JP3009167B2 - Method for manufacturing semiconductor device - Google Patents

Description

Description: FIELD OF THE INVENTION The present invention relates to a method for mounting microspheres, and particularly when solder balls are joined to connection pads of a semiconductor element, the solder balls enter in the same arrangement as the pads. The present invention relates to a method of supplying and mounting solder balls to a jig having holes to be formed.

[Conventional technology]

Conventionally, as a method of supplying and aligning solder balls at predetermined positions, there is a method described in Japanese Patent Application Laid-Open No. Sho 60-52045.

It is shown in FIG. In this method, (a) a particle 9000 such as solder is placed at a position corresponding to the electrode pad 9002 of the substrate 9001.
A positioning plate 9004 having an insertion hole 9003 for inserting the same is positioned just above the electrode pad 9002 so as to match the insertion hole 9003. Thereafter, (b) the particles 9000 are positioned on the positioning plate 9004.
And apply vibration. (C) Insertion hole by the vibration
The particles 9000 are put in 9003. (d) The surplus particles 9000 are such that the positioning plate 9004 and the substrate 9001 are simultaneously tilted and eliminated.

[Problems to be solved by the invention]

In the above prior art, first, even if particles enter the positioning plate,
Because there is nothing to hold the granules, the positioning plate vibrates and the granules jump out of the hole when tilted, so the mounting success rate is low.Next, static electricity may be accumulated on the granules and the positioning plate. The body adheres to each other or may adhere to the positioning plate, making it difficult to attach to the desired amount and position, and further tilting the positioning plate makes it mechanically complicated. At the end, there is a problem that it is difficult to collect and collect the surplus particles since they flow apart.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method for mounting microparticles that can mount microparticles such as solder balls at high speed and reliably.

Another object of the present invention is to provide the granules without damaging them.
It is an object of the present invention to provide a method for mounting a granular material that can automatically mount and collect solder balls.

[Means for solving the problem]

In order to achieve the above object, the present invention supplies a large number of conductive particles to the suction surface side of a mounting jig having a through hole corresponding to a pad position of a semiconductor device by air or an inert gas flow, Attach the conductive particles to the through-hole by suctioning from the surface opposite to the suction surface of the through-hole, and if there is a mounting failure, supply and mount the conductive particles again. Then, the pad position of the semiconductor device is aligned with the conductive particles mounted on the mounting jig, and the conductive particles are transferred to the pads of the semiconductor device.

Also, a large number of conductive particles are supplied by air or an inert gas flow to the suction surface side of a mounting jig having a through hole corresponding to the pad position of the semiconductor device, and the conductive particles are provided on the opposite side of the suction surface of the through hole. Attaching the conductive particles to the through holes by suction from the surface, and if there is a mounting failure, performing a step of supplying and mounting the conductive particles again, and performing the pad position of the semiconductor device and the pad position. The conductive granules mounted on the mounting jig are aligned with each other, and the pads of the semiconductor device are pressed against the conductive granules mounted on the mounting jig, and the conductive granules are brought into contact with the semiconductor device. It is characterized in that it is transferred to a pad.

Also, a large number of conductive particles are supplied by air or an inert gas flow to the suction surface side of a mounting jig having a through hole corresponding to the pad position of the semiconductor device, and the conductive particles are provided on the opposite side of the suction surface of the through hole. Attaching the conductive particles to the through holes by suction from the surface, and if there is a mounting failure, performing a step of supplying and mounting the conductive particles again, and performing the pad position of the semiconductor device and the pad position. The conductive granules mounted on the mounting jig are aligned with each other, and the pads of the semiconductor device and the conductive granules mounted on the mounting jig are pressed against each other to imitate the conductive granules. It is characterized in that it is transferred to a pad of the semiconductor device.

Further, the present invention is characterized in that a limit is set on the number of repetitions of the step of supplying and mounting conductive particles again.

Further, the supply of the conductive particles to the mounting jig is performed by pulsating airflow or on / off of the airflow.

Also, a large number of conductive particles are supplied by air or an inert gas flow to the suction surface side of a mounting jig having a through hole corresponding to the pad position of the semiconductor device, and the conductive particles are provided on the opposite side of the suction surface of the through hole. Mounting the conductive particles in the through holes by suction from the surface, removing and collecting excess conductive particles, and if there is a mounting failure, supplying and mounting the conductive particles again. The method is characterized in that the pad position of the semiconductor device is aligned with the conductive particles mounted on the mounting jig, and the conductive particles are transferred to the pads of the semiconductor device.

Also, a large number of conductive particles are supplied by air or an inert gas flow to the suction surface side of a mounting jig having a through hole corresponding to the pad position of the semiconductor device, and the conductive particles are provided on the opposite side of the suction surface of the through hole. The conductive particles are attached to the through holes by suction from a surface, and excess conductive particles are removed and collected by vacuum suction or gas blowing, and attached to the pad position of the semiconductor device and the attachment jig. The conductive particles are aligned with each other, and the conductive particles are transferred to pads of the semiconductor device.

Also, a large number of conductive particles are supplied by air or an inert gas flow to the suction surface side of a mounting jig having a through hole corresponding to the pad position of the semiconductor device, and the conductive particles are provided on the opposite side of the suction surface of the through hole. The conductive granules are mounted in the through holes by suction from a surface, illumination light is irradiated from one side of the mounting jig, and the conductive particles are received by a light receiving element provided on the other side of the mounting jig. Inspect the presence or absence of conductive particles, and if there is a mounting failure, perform the step of supplying and mounting the conductive particles again, and check the pad position of the semiconductor device and the conductive material mounted on the mounting jig. The method is characterized in that the particles are aligned with each other, and the conductive particles are transferred to pads of the semiconductor device.

Also, a large number of conductive particles are supplied by air or an inert gas flow to the suction surface side of a mounting jig having a through hole corresponding to the pad position of the semiconductor device, and the conductive particles are provided on the opposite side of the suction surface of the through hole. Attaching the conductive particles to the through holes by suction from the surface, and if there is a mounting failure, performing a step of supplying and mounting the conductive particles again, and performing the pad position of the semiconductor device and the pad position. Aligning the conductive particles mounted on the mounting jig, transferring the conductive particles to pads of the semiconductor device, heating the conductive particles by heating means, and joining the conductive particles. And

Also, a large number of conductive particles are supplied by air or an inert gas flow to the suction surface side of a mounting jig having a through hole corresponding to the pad position of the semiconductor device, and the conductive particles are provided on the opposite side of the suction surface of the through hole. Attaching the conductive particles to the through holes by suction from the surface, and if there is a mounting failure, performing a step of supplying and mounting the conductive particles again, and performing the pad position of the semiconductor device and the pad position. Align the conductive particles mounted on the mounting jig, transfer the conductive particles to the pads of the semiconductor device, heat the conductive particles by laser irradiation,
It is characterized by joining.

[Action]

As described above, according to the present invention, a fluid is used, and a large number of fine particles are held in the holder by being disturbed by the turbulent flow of the fluid. Particles can be mounted in the amount and position of the particles.

Also, the remaining fine particles not held by the holder are
By feeding the fluid into the closed space again, the fluid can be automatically collected at high speed without damaging the granules.

Also, the granules necessary for one-time mounting are taken out by raising and lowering a ball push-up shaft having a concave portion at the tip inside a storage where a large number of granules are stored, and sent to a closed space together with a fluid. The supply operation can be performed automatically for a long time.

〔Example〕

 Hereinafter, embodiments of the present invention will be described with reference to the drawings.

 First, the outline of the main part of the present invention will be described.

