vacuum suction units 4
And a controller (control means) 6 for controlling the compressed air supply unit 5, to which a camera unit 7 for image recognition, a syringe 8 for flux supply, and a work feed cylinder 9 for serving as a flux squeegee and a work feed. And a suction cylinder 10 for transferring a work is mounted.

The aligning unit 2, the camera unit 7, the syringe 8, the work feed cylinder 9 and the suction cylinder 10 are horizontally mounted on a support plate 12 of a orthogonal type three-axis robot 11. Thus, it is configured to be movable in the X-axis direction (forward and backward with respect to the plane of the drawing), the Y-axis direction (left and right in the drawing) and the Z-axis direction (up and down in the drawing). The control of the vacuum suction unit 4 and the compressed air supply unit 5 by the controller (control means) 6 is specifically provided on a hose connecting the vacuum suction unit 4 and the compressed air supply unit 5 to each device. This is performed by turning on and off the solenoid valve 13.

In the embodiment, several (3 to 4) packages P mounted with the IC chip Pb are carriers (not shown).
The carrier is housed in a magazine (not shown) and supplied to the solder ball mounting device 1. In the solder ball mounting device 1, the suction cylinder 10 that is moved by the triaxial robot 11 transfers the carrier on which the package P is mounted from the magazine to the mounting unit 3. Here, a mask (not shown) is set on the carrier, and flux is supplied thereto from the syringe 8. Next, the work feed cylinder 9 performs a squeegee operation by the triaxial robot 11, and flux is simultaneously applied to all the packages P mounted on the carrier via the mask.

When the application of the flux is completed, the work feed cylinder 9 moves the first package P through the carrier.
To the appropriate position. Next, the solder balls B are supplied from the supply container 41 of the alignment unit 2 to the alignment table 25 of the mounting unit 3. When the image of the alignment of the solder balls B on the alignment table 25 is recognized by the camera unit 7, the alignment table 25 is inverted and the solder balls B are mounted on the package P. The image of the solder ball B mounted on the package P is again recognized by the camera unit 7, and the mounting of the solder ball B on the first package P is completed here. Next, the work feed cylinder 9
The next package P is moved to an appropriate position via the carrier, and the same operation as described above is performed. In this way, when the solder balls B are mounted on all the packages P mounted on the carrier, the suction cylinder 10 operates to transfer the carrier to the reflow-side transfer device.

Next, the main part of this embodiment will be described in detail.

The mounting unit 3 is composed of a reversing mechanism 21 fixed on the base 14, and a work mounting table 22 arranged on the base 14 side by side with the reversing mechanism 21. The reversing mechanism 21 includes a support base 23, a reversing arm 24 rotatably attached to the support base 23, and an alignment table 25 removably attached to the tip of the reversing arm 24. The package P is provided on the work placement table 22.
A work table 28 that adsorbs (sets) a carrier on which is mounted is provided.
It is arranged at a position facing the alignment table 25, which is reversed by the reversing arm 24. A guide groove is formed in the work table 28 so that the carrier and the package P can be guided.

A large number of array-shaped suction holes 26 are formed on the alignment table 25 so as to match the solder ball mounting pattern (see FIG. 4). Below the alignment table 25, suction connected to the vacuum suction unit 4 is performed. Mouth 27 is facing. Solder balls B falling from the supply container 41
Are adsorbed by the respective adsorption holes 26 and are thus arranged in an array. On the upper surface of the alignment table 25, the supplied solder balls B are easily rolled and attracted to the suction holes 26, and when the excess solder balls B are dropped, for example, when the alignment table 25 is tilted inside the recovery container 42. The solder balls B are formed flat so that they can easily fall.

The reversing arm 24 is, by an internal device (tilting mechanism) of the mounting unit 3, a reference position which horizontally faces the supply container 41, and a mounting position which horizontally rotates upward by 180 degrees and horizontally faces the work table 28. , Is pivoted between a tilted position that pivots slightly downward from the reference position. A barrier plate 29 is erected at an intermediate position of the reversing arm 24,
The solder balls B dropped on the alignment table 25 are prevented from bouncing and dropping to the support base 23 side. Also,
On the front surface of the barrier plate 29, a blowout port (blowing means) 30 connected to the compressed air supply unit (blowing means) 5 is formed, and the surplus solder balls B on the alignment table 25 are
When the reversing arm 24 is rotated to the tilted position, the air outlet 30
The air is blown off from the aligning table 25 and is reliably blown off from the aligning table 25.