FIG. 1 shows an outline of an embodiment of the present invention.
The solder ball supply and alignment method of the present invention will be described with reference to FIGS. As shown in FIG. 15, the glass jig has a hole into which the solder ball 3 enters and a small hole provided for sucking the solder ball 3 overlapped.
These holes are provided so as to match the arrangement of the connection pads of the semiconductor element 1. As shown in FIG. 1, from the stocker 5301 in which the solder balls for several hours enter, a separating section for dividing the glass jig into only the number necessary to enter all the holes in which the solder balls enter, and the upper part of the glass jig (Surface to which solder balls enter) Transfer head unit 50 with hopper (A) 5001 with a mechanism that allows close contact with the surface and a fixed volume
0 , a collection unit 560 having a container 5100 connected to a suction unit to collect the solder balls remaining in the holes of the glass jig, and a unit for controlling the compressed air pressure used for each unit, It is composed of a control system that electrically controls each operation of each unit.

As described above, the glass jig 4 is fixed so that the solder ball can be sucked (the solder ball enters) with the hole on the upper surface (2), and the transfer head 500 is inserted from the upper surface of the glass jig 4.
The hopper (A) 5001 is placed, and the necessary number of solder balls separated by the separation unit are sent to the hopper (A) 5001 by compressed air (A). At this time, since the air of the compressed air (A) is removed from the gap provided between the lower part of the hopper (A) 5001 and the glass jig, the solder balls are removed from the hopper.
The hose (B) 5021 or 5019 provided on the 5001 is stored in the hopper 5001 without going. Next, compressed air (A)
Then, compressed air (B) is sent from the hose 5019 at a predetermined pressure, and the solder balls are disturbed in the hopper (A) 5001. Due to this disturbance, the solder balls are sent into the holes (the solder balls enter) of the glass jig at a flow rate of the compressed air.
Therefore, since it is repeatedly sent in a very short time, the insertion rate into the hole is extremely high. Also, this disturbance is compressed air (B)
The same effect can be obtained even if the solder ball is fed or stopped, that is, the disturbance is stopped and the disturbance is repeated, and the solder ball is repeatedly held stationary, and the same effect can be obtained, and the time required for mounting in all the holes is reduced. Next, the solder balls put into the holes in the glass jig are adsorbed to the glass jig by the suction means described above, and the surplus remains on the upper surface of the glass jig (however, in the hopper 5001).

The remaining solder balls are collected in the collection container 5100 through the hose 5019 by the compressed air (B) into the hopper 5001.

Next, an outline of the entire apparatus including the main part of the present invention will be described with reference to FIG. Fixing the magazine 21 that are staked to the upper surface to the pallet (Figure 16) of the base 10, the magazine 21 moves up and down, pallet feed section 22 for feeding the pallet one by one, the fed pallet 20 The XY table 23, which is positioned and fixed, and moves in the X and Y directions, the semiconductor element 1 contained in the pallet 20 is taken out one by one, and the semiconductor element supply part 24 for supplying to the turntable (A) 26 is emptied. A pallet discharge unit 25 for storing the pallet 20 that has been turned, a turntable unit (A) 26 having a head for sucking the semiconductor element 1 and intermittently rotating by a predetermined angle, and a glass jig containing solder balls. 4 in the test and have the possibility and the head suction and inversion, turntable unit for intermittently rotated by a predetermined angle (B) 38, the glass jig 4 to secure the glass magazine 308 for stacking housing, between the upper and lower and A table for rotating the glass jig 4 from the glass magazine 308
Are taken out one by one, and the taken out glass jig 4 is supplied to and discharged from the turntable section (B). A glass jig supply / discharge unit 30 ; a solder ball supply unit 50 for supplying solder balls to the glass jig 4;
After the relative position between the solder ball and the pad of the semiconductor element 1 described above is adjusted by a method described later, the solder ball is melted by a laser, and the positioning portion 60 to be joined to the pad surface is joined to the solder ball. The removed semiconductor element 1 is taken out of the turntable section (B), and the pallet 21
A semiconductor discharge unit 80 to be loaded is placed.

In addition, the semiconductor element 1 which is a target work of the present invention is configured by arranging several hundred pads 2b for joining the semiconductor element body 2a (semiconductor module) and the solder balls at a pitch of 0.3 to 0.5 mm. FIG. 14 (b) shows the apparatus of the present invention for a solder ball 3 having a diameter of 0.1 to 0.5 mm connected to the pad, and FIG. 15 (a) shows a glass jig 4 used in the present invention.
As shown in FIG. 14B, a large mounting hole into which the solder ball 3 shown in FIG.
5a and a small suction hole 5b for sucking the solder ball 3 are concentrically overlapped to form a through hole. Further, it is a glass jig 4 provided in the same arrangement as the pad 2. The depth of the mounting hole 5a is determined when the solder ball 3 enters.
A predetermined amount (determined by the joining conditions) is projected from the glass body 5.

Next, a supply part of a solder ball which is a main part of the present invention,
The transfer unit, the inspection unit, and the collection unit will be described in detail with reference to FIGS. As shown in FIGS. 1 and 2 (a) and 2 (b), the solder ball supply unit 50 sucks the square pillar body 3801 (a component of the head unit 380 ) of the turntable (B) 38 described above. A transfer head unit 500 for feeding the solder ball 3 into the hole 5a of the fixed glass jig 4;
A supply unit 530 for sending a predetermined amount of the solder balls 3 to the transfer head unit 500; and a hole 5a of the glass jig 4
A collecting unit 560 for collecting the solder balls 3 that have been put in excess, a horizontal driving unit 580 that fixes the respective units and reciprocates horizontally, and whether or not all the holes are in the holes 5 a of the glass jig 4. The recognition unit 610 to be inspected comprises an air control unit for controlling the pressure of the compressed air.

The transfer head section 500 is a sectional view taken along the line BB in FIGS. 2 (a) and 2 (b) and FIGS. 3 (a) and 3 (a) which are bottom views of FIG. 3 (a). 3 (b), FIG. 4 (b) as viewed in the direction of arrows AA, and FIG. 1 (b) are top views (a).

As shown in FIG. 3 (a), all the holes 5a (in which the solder balls 3 enter) formed in the glass jig 4 are opposed to the upper surface of the glass jig 4 adsorbed on the head portion 380. A rectangular hopper (A) 5001 having a closed space 5009 having a size enough to enclose is used as closed space forming means. A cylindrical body 5008 is formed in a part of the hopper (A) 5001 and the cylindrical body is formed.
A cone 507 with a conical outer shape fitted with 5008 and a screw 50
Fixed at 06. The inclined portion of the cone 5007 is fitted with the same inclined portion as the hopper mount 5004.
The hopper (A) 5001 is provided with a compression spring 50 on the outer circumference of the cylindrical body 5007 at the same radius and at a position obtained by dividing the circumference into three equal parts.
03 and the hopper mounting base facing it
A hole 5014 is provided in 5004, and the compression spring 5003 is inserted between the holes 5002 and 5014. Thereby, the hopper (A) 5001
Usually, the inclined portion of the hopper mount 5004 and the inclined portion of the cone 5007 are brought into close contact with a constant force by the repulsive force of the compression spring 5003. In the above, hopper (A) 5001
When is lifted from the hopper mount 5004, the inclined portion of the cone 5007 and the inclined portion of the hopper mount 5004 are separated from each other and can be freely tilted only by being held by the compression spring alone.
Therefore, even if the surface of the glass jig 4 is inclined, if the hopper (A) 5001 is lifted, the bottom surface of the hopper (A) 5001 follows the inclined surface of the glass jig, and the entire surface is in close contact (constant). Pressing force).
In the lower part of the hopper (A) 5001, four grooves 5025 for allowing only the compressed air to escape (the solder balls do not pass) when the surface is in close contact with the surface of the glass jig 4 (FIG. 3A) , (B)) and a pin 5005 for regulating the rotation direction to a fixed amount are fixed to the holes (large enough not to interfere even if the hopper (A) 5001 is inclined by a predetermined amount) provided in the hopper mounting base 5004. I put it. In addition, this hopper mounting base 5005
As shown in FIGS. 4B and 4A, a commercially available slide unit 5202 that slides up and down and an air cylinder 5205 for moving a slide table 5207 of the slide unit 5202 up and down are supported by a support base 5201 ( (Fixed to the horizontal drive unit 580). As described above, the hopper (A)
5001 is normally held at a fixed position (the inclined portion of the cone 5007 and the inclined portion of the hopper mount 5004 are fitted). Next, this is lowered to bring it into contact with the upper surface of the glass jig 4, and further lowered, the hopper (A) 5001 is freely tilted, and even if the surface of the glass jig 4 is tilted, it is brought into close contact. be able to. This close contact also has a certain pressing force by the compression spring.

The hopper (A) 5001 is provided with the supply unit 530.
To put the solder ball 3 into the opening 5009
A joint (A) 5010 is provided, a supply part 530 is provided by a hose (A) 5018, and a joint (B) 5022 is provided for sending solder balls from the closed space 5009, and a hose (B) 5021 is provided.
A joint (C) 5011 is provided for connecting a compressed air source (shown in FIG. 10) with the closed space 5009 for passing the solder balls, and a hose (C) 5019 is connected to the collecting section 560.

As described above, the transfer head section 500 holds the hopper (A) 50 on the upper surface of the glass jig 4 (connected to the suction means).
When the solder ball 3 is supplied to the hopper (A) 5001 and the hopper (A) 5001 enters the hole 5 a of the glass jig 4. At this time, when a predetermined amount of air pressure is sent from the hose (B) 5021, the solder balls 3 that have entered the holes 5a are adsorbed, but those that do not enter the holes 5a due to the air pressure. In the 5001, the solder ball can be sent to the hole without the solder ball many times by rebounding, moving back and forth, right and left, and colliding with each other (this is called disturbance).
Also, compressed air can be turned on and off.

Next, the supply unit 530 is configured as shown in FIGS. 2 (b) and 2 (a).
5 is shown in FIG. 5, and FIG. 6 (b), FIG. 6 (b) is a top view of FIG. 6 (a), and FIG. 6 (a) is a top view of FIG.

In a stocker 5501 that holds hundreds of thousands of solder balls 3 (this volume is determined by the size of the solder balls and how much time it takes to make one replenishment), the place where the solder balls 3 are put into a conical shape In the center thereof, a ball push-up shaft 5306 that forms a cone at the tip and moves up and down, and a vibrator 5302 at one location on the outer periphery are provided.
It is fixed to.

As shown in FIGS. 6A and 6B, the ball push-up shaft 5306 vertically moves a commercially available slide unit 5402 and a slide table 5403 which is a vertically moving side of the slide unit 5402 on the support base 5300. An air cylinder 5406 for fixing is fixed. This air cylinder 5406
Is fixed to the slide table 5403, and the vertical shaft 5306 is moved up and down.

As described above, when the solder ball 3 contained in the stocker 5501 is raised from the position where the ball push-up shaft is most lowered as described above, the solder ball is put into the cone at the tip of the ball push-up shaft 5306 (this is (A supply amount of solder ball for one time). The vertical movement of the ball lifting shaft is repeatedly performed by an operation command (not shown) to the air cylinder 5406. When the ball push-up shaft is lowered to the lowermost end, the vibrator 5302
The vibration is applied to the solder balls 3 in the stocker 5501 so that the upper surface of the solder balls is substantially flat in the stocker.

Next, when the ball push-up shaft 5306 is raised, a hopper (B) 5507 wrapping around the tip is fixed to the support base 5300. The hopper (B) 5507 includes an opening 5503 in which the ball push-up shaft 5306 enters, a joint (D) 5507 connected to the opening 5503 (hole 5508), and a hose (D) from the transfer head 500. Connect 5018,
The solder balls can be sent from the opening 5503 to the transfer head 500 . On the other hand, the vertical shaft 5306
A joint (E) 5009 connected to a hose (E) 5510 for supplying compressed air for sending the solder ball placed on the tip of the transfer head section 500 to the transfer head section 500 is attached. As described above, the necessary amount of solder balls placed on the vertical shaft 5306 at one time enters the hopper (B) 5507 and is sent to the transfer head by compressed air. All the operations described above are continuously performed by a command (not shown).

Next, the recovery unit 560 is shown in FIG. 13 and the detailed diagram in FIG. A container 5100 formed in a cylindrical shape with one end closed and a thread cut into one end is fixed to the horizontal drive unit 580, and a lid 5106 engaged with one screw of the container 5100 is provided.
Is screwed. A joint (F) 5101 connected to a suction unit (not shown) by a hose (F) 5126, a joint (C) 5011 of the transfer head unit 500 , and a hose (C) 5019 are connected to the lid 5106. It is composed of a joint (G) 5102. The joint (F) 51
A net 5104 is wrapped around the container 5100 of 01 so that the solder ball 3 does not flow to the suction means through the joint (F) 5101.

As described above, from the transfer head section 500 , as described above, at the same time as sending the solder ball by compressed air,
Vacuum suction is performed from a joint (G) 5102 connected to the suction means (not shown), and the solder balls 3 are collected in the container 5100. The recovered solder balls 3
Removes the lid 5106, and returns to the stocker 5501
Returned to use again.

The transport of the collected balls 3 from the container 5100 to the stocker 5501 can be performed by compressed air as in the case of collecting the balls 3 from the hopper 5001 (b) from the container 5100.

The horizontal drive unit 580 is a view taken along the line EE in FIGS. 2 (a), 2 (b) and 2 (b). FIG. 8 (b) and FIG. 8 (b)
FIG. 8 (a) which is a plan view of FIG. The stocker 5501 of the supply unit 530 and the hopper (B) 5507 shown in FIG.
5300 which fixes the support, the fixed base 5301 which fixes the support 5300, and the base 5561 which supports the fixed base 5301
Rubber damping rubber 5610 (4 places) fixed to the base plate 56
In order to slide 11 horizontally, a guide rail 5612 is fixed to a mounting base 5615 (fixed to the base 10).
It is slidably engaged with 12. Two slide bases 5616 are installed. The sliding of the base plate 5611 is
It is fixed to. The lot 5614 of the air cylinder 5613 and the base plate 5611 are fixed, and the rod 5614 is moved by an operation command to the air cylinder 5613 to slide the base plate 5611.

As described above, the above-described horizontal drive unit 580 fixes the transfer head unit 500 , the supply unit 530, and the collection unit 560, moves horizontally, and prevents interference when the turntable unit (B) 38 rotates. ing.

As shown in FIG. 13 to FIG. 9 (m), the second recognition section 590 places the recognition camera 5900 on the support base 5903 directly above the glass jig 4 of the head section 380 (the base base). 10) and a lamp 5901 for illumination is provided below the head portion 380.
Is fixed to the base 10 (not shown) by a holder 5904. With the above structure, after the solder balls 3 are put into the holes of the glass jig 4 sucked by the head unit 380 by the solder ball supply unit 50 described above, the lighting lamp 59
Light at 01. At this time, it penetrates the rectangular column body 3801 of the head section 380 . One side (on the camera 5900 side) is a transparent glass jig 4 containing the solder ball 3 and one side (on the illumination light 5901 side) sandwiching the square hole (A) 3802.
Is provided with the square hole (C) 3827 provided in the flat plate 3820,
Since the transparent glass 3829 is adhered so as to cover the square hole (C) 3827, the illumination light is delivered to the camera 5900 through the head unit 380 .

As described above, the camera 5900 detects the silhouette of the solder ball 3 using transmitted light, and determines the presence or absence of the solder ball 3 by using the transmitted light.
If even one is missing, it will try again automatically.

FIG. 10 is a circuit diagram for disturbing the solder balls in the transfer head unit 500 in FIG. 3 and controlling the pressure of the compressed air for feeding the solder balls in the supply unit 530. No.
Fig. 10 shows a compressed air supply source 6001 from a compressor etc.
And a commercially available air filter 6002 for removing compressed air dust and the like, a pressure control 6003 that can arbitrarily change the pressure of the compressed air, and a compressed air with a controlled pressure when necessary. A solenoid valve 6004 for stopping is supplied from the solenoid valve 6004 to the head section 500 and the supply section 530.