On the other hand, the alignment unit 2 stores the solder balls B and supplies the solder balls B to the alignment table 25 of the mounting unit 3, and the excess solder balls B on the lower side of the alignment table 25. Collection container 4 to receive
2 and a transfer means 43 for transferring the solder balls B from the recovery container 42 to the supply container 41. The transfer means 43 includes the above-described vacuum suction unit 4, a vacuum hose 44 having one end connected to the vacuum suction unit 4 and the other end connected to the supply container 41, and one end connected to the recovery container 42 and the other end supplied. It is composed of a transfer hose 45 inserted into the container 41. The supply container 4 for the vacuum hose 44
It is preferable that the connection position to No. 1 and the connection position of the transfer hose 45 to the collection container 42 are the upper end and the bottom, respectively, but the present invention is not limited to this. That is, the vacuum hose 44 does not suck the solder balls B in the supply container 41, and the transfer hose 45 can appropriately suck the solder balls B in the recovery container 42. , It does not matter the connection position of each. The supply container 41, the recovery container 42, and the transfer hose 45 are attached to the support plate 12 of the triaxial robot 11 and are movable in the X, Y, and Z directions.

The supply container 41 has a glass container body 51 having a funnel-shaped lower half, a cap 52 for sealing the upper end of the container body 51, and a supply nozzle 53 connected to the lower portion of the container body 51. And a cock (opening / closing gate) 54 interposed in the middle of the supply nozzle 53, and an air cylinder 55 that opens and closes the cock 54. Cap 5
2, the other end of the vacuum hose 44 is connected so as to penetrate therethrough, and the other end of the transfer hose 45 is connected so as to be penetrated deeply. As a result, when the vacuum suction unit 4 is driven and the air in the container body 51 is sucked while the cock 54 is closed, the air flows from the collection container 42 to the container body 51 via the transfer hose 45. , Collection container 4
The solder balls B in 2 are conveyed into the container body 51.

The air cylinder 55 is connected to the vacuum suction unit 4 and reciprocates using the vacuum suction unit 4 as a drive source. The air cylinder 55 and the handle 54a of the cock 54 are connected via a link 56,
The cock 54 is opened and closed by the reciprocating motion of the air cylinder 55. In this case, by opening the valve of the cock 54, the solder balls B of the container body 51 are supplied (dropped) to the alignment table 25, but in reality, the controller 6 opens and closes the inside of the container body 51. Solder balls B are supplied in conjunction with the suction and stop of suction of air.
Specifically, after the suction of air is started (driving of the vacuum suction unit 4 is ON), the cock 54 is opened, and then the suction of air is stopped (driving of the vacuum suction unit 4 is OFF). Ball B is paid out. When the predetermined amount of solder balls B are dispensed, the suction of air is opened again, the cock 54 is subsequently closed, and the suction of air is stopped.

That is, the suction of air is started and the cock 5
As the valve 4 is opened, air flows in from the tip of the supply nozzle 53, and the solder ball B floats against gravity. When the suction of air is stopped after the cock 54 is fully opened, the weight of the solder ball B is discharged from the supply nozzle 53. When the suction of air is started again, the solder ball B is blown up by the air flowing in from the supply nozzle 53, and its fall is prevented. in this way,
When the cock 54 is opened / closed, the solder ball B moves to the cock 5.
Since it is floated from the valve seat of No. 4, it is possible to prevent the solder ball B from being caught in the valve seat. Therefore, it is possible to prevent the open / close failure of the cock 54, prevent particularly mechanical damage to the solder ball B, and reliably prevent the failure of the device and the mounting failure of the solder ball B.

The recovery container 42 has a so-called hopper shape with an open top, and is made of metal such as stainless steel or aluminum. The bottom of the recovery container 42 is a deep groove, and the above-mentioned transfer hose 4 is provided in the deep groove.
5 is connected. The upper edge of the recovery container 42 is arranged at a position higher than the alignment table 25, and the supply container 4
The solder balls B dropped from No. 1 and bound at the alignment table 25 are prevented from jumping out of the recovery container 42. Although not shown in the drawing, the supply nozzle 53 and the alignment table 25 are provided in the upper open portion of the collection container 42.
A net is stretched so as not to interfere with the above, so that the excess solder balls B can be captured in the recovery container 42 without leakage. In addition, the replenishment of the solder balls B to the supply container 41 is performed by operating the conveying means 43, and
Replenish from 2.