As described above, the supply of the compressed air to the head section 500 and the supply section 530 can obtain a predetermined constant pressure when required (by a command from control (not shown)).

The operation of the solder ball supply unit 50 described above is a main configuration, and FIGS. 11 (t) to 11 (a) to 11 (f) are schematic diagrams showing the process until the solder balls remaining from the holes of the glass jig are collected. Each of the steps shown in FIGS. 9A to 9H will be described below in the order of steps.

In the first step, as shown in FIGS. 11 (t) and 11 (a), the head section 380 has attracted the glass jig 4 and has been sent to the solder ball supply section 50 . Part 580
At a position where it does not interfere with the head 380 .
Also, the ball push-up 5306 rises and the hopper (B)
It is in a state where the tip is put in 5507. On the other hand, at this time, the solder balls 3 are (as shown in FIG. 1 (u) (a)).
This is a state where the stocker 5501 containing many pieces is divided into the supply amount required at one time. In this case, the supply amount required at one time was an appropriate amount of 2 to 2.5 times the amount required for the solder balls to enter all the holes of the glass jig 4.

In the second step, as shown in FIGS. 11 (t) and (a), each part is advanced by the horizontal drive unit 580, and the transfer head unit 500 is
The transfer unit 500 is moved directly above the glass jig 4 adsorbed on the head unit 380 , the transfer head unit 500 is lowered, the hopper (A) 5001 of the head unit 530 separates from the mounting table 5004, and the compression spring It is imposed only by 5003. Therefore, the lower surface of the hopper (A) 5001 is in close contact with the upper surface of the glass jig 4 and is pressed. In the above state, the solder balls 3 are supplied to the hopper (B) 550 of the supply section 530.
7 is supplied with compressed air (a) from a hose (E) 5510 and passes through a hose (D) 5018 to the transfer head 500
(Fig. 11 (u) (i) to (u)). At this time, the compressed air (a) may be at a minimum pressure (in the present invention, a pressure of 0.1 to 0.4 kgf / cm ² ) at which the solder ball is sent, and the flow of the compressed air (a) is shown in FIG. (U) (U)
As shown in (a), as a flow path in the lower part of the hopper (A) 5001, escape from the groove 5002 (four directions) formed, and the solder ball 3 is connected to the hose (C) 5019 and the hose ( B) It does not flow in the direction of 5021.
When all the solder balls that are supplied at one time are sent,
Compressed air (a) from hose (E) 5510 is turned off.

The third step is the same as the second step except that the ball push-up shaft 5306 is lowered as shown in FIGS. 11 (t) and 11 (c). In this state, the compressed air (b) is sent from the hose (B) 5021 into the hopper (A) 5001. At this time, the air pressure is such that the solder balls 3
In 01, the solder balls are set so as to float up from the glass jig 4, and the solder balls interfere with each other and fall on the side wall of the hopper (A) 5001. That is, the solder balls are disturbed in the hopper (A) 5001 and are successively put into the holes 5a of the glass jig 4 (FIG. 11 (u) (o)). Since the disturbance of the solder ball 3 is performed at substantially the same flow rate as the compressed air, the solder ball 3 is repeatedly and repeatedly sent to the hole of the glass jig 4 in a short time. Therefore, the mounting success rate of the solder ball 3 is extremely high. In addition, the supply and stop of the compressed air are repeated to change the disturbed state of the solder ball 3 and to insert the solder ball 3 into the hole 5 a of the jig 4,
As described above, it is better to mount the solder balls 3 in a one-stop state and mount them (repeating of FIG. 11 (u), (o) and (ka)) than to mount the solder balls 3 while continuing to disturb the mounting. It turned out to be short. When this operation was repeated, the mounting was completed in a shorter time.

At this time, the compressed air is also supplied to the hopper (A) 5001
Since it escapes from the groove 5002 formed in the above, the solder ball does not flow from other hoses, and flows very little.
As described above, the solder balls enter all the holes of the glass jig 4 and are sucked by the suction unit of the head unit 380 described above. The surplus is left on the surface of the glass jig 4.

In the fourth step, as in the third step, FIG.
It is a state of. On the other hand, when all the solder balls 3 are put into the holes of the glass jig 4 in the third step, the compressed air (b) from the hose (B) 5021 is stopped. (At this time, the compressed air (a) from the hose (E) is also stopped). Next, as shown in FIG. 11 (u) (g), suction is performed from the hose (F) 5126 connected to the suction means (into the container 5100),
At the same time, compressed air (b) is sent from the hose (B) 5021. Thus, the compressed air (b) passes through the hose (C) 5019, passes through the container 5100, and flows from the hose (F) 5126 to the suction unit. Therefore, the solder balls 3 are sent along the flow of the compressed air (b) and sent to the container 5100. Therefore, all the excess solder balls 3 on the glass jig 4 are collected in the container 5100. In the above, the compressed air (b) may be changed to the working pressure in the third step described above, or may be supplied by providing another compressed air circuit.
In any case, the object is achieved by determining the exhaust flow rate of the suction means so that the above-described flow of the compressed air (b) flows in the above-described circuit. As described above, when all the solder balls 3 are collected, the compressed air (b) is stopped.

In the fifth step, as shown in FIGS. 11 (t) and (e), the transfer head section 500 is lifted and retracted by the horizontal drive section 580, so that the transfer head section 500 does not interfere with the head section 380 . At this time, the solder ball 3 that has entered the hole of the glass jig 4 is adsorbed by the glass jig 4 and
What is contained in the 5501 is vibrated by a vibrator 5302 and aligned almost flat in the stocker 5501.

In the sixth step, as shown in FIGS. 11 (t) and (f), the mechanical operation is the same as that in the fifth step, and the glass jig 4 holding the solder ball 3 on the head portion 380 includes: It is checked from above with the camera 5900 whether or not all the holes in the glass jig 4 where the solder balls 3 are to be inserted are mounted. If there is not any one, the process is repeated from the first step by a command not shown. Do. In the present invention, repetition is performed only once because the mounting success rate is high, and the repetition is treated as another cause (the glass jig has dust).

As mentioned above, the solder ball supply unit 50 puts a large amount of solder balls in the stocker 5501, divides it into the necessary amount at one time, and sends it to the glass jig where the solder balls are put with compressed air. Then, the solder ball is disturbed by the compressed air (a) and can be mounted in all the holes of the glass jig in a short time. The solder balls 3 remaining in the holes of the glass jig 4 are recovered by compressed air (b) and suction means and used again.
If even one solder ball does not enter the hole 5 (a) of the glass jig, it is detected and compensated for. The above series of operations are controlled by the control for control.
Everything is done automatically.

The above-described solder ball supply method can also be achieved by the following method.

(1) The method of supplying the compressed air to the solder ball supply unit 530 and the transfer unit 500 described above is performed by using the compressed air supply source 6001 and the air filter in FIG. Between 6002, install dry air unit 7002 (the rest of the circuit is the same). Thereby, since the moisture of the solder ball is removed, the reliability of the joining can be improved. Also, as shown in FIG. 10 (c), after the dry air unit 7002 in FIG.
The same is true for the method of adding 7004 and actively drying.

(2) Next, in FIGS. 10 (a), (b) and (c),
By inserting the static eliminator 7003 after the pressure control 6003, it is possible to prevent static electricity from being accumulated on the solder balls 3 and prevent the solder balls 3 from adhering to various parts.

(3) In addition, the above-described dry air means, heater means, and static electricity removing means are not limited to the above-mentioned places, but may be any places where the purpose of each means can be achieved, and the combination of each means is also the same. it is obvious.

(4) Next, in order to shorten the melting time of the solder ball, the above-mentioned heater is used not only as a drying means but also as a heating means to raise the temperature to a constant temperature, and the heating means is provided in a stocker. Alternatively, a method in which solder balls previously heated are put into a stocker to shorten the melting time of the solder balls.

(5) The above-mentioned compressed air supply source 6001 is not compressed air,
A method in which oxidation of the solder ball is prevented by using an inert gas such as N ₂ gas (otherwise the same), and used in the above (c) to (4).

(6) The head section 380 has described the method of mounting the solder ball from above the hole with the glass jig 4 with the hole into which the solder ball is inserted facing upward. However, this mounting method is described in FIG. as shown, the head portion 380 1
It is also possible to adopt a method in which the glass jig 4 is sucked to the lower surface of the head portion 380 and the holes for the solder balls are directed downward, and the solder balls are sprayed from below onto the glass jig. An example is shown below.

The method is described in the transfer head section 500 described above with reference to FIGS. 3 (a) and 3 (a), which are sectional views taken along line BB of FIG. 2 (a).
3 (b), which is a bottom view of FIG. 4, FIG. 4 (b) as viewed from the direction of arrows AA, and a top view of FIG. 4 (b) having the same configuration as that shown in FIG. 4 (a), The operation is almost the same, and the following points are different.

(A) The head unit 380 and the transfer head unit 500 are combined, and the rotating shaft 3830 of the head unit 380 is rotated by 180 degrees to position and fix the head unit 380 .

(B) The entrance where the solder ball from the supply unit 530 enters the hopper (B) 5001 is shown in FIG. As shown in the figure, it should be close to the glass jig 4 (so that the solder balls 3 fall).

(C) The inlets of the compressed air for agitation and recovery are opposite. In other words, the inlet of compressed air for disturbance is Is for recovery. However, compressed air for disturbance At the inlet of the hopper (B) 5001, a net 5001b is fixed by a ring 5001a as shown in FIG. 1 (Z) so that the solder balls 3 do not enter the hose (C) 5019.

(D) Compressed air used when collecting solder balls Of the input port for the collection ( (Shown in FIG. 3)) and the joint (B) 5021. Therefore, when collecting solder balls, From the specified pressure, and at the same time, From the collecting container 5100.

(E) The compressed air (d) for agitation has a pressure at which the solder ball sufficiently collides with the glass jig 4 from the hose (c) 5019.

As described above, the solder balls (necessary amount at one time) sent from the supply unit 530 are blown up to the glass jig by the disturbing air (d), and the solder balls are transferred to the glass jig. It is a method of adsorbing and attaching to all holes. In other respects, the means for sending, collecting, and recognizing the solder balls are exactly the same as those described above.

Hereinafter, a description will be given of an apparatus for automatically and continuously forming bumps on a semiconductor element by a main part of the present invention with reference to FIGS. 16 (a) and (b) to FIG.

FIGS. 16 (a) and 16 (b) show that a square groove 202 into which the semiconductor element 1 is inserted is formed so that the semiconductor element 1 can be stored at a predetermined pitch.
The pallet 20 is formed on the flat plate 201 at a predetermined pitch and at a depth at which the semiconductor element can be grasped and detached when the semiconductor element 1 is inserted.

FIG. 17 shows a groove in which both ends of the pallet 20 can be taken in and out.
2102 are provided at equal pitches in multiple stages. Also, grooves 21 at both ends
An opening is provided between 02a and 2102b, and the magazine 21 has an opening so that the semiconductor element 1 accommodated in the pallet 20 does not interfere with the case 2101 and has a cubic outer shape.

Next, as shown in FIG. 18, the pallet supply unit 22 attaches a commercially available vertical moving slide unit 2200 to a fixed base 2210 fixed to the base 10, and the slide unit 22
A guide table 2206 for guiding the magazine 21 to a predetermined position and a magazine holder 2205 for detachably holding the magazine 21 are fixed to the slide table 2204 of 00. The slide table 2204 is configured to move up and down (by a rotation command to the pulse motor) by rotating a ball screw by a pulse motor 2201. As described above, when the slide table 2204 is given a predetermined rotation to the pulse motor 2201 and is moved up and down, the magazine 21 can be moved up and down by a predetermined amount. This vertical movement, the grooves 2102 of the amount required to retrieve it and pallet 20 is housed in the magazine 21 (the magazine 21
(A) and 2102 (b) pitch).

To take out the pallet 20 in the magazine 21 , the guide rail 2325 and the air cylinder 2222 are fixed to the support 2222 fixed to the base 10, and the air cylinder 2222
The slider 2321 slidably engaged with the guide rail 2325 is moved horizontally. This slider
2321 has an extruding plate 2220 for extruding the pallet 20
Is fixed.

As described above, the pallet 20 housed in the magazine 21 moves up and down by giving a rotation command to the pulse motor 2201 to have the same height as the pushing plate 2220, and the pallet 20 When the (semiconductor element 1) is required in the XY table section 23, the pushing plate 2220 is advanced (indicated by a dotted line) and supplied by an air cylinder 2222. When the next pallet 20 is required, the magazine 21 is moved up and down by the pulse motor 2201 to a position where the pallet 20 is located (aligned with the position of the extruding plate 2220), and is pushed out by the air cylinder 2222 to push the XY table. Supply to section 23. Therefore, the pallet 20 containing a large number of semiconductors 1 is stacked in the magazine 21 in multiple stages, and when the pallet 20 is needed (XY
The semiconductor elements can be continuously supplied for a long time because the semiconductor elements are automatically and sequentially supplied (when all the semiconductor elements are left in the pad in the table section 23).

As shown in FIGS. 19 (a) to 19 (c), the XY table section 23 rotates a ball screw with a pulse motor on a base plate 2300 fixed to the base 10 in the X and Y directions. A commercially available XY table 230 that can move a predetermined amount horizontally.
Is fixed. On a moving table 2301 of one Y table 231 of the XY table 230, a pallet receiving table 2315 having a groove 2316 into which the pallet 20 can slide, and an air cylinder unit 23 that moves horizontally with two guide shafts.
30 is fixed. A horizontal plate 2305 is fixed to a horizontally moving slider 2310 of the air cylinder unit 2330, and a shaft 2336 which is vertically movably fitted to the horizontal plate 2305.
And a contact plate 2337 connected to a rod 2335 of an air cylinder 2334 (fixed to the horizontal plate 2305) at the center. As described above, the vertical movement and the Y direction of the contact plate 2337 are performed by moving the respective air cylinders. At this time, when the pallet 20 is sent from the pallet supply unit 22 to the upper surface 2338 of the pallet receiving table 2315 when the pallet 20 is raised, the pallet 20 does not interfere with the abutment plate 2337, When lowered, the height should be such that it does not interfere with horizontal movement with the upper surface 2338 of the pallet support 2315.
Is the distance that can be moved in the Y direction by the air cylinder unit 2330 and delivered to the pallet discharge unit 25.

The pallet 20 is fixed at a fixed position by a method (not shown) when the pallet 20 is sent from the pallet supply unit 22 and placed on the pallet receiving stand 2315.

As described above, the pallet 20 is sent from the pallet supply unit 22 and the pallet support 23 of the XY table unit 23
It enters into 15 grooves 2316 and is positioned and fixed. Next, X
A predetermined amount (the position of the semiconductor element in the pallet 20 ) is sent in the X direction and the Y direction by the Y table 230. this is
The turntable taken out one by one semiconductor element of the pallet 20 located on the XY table 23 of the semiconductor device supply station 24 supplies the (A) 26 is fixed at a predetermined position, by moving the pallet 20 in the XY table 23, This is because the semiconductor element in the pallet can be taken out. Thus, the semiconductor elements 1 on the pallet 20 are taken out one by one by the semiconductor element supply unit 24 .

When all the semiconductor elements 1 in the pallet 20 are exhausted,
The air cylinder unit 2330 is operated, and is sent out to the pallet discharge section 25 by the contact plate 2335 (down), and a new pallet 20 (containing semiconductor elements) is sent from the pallet supply section.