On the other hand, the transfer hose 45 has a ground wire (metal wire) 46 which constitutes static electricity removing means, one end of the ground wire 46 is connected to the recovery container 42, and the other end is a transfer hose. It is hung from 45 and buried in the solder ball B in the supply container 41. In this case, it is preferable that the transport hose 45 is made of a flexible resin (for example, a silicon hose) and the ground wire 46 is made of a bare copper wire, but the transport hose 45 is not limited as long as it has flexibility. It does not matter whether it is a conductive member or a non-conductive member, and the earth wire 46 does not matter as to its material or sectional shape as long as it has conductivity. For example, a conductive member may be internally attached to a part or all of the inner surface of the transfer hose 45, or this may be used in combination with the ground wire 46.

In this embodiment, one earth wire 46 is inserted through the transfer hose 45, but in this case, considering that the solder ball B is vacuum transferred, the following conditions are satisfied. It is preferable. The inner diameter of the hose exceeds the solder ball diameter + the ground wire diameter. The inner diameter of the hose is about 1.5 to 2.0 times the diameter of the solder ball. The inner diameter of the hose should be about the solder ball diameter + the ground wire diameter + 0.3 mm. When this is shown by a specific numerical value, when the diameter of the solder ball B is 0.5 to 1.0 mm, the inner diameter of the transfer hose 45 is 1.5 to 2.0 m.
m, and the ground wire diameter is about 0.2 mm.

By adopting such a configuration, the solder balls B can be smoothly transported, and even if the solder balls B are charged, the recovery container 42, the support plate 12,
The three-axis robot 11 and the base 14 are grounded in this order, and the solder balls B can be prevented from adhering to the inner surface of the transfer hose 45 and the inner walls of the supply container 41 and the recovery container 42 due to static electricity. This effectively prevents clogging of the solder balls B, defective supply, and the like, and does not hinder the supply of the solder balls B due to free fall. Also,
The supply container 41 itself can also be configured by a glass container (plastic can be used) whose inside can be visually recognized, and does not need to be a metal container.

Here, the mounting operation of the solder ball B will be briefly described with reference to FIG. When the rotating arm 24 is rotated to the reference position and the flux coating of the package P is completed, the air suction of the alignment table 25 is started and the transport means 43 is operated (air suction of the supply container 41). Next, the cock 5 with the air cylinder 55
4 is opened, the transportation means 43 is stopped, and the solder balls B are dropped onto the alignment table 25. At that time, 3
The axis robot 11 slightly moves the supply container 41 back and forth and left and right, and the solder balls B are uniformly dropped (scattered) on the alignment table 25. Next, after the transporting means 43 is operated again, the cock 54 is closed.

Here, the alignment table 25 is rotated to the tilted position, and air is blown from the air outlet 30 of the barrier plate 29 to drop the excess solder balls B on the alignment table 25 into the recovery container 42. Next, the camera unit 7 faces the alignment table 25 that has returned to the reference position, and it is confirmed whether or not the solder balls B are aligned. On the other hand, before and after this, the transfer means 43 is activated, and the solder balls B recovered in the recovery container 42 are supplied to the supply container 4 via the transfer hose 45.
1 is transported. When the alignment of the solder balls B is confirmed,
The three-axis robot 11 causes the supply container 41 and the camera unit 7 to escape from the position of the reversing arm 24, and the reversing arm 2
4 rotates to the mounting position. Here, the suction of the alignment table 25 is stopped, so that the solder balls B are attached to the flux and mounted on the package P. Then, when the number of solder balls B in the supply container 41 becomes low during the repetition of these operations, the recovery container 42 is replenished with the solder balls B.

As described above, according to this embodiment, the solder balls B are allowed to fall freely from the supply container 41 to the alignment table 2.
5, the alignment unit 2 can have an extremely simple structure. Further, the solder balls B can be replenished by simply putting the solder balls B into the recovery container 42, and the replenishment can be easily performed without stopping the operation of the apparatus. Furthermore, the charged solder balls B can be discharged with a simple structure. In addition, the solder ball B conveying means 43 can also serve as a substantial supply gate of the supply container 41, so that the solder ball B can be prevented from being damaged and the device configuration can be simplified in this respect as well. Therefore, a device with few failures and good yield can be constructed at low cost.

Although the glass container is used as the supply container in this embodiment, the material and structure thereof are not limited as long as the inside can be visually confirmed and the solder balls can be dropped. Needless to say, the present apparatus can be applied to the formation of solder bumps such as flip chips in addition to BGA.

[0057]

As described above, according to the solder ball mounting apparatus of the present invention, since the solder balls are supplied to the alignment table by free fall, the apparatus can be extremely simplified and the apparatus can be operated. Further, the solder balls can be replenished, the handling becomes good, and the cost can be reduced. Further, since the solder balls in the supply container can be visually recognized, the handling becomes good also in this respect. further,
By the static electricity removing means, the solder balls can be transported smoothly, and the reliability of the device can be improved.