Note that the pallet discharge section 25 is mechanically almost the same as the pallet supply section 22 shown in FIG. 18 (there is no mechanism for sending out the pallet 20 ), as shown in FIG. That is, the magazine 21 in which the pallet 20 is inserted is detachably held, the slide unit 2200 that moves up and down is moved up and down by a pulse motor, and the pallet 20 sent from the XY table unit 23 is moved into the groove 2101 of the magazine 21 . 1 in (a) and (b)
It is designed to be inserted step by step.

As a result, the XY table section 23 becomes empty (semiconductor element supply section).
The pallet 20 , which has been taken out by the semiconductor device 24 ) is automatically moved up and down (by a command not shown) and stored in the magazine 21 .

As shown in FIGS. 20 (a) and 20 (b), the semiconductor element supply section 24 has a horizontal moving section 240 that moves horizontally, a vertical moving section 241 that moves up and down, and a fixed support supported by two prisms 2400. Stand2520
(Fixed to the base 10). The horizontal moving unit 24
Reference numeral 0 indicates that the guide rail 2401 and the air cylinder 2403 are fixed to the fixing base 2520 in a substantially parallel manner. This guide rail
A slide table 2402 that fits horizontally with the slide 2401 and a slide 2517 of the air cylinder 2403 are fixed. Thus, the slide table 2402 moves horizontally along the guide rail 2401 in response to a movement command (not shown) to the air cylinder 2403.

On the other hand, the vertical moving part 241 is attached to the slide table 2462. A guide rail (A) 2418 is vertically fixed to the slide table 2402, and the guide rail 2418 is fixed.
A commercially available air chuck 2411 is fixed to an upper and lower table 2519 which is vertically movable. This air chuck
Reference numeral 2411 denotes a commercially available product that opens and closes by supplying and exhausting compressed air. Opening and closing claws 2412 (a) and 2412 (b) are opened and closed at the tip, so that the outer periphery of the semiconductor element 1 can be chucked. The air chuck 2411 is provided on the slide table 24.
Rod 24 of vertical air cylinder 2410 fixed to 02
Connected to 15.

As described above, the air chuck 2411 for chucking the semiconductor element 1 can move vertically and horizontally.

One of the horizontal movements is on the semiconductor element 1 stored on the pallet 20 of the XY table section 23, and the other end is on the semiconductor element 1 of the head section 265 of the turntable section (A) 26. Supply position. This movement can be moved to the air cylinder 2403 by an operation command (not shown). Further, the air chuck 2411 is moved up and down by the air cylinder 2410, so that the semiconductor element 1 is grasped by the air chuck 2411 from the above-mentioned XY table section 23, lifted up, transported to the turntable section 26 , and lowered to be chucked. Can be supplied to the head unit 265.

As shown in FIGS. 13 to 22 (a) to (c), the turntable part (A) 26 includes a rotary drive part 260 fixed to the base 10, a rotary table part 261 and a head. Part 265
It consists of.

A rotary drive unit 260 shown in FIG. 21 (a) includes a commercially available 4-indexed index unit 2600, and a timing pulley 2603 (a) attached to the input shaft 2602 of the index unit 2600 and the rotary shaft 2609 of the motor 2601. , 2603
(B) is fixed (not shown) and joined by a timing belt 2604. Therefore, when a rotation command is given to the motor 2601 by a method (not shown) and the input shaft 2602 of the index unit 2600 makes one rotation, the output shaft 2607 of the index unit 2600 rotates 90 degrees. By repeating the rotation command and the stop command to the motor 2601, the output shaft 2607 of the index unit 2600 can be intermittently rotated by 90 degrees. In addition, since the motor can be controlled (not shown) so that the rotation start / stop command can be set to an arbitrary time, the rotation and stop of the intermittent rotation of the output shaft 2607 can be set arbitrarily.

The head section 265 in FIG. 22 (b) is provided so that a hemispherical hole 2659 is fitted into the head main body 2655 when the hemispherical body 2651 is inserted (the hemispherical body is inserted into the hemispherical hole). When a groove 2654 is provided in a part of the hole 2659 and connected to the suction port 2656 (a) (connected to the suction means), and the suction means is operated on the suction port 2656, the hemispherical body 2651 is sucked into the head main body 2655.

On the other hand, the center of the hemisphere 2651 is connected to the suction port 2656 (b) (connected to the suction means) through the through hole 2656,
When the suction means is operated at 56 (b), a suction force is generated. Here, the semiconductor element 1 is placed and sucked from the semiconductor element supply section 24 .

Accordingly, when the semiconductor element 1 is placed on the hemisphere 2651, the semiconductor element 1 is sucked and held by the suction means. When a partial load is applied to the semiconductor element 1 from outside, the hemisphere 2651 is tilted. While being tilted, it is held by the main body 2655 with the front suction force (generated by the suction means).

The shape of the lower portion 2657 of the main body 2655 is as shown by a dotted line in FIG. 22 (a) in a square hole (a) 2612 provided with the axis of the rotary table (A) 2619 as a diagonal line. 22 (b) with the shaft 2616.
As shown in the figure, the notch 2659 of the main body 2655 is inserted, and the lower part 2657 of the main body 2655 is inserted by the compression spring 2622 into the hole (a) 2612.
It is pressed and positioned in one direction. In addition, this head part
265 is the shaft 2616 when detaching from the rotary table unit 261.
Is operated by a method not shown (to compress the compression spring) by grasping the lowermost portion 2660 of the main body 2655 and lifting it.

As described above, the turntable unit (A) 26 receives the semiconductor device 1 from the semiconductor device supply unit 24 described above,
At a predetermined time, it is sucked and held (however, if the semiconductor element 1 is tilted to a free angle by an external force, the state is maintained as it is).
90 ° intermittent rotation and stop can be performed.

21 (b), the rotary table (A) 2619 is firmly fixed to the output shaft 2607 of the index unit 2600 by a method not shown, and rotates intermittently as described above. A head mount 2618 is attached to the rotary table (A) 2619 at a position equally divided into four parts on the circumference.

The head mount 2618 has a rotary table (A) 2619
Square holes (a) 2612 into which the head portion 265 is inserted with the axis of the diagonal line as a diagonal line (see FIG. 22 (a)), and the holes (a) 2612
A square hole (b) 2614 inclined coaxially at 90 degrees with a notch
The rotary table (A) 2619 is provided with a through hole 2621 passing through the hole (a) 2612, the hole (b) 2614 and the notch 2620, and a collar 2615 is provided in the through hole 2621. The compression spring 2622 is inserted into the shaft 2616
2616 presses against the outer periphery of the rotary table (A) 2619.

In the center of the rotary table (A) 2619, a separator valve 2623 connected to a vacuum suction means (not shown) is provided to supply a suction force to each head 265. As described above, the head 265 is held at a fixed position,
The index unit 2600 intermittently rotates by 90 ° to carry the semiconductor element 1 to each part.

The glass supply / discharge unit 30 is shown in FIG. 13 and FIG.
(C) Or, as shown in FIG. 24, it comprises a discharge unit 301, a handling unit 304, a supply unit 307, and a glass magazine 308.

As shown in FIG. 24, the glass magazine 308 has grooves 3081 (a), 3081 (b) provided at both ends of the glass jig 4 and provided with a slidable width at predetermined pitches. It consists of a jig body 3080 provided in stages. An opening 3082 is provided between the grooves 3081 (a) and 3081 (b) of the main body 3080 so that the glass jig 4 can be taken in and out, and the outer dimensions are slightly larger than the outer dimensions of the glass jig 4. are doing.

As shown in FIGS. 23 (a) and (b), the discharge unit 301 receives a rotation command (by a method not shown) to the pulse motor.
A commercially available slide unit 3020 having a slide base 3021 that moves up and down by turning a ball screw is attached to the base 10 by a support base 3022.
It is fixed with. Further, the slide table 3021 has a commercially available index unit 303 fixed by a fixing table 3013. The index unit 303 can intermittently rotate (60 degrees in this case) and stop the rotation shaft 3011 of the index unit 303 by a rotation and stop command to a motor (not shown). A rotary table 3012 having a guide plate 3015 into which the glass magazine 308 can be detachably attached is fixed to the rotary shaft 3011 at six locations at the same angle on a concentric circle centered on the rotary shaft 3011 so as to rotate intermittently. ing.

As described above, the glass magazines 308 detachably held at the six positions of the rotary table 3012 are moved up and down by a predetermined pitch (at intervals where glass jigs of the glass magazine are inserted), and by a rotation angle of 60 degrees. The rotation and the stop are sequentially and repeatedly performed automatically (by a method not shown).

When the glass jig 4 is put into the glass magazine 308 of the discharge unit 301, the glass jig 4 carried out by the hard ring unit 304 (taken out of the turntable (B) 38 ) is made of glass. The jig 4 is mounted on a glass magazine mounting table 3019 (fixed to the base 10) having guides 3030 (a) and 3030 (b) provided on both sides so that the jig 4 can move horizontally. 3030
(A), 3030 (b) by the push plate 3018 which slides in the center,
Is pushed into the discharge section 301 (the groove 30 of the glass magazine 308 ).
81 (a), 3081 (b)).

As described above, the discharge unit 301 pushes the glass jigs 4 carried from the turntable (B) 38 by the handling unit 304 into the glass magazine 308 one by one. At this time, when one glass jig 4 enters the glass magazine 308, the slide unit 3020 is operated to descend the glass magazine 308, and the groove of the glass magazine 308 is sequentially formed.
3081 (a) and 3081 (b). If all the grooves are entered, the entire index unit 303 rotates one index. Do this six times. In this way, the glass jig 4 can be stored continuously for a long time. The above operations are all performed continuously by a method not shown.

The supply section 307 in FIG. 23 (a) has substantially the same structure as the discharge section 301, and has a rotary table 3012 that moves up and down and intermittently rotates with the glass magazine 308. However, the glass magazine 308 contains all the glass jigs 4 (replacement jigs).

The glass jig 4 fixes an air cylinder 3072 to a support 3071 fixed to the base 10 near the center of the rotary table 3012, and a lot 3073 of the air cylinder 3072.
Is horizontally moved, and the glass jig 4 in the glass magazine 308 is sent out of the glass magazine 308. The sent glass jig 4 is set to enter a groove 3076 of a guide table 3075 (fixed to the base 10) provided at a position facing the lot 3073. As described above, when one glass jig 4 is taken out from the glass magazine 308, the rotary table 3012 is operated by the method described above, and moves to a position where the next glass jig can be taken out. When all the glass jigs are pulled out from one glass magazine 308, the rotary table 3012 rotates one index, moves to the next glass magazine, and automatically turns until all the glass jigs set on the rotary table are exhausted. I can do it.

The stop positions of the two arms of the handling section 304 are as follows. One of the arms is initially set at the turntable section (B) 38.
And the other arm are located at a predetermined height directly above the glass jig 4 being sent to the guide table 3075 of the supply unit 307, and the other arm is located immediately above the position where the glass jig 4 can be taken out. In response to a command (not shown), the arm is lowered, the glass jig 4 is suctioned by suction pads 3045 provided on the two arms 3042 (a) and (b), and the arm is moved up and down. The glass jig of the turntable part (B)
38 , and the other is sent to the discharge unit 301. Thereby, the glass jig is replaced. This can be repeated.

Next, the handling unit 304 is a commercially available pick and place unit 3041 having a shaft 3040 capable of repeatedly repeating vertical movement and 90-degree swing by compressed air.
Two arms 3042 (a) and 3042 (b) with opening angles of degrees
The swing arm 3043 with the
At the tip of (a), 3042 (b), a suction means (not shown) is connected from the shaft 3040 to the same center. Suction pad 3045 is attached. The suction pad 3045 connects to the suction means to suck the center of the glass jig 4, lifts it with the rocking arm 3043, rocks (90 degrees), lowers it, and separates it from the suction means by a method (not shown) to suck it. Remove the force (the glass jig separates). This is repeated automatically (not shown).

As described above, the glass supply / discharge section 30 takes out the glass jig 4 from the turntable section (B) 38 (used once or several times) and replaces it with a new one. is there. If the glass jig 4 is free from dirt or the like due to the formation of bumps on the semiconductor element 1, it is apparent that the glass supply / discharge unit 30 need not be used.

The turntable part (B) 38 is shown in FIGS. 13 and 25 (a).
26 (a) and (b), the head section 380 , the vacuum switching section 400, and the rotary table section 420.
It consists of.

The head section 380 is a square prism 380 as shown in FIG.
First, the square hole (A) 3802 that penetrated and this square hole (A) 3802
A groove 3803 is provided in a square pillar 3801 at a predetermined depth in a U-shape around the rectangular pillar 3801. A suction means (not shown), a flow path (A) 3806, and a flow path (B) 3807 are provided in the square hole (A) 3802 and the groove 3803.
It has been fed continuously. The size of the square hole (A) 3802 is smaller than the glass jig 4 and larger than the area where the solder balls 3 in the glass jig 4 are arranged.
03 U-shaped size is larger than square hole (A) 3802,
The glass jig 4 is formed so as to be smaller than the outer diameter.

Next, at a specific position of the flow path (B) 3807, an O-ring 3813 is vertically sandwiched by the flow path 3807, and the O-ring 3813 is fixed by flanges 3815 and 3216 so as to be movable up and down. 3812 are provided. By moving this axis 3812,
The cutoff and connection of the suction means to the square hole (A) 3802 and the groove 3803 are performed and the connection is switched. For example, in the state of FIG. 25 (c), the small hole 3817 of the shaft 3812 and the flow path (B) 3807 Both the square hole (A) 3802 and the channel 383 in the channel A3806 have holes 3831
When this is lowered, the small hole 3817 of the shaft 3812 is prevented, the square hole (A) 3802 is cut off from the suction means, and the groove 3802 is cut off from the suction means. .

Next, as shown in FIG. 25 (c), one surface 3801 (a) of the rectangular prism 3801 (a U-shaped groove 3803 is cut (a)).
Surface) is a flat surface and the opposite surface parallel to this is 3801 (b).
The surface (b) has the same size as the square hole (A) 3802, and has square holes (B) 3823 (a) and square holes (c) 3823 (b) (see FIG. 26) at a predetermined pitch. One square hole (c) 3823
(B) shows a flat plate 3820 to which a transparent glass 3827 is adhered, a guide plate 3821 for guiding the flat plate 3820 so as to be slidable, and a tension spring for pulling the flat plate 3820 in one direction. 3825, spring hooks 3826 (a) and 3826 (b) for hooking the spring 3825, and pins 3822 used when sliding the flat plate 2820. The flat plate 3820 usually has the square hole (c) 3823 (b) bonding the transparent glass 3827 by the tension spring 3825 so that the square hole (A) 3802 of the square prism body 3801 matches the square hole (A) 3802. I have. As a result, the glass jig 4 containing the solder balls 3 is placed on the flat surface 3801 (a), and the suction means and the flow paths 3806 and 3806 in FIG.
When 807 is connected, the inside of the square hole (A) 3802 becomes a vacuum state, and both the glass jig 4 and the solder ball 3 are sucked. On the other hand, the flat plate 3820 shown in FIG. 27A is moved by the vacuum switching unit 400 described later to move the
If the position of 823 (b) is the same as that of the square hole (A) 3802, the inside of the square hole (A) 3802 of the quadrangular prism body 3801 comes into contact with the outside air and is released.
Further, both sides 3801 of the square pillar 3801 in FIG.
(A) and 3801 (b) are provided with a positioning guide having a positioning groove 3821 at the center, and when the positioning pin 3882 of the vacuum switching unit 400 is fitted, the square pillar 3801 is set.
The planes of (a) and 3801 (b) are always constant. Further, this quadrangular prism body 3801 is rotatably fixed to a bearing 3834 (fixed to the rotary table 420) by a method (not shown) on a rotating shaft 3830 having a hole 3831 connected to the suction means at the center. ing.