Further, according to the solder ball supplying apparatus of the present invention, the solder balls can be smoothly supplied to the alignment table without damaging the solder balls, so that the solder balls can be reliably aligned and packaged. It is possible to surely mount the package, and it is possible to improve the yield of the package.

[Brief description of drawings]

FIG. 1 is a side view showing the overall configuration of a solder ball mounting device according to an embodiment of the present invention.

FIG. 2 is an enlarged side view around the supply container of the solder ball mounting device according to the embodiment.

FIG. 3 is a cross-sectional view of a semiconductor device including a BGA package.

FIG. 4 is a back view of a semiconductor device including a BGA package.

FIG. 5 is a side view showing the overall configuration of a conventional solder ball mounting device.

[Explanation of symbols]

 1 Solder Ball Mounting Device 2 Alignment Unit 3 Mounting Unit 4 Vacuum Suction Unit 5 Compressed Air Supply Unit 6 Controller 21 Inversion Mechanism 24 Inversion Arm 25 Alignment Table 30 Air Outlet 41 Supply Container 42 Recovery Container 43 Conveying Means 44 Vacuum Hose 45 Conveying Hose 46 Ground wire 54 Cock B Solder ball P package

Claims (14)

[Claims] 1. An alignment table that is arranged substantially horizontally and that aligns the solder balls for terminals supplied from the upper side in an array by suction, and a solder ball that is reversed from the alignment table and is attracted onto the alignment table. A reversing mechanism for mounting on a printed circuit board, a supply container arranged on the upper side of the alignment table and supplying stored solder balls to the alignment table by dropping, and arranged on the lower side of the alignment table, A solder ball mounting device comprising: a recovery container for receiving an excess solder ball overflowing from the alignment table; and a transfer means for transferring the solder ball from the recovery container to the supply container. 2. The solder ball mounting apparatus according to claim 1, wherein the solder balls drop from the supply container to the alignment table is a free fall. 3. The supply container is a hermetically sealed container, and the transfer means includes a vacuum suction device, a vacuum hose having one end connected to the vacuum suction device and the other end connected to the supply container, and one end provided with the vacuum hose. The solder ball mounting device according to claim 1 or 2, further comprising: a transfer hose connected to a recovery container and the other end of which is inserted into the supply container. 4. The vacuum hose has the other end connected to the upper end of the supply container, and the transfer hose has one end connected to the bottom of the recovery container. Solder ball mounting device. 5. A static electricity removing unit for eliminating static electricity is further provided in a transfer path of the solder balls including the recovery container and the supply container and extending from the recovery container to the supply container. The solder ball mounting device according to 1 or 2. 6. A static electricity removing means for eliminating static electricity is further provided on a transfer path of the solder balls including the recovery container and the supply container and extending from the recovery container to the supply container. The solder ball mounting device described in 3 or 4. 7. The static electricity removing means is a ground wire which is included in at least the transfer hose of the recovery container, the transfer hose, and the supply container that constitute a transfer path of the solder balls. The solder ball mounting device according to claim 6. 8. The method according to claim 1, wherein at least a part of the supply container is made of a transparent material that allows the stored solder balls to be visually recognized from the outside. Solder ball mounting device described. 9. The supply container has a lower part formed in a funnel shape and has an opening / closing gate for discharging solder balls at a lower end part thereof, prior to and following the opening operation of the opening / closing gate. 7. A control means for driving the vacuum suction device prior to the closing operation is further provided.
7. The solder ball mounting device according to 7 or 8. 10. The solder ball mounting apparatus according to claim 1, further comprising a tilting mechanism for tilting the alignment table. 11. The solder ball mounting according to any one of claims 1 to 10, further comprising blow-off means for blowing off excess solder balls that have not been attracted from the alignment table. apparatus. 12. The solder ball mounting device according to claim 1, wherein an edge portion of the recovery container stands up above the alignment table. 13. A solder ball supply device of a solder ball mounting device, which supplies a predetermined amount of stored solder balls onto an alignment table by dropping the solder balls and supplies the solder balls having a lower portion formed in a funnel shape. A container, a vacuum suction unit that is connected to the upper portion of the supply container and that can suck the air in the supply container and prevent the solder balls from falling, and a control unit that turns ON / OFF the drive of the vacuum suction unit. A solder ball supply device for a solder ball mounting device, which is characterized by being provided. 14. The solder ball supply device for a solder ball mounting device according to claim 13, wherein the vacuum suction means is connected to an upper end portion of an upper portion of the supply container.