It should be noted that the rotating shaft 3830 is adapted to maintain the planes 3801 (a) and 3801 (b) of the rectangular prism body 3801 at a predetermined position and with a constant holding force by a method not shown in the drawing. Is rotated 180 degrees when it is obtained from outside.

The vacuum switching unit 400 is a horizontal moving table 4001 that moves horizontally.
A commercially available slide table 4002 that fixes the horizontal moving table 4001 and an air cylinder 4004 for moving the horizontal moving table 4001 in the lot 4003 in the upward direction are fixed to the supporting table 4000 (fixed to the base 10). . The horizontal moving table 4001 has a vertical drive air cylinder 4006 and a vertical slide table 4010.
Are fixed, and the slide side of the slide table 4010 and the upper and lower bases 4008 are connected by the lot 4007 of the air cylinder 4006. Therefore, the up-and-down table 4008 is moved up and down and back and forth by an air cylinder. When the up-and-down table 4008 moves forward from the retracted position in FIG. 26 (a), the vacuum switching shaft 3812 (At this time, the upper and lower bases 4008 are rising), and the lowering command causes the vacuum switching shaft 38
As described above, 12 is cut off from the vacuum suction means of the square hole (A) 3802 as described above.

Further, an air cylinder 3840 for moving the flat plate 3820 of the head unit 380 is fixed to the upper and lower bases 4008, and the opening and closing is fixed to the lot 3842 of the air cylinder 3840 as shown in FIG. Hole 3846 in block 3845
Then, the pin 3822 fixed to the flat plate 3820 is inserted, and the air cylinder 3840 is operated to move the flat plate 3820 (in this state, when the upper and lower base 4008 is advanced and lowered) (the square hole ( A) Release 3802 from outside air).

The rotary table drive unit 420 shown in FIG.
At 0, a 6-index (1 index rotation angle) that performs intermittent rotation by a rotation and stop command (not shown) to a commercially available motor
60 degree) index unit 4201 and the output shaft 4202 of this index unit.
The head section 380 is mounted at a position obtained by dividing the rotary table 4210 into six equal parts from 02. Therefore,
The rotary table driving unit 420 can repeatedly rotate and stop the head unit 380 fixed to the rotary table 4210 by 60 degrees.

As described above, the turntable part (B) absorbs the glass jig 4 (including the solder ball 3) on the head part 380 and the square hole (A) 3802 in the vacuum switching part 400.
Shut off with suction means inside, open with outside air, and head part
Perform 380 positioning. Also, the index unit 4
At 201, the head unit 380 is rotated and stopped by 60 degrees, and the glass jig can be sequentially sent to the next process.

The position of the head portion 380 of the turntable unit (B) 38, the head portion 380 to adsorb the glass jig 4, which is adsorbed to the glass jig 4 (a state in which the solder ball down) the arrangement of the solder balls When the arrangement of the bumps of the semiconductor element 1 with the semiconductor element adsorbed on the head section 380 of the turntable section (A) 26 is carried to the alignment section 60 ,
Both the XY direction and the θ direction are arranged so as to match in a direction described later.

Thus, the turntable unit (B) 38, the head portion 38
0 , the glass jig 4 (including the solder ball 3) is adsorbed on one side, and a flat plate 3835 having transparent glass is slid on the other side. When the outside air is released and the solder ball 3 is bonded to the bump surface of the semiconductor element 1, the solder ball is sucked (from a glass jig), and smoke and moisture when the flat plate 3835 is switched and bonded are removed. When the solder ball 3 is released into the outside air and transferred into the glass jig 4 (the rotary table 420 is sucked), the alignment 60
29, (a), (b) and FIG. 30, the laser beam passes through the fiber 6001 and is sent to the lens barrel 6002 to irradiate the head 380 with the laser jig. A recognition unit 610 for measuring the amount of positional deviation between the arrangement of the solder balls 3 and the arrangement of the bumps of the semiconductor 1; a chuck unit 620 for holding the head unit 265 of the turntable unit (A) 26 ; The θ rotation unit 630 that rotates the chuck unit 620 in the θ direction (horizontal direction), the vertical drive unit (A) 640 that moves up and down by a cam, the vertical drive unit (B) 650 that moves up and down by an air cylinder, in the X and Y directions It consists of a moving XY drive unit 660.

In addition, this alignment part 60 is a turntable part (A)
The position where the 26 semiconductor elements 1 intersect the turntable part (B) 38 the glass jig 4 and the turntable part (A)
It is located below 26 (Figure 13).

The irradiating section 600 is composed of the parts shown in FIGS. 28 and 29 (a) and (b),
As shown in the principle diagram in Fig. 30, a laser beam is emitted from a laser oscillator (not shown) (this time using a YAG laser) to a fiber 600.
1 through the lens barrel 6002, the square hole of the head 380 (A)
The size is 3802 (all solder balls can be melted). The lens barrel 6002 is fixed to a gate-shaped base 6010 fixed to the base 10.

The recognition unit 610 measures the amount of displacement between the arrangement of the solder balls 3 adsorbed on the glass jig 4 and the position where the bumps of the semiconductor element 1 are arranged in μm units. As shown in FIG. 1 (c), the solder ball 3 adsorbed on the glass jig 4 is connected to the head part.
At 380 downwards (reflected in a way not shown)
As described above, the upper portion of the head portion 380 is bonded with the transparent glass 3827 provided on the square hole (B) 3823 of the flat plate 3820, so that the solder ball 3
In the position of, the illumination light of the light source 6103 is refracted by the mirror 6003 and applied to the glass jig 4, and the light passing state (transparent glass is transmitted and the solder ball is shadow) is refracted by the plane mirror 6102. The position is measured by looking at the camera 6101 and processing it electrically.

On the other hand, the position of the bump of the semiconductor element 1 attracted to the head portion 265 is determined by directly irradiating the illumination light of the light source 6104 (at a specific angle) and shading reflected from the surface of the bump into the plane mirror 61
The light is refracted at 02 and viewed by the camera 6105 to process it electrically and measure the position.

As described above, the amount of deviation between the position of the solder ball and the bump position is calculated for each of the X, Y, and θ directions (not shown), and the deviation is measured by the following method.

As shown in FIG. 29, the cameras 6101 and 6105 are fixed to both ends, and the mirror 6102 is disposed at a position conforming to the above-described principle, and the plane mirror 6102 is disposed in a prism 6106;
06 is fixed to a slide table 6012 which is fitted to a guide 6011 for horizontally moving (fixed to the base 6010)
Lot 6023 of air cylinder 6022 (fixed to the base 6010)
And the cylinder 6022 is operated to operate the prism 6106
Move. The light sources 6103 and 6101 and the mirror 6003 are fixed to the base 6010 at positions that achieve the above-described principle.

As described above, the solder ball 3 and the semiconductor element 1
When the camera is brought to a predetermined position and stopped, the cameras 6101 and 6105 and the plane mirror 6102 move to the measurement position and measure by the air cylinder. This measurement result indicates how much the bump position of the semiconductor element 1 deviates from the position of the solder ball in each of X, Y, and θ directions in units of 1 μm. Correct the amount of deviation.

The chuck section 620 shown in FIG. 28 has an air chuck 6201 having a claw (not shown) that opens and closes with compressed air so as to grip the lower portion of the head section 265 of the turntable section (A).
Further, arms 6202 (a) and 6202 (b) formed so as to hold the lower portion 2660 of the chuck portion 265 are fixed to the claws of the air chuck 6201. Therefore, the chuck part 62
0 indicates that the head 265 holding the semiconductor element 1 can be clamped or separated.

The drive unit 630 is a commercially available spline shaft 6301 having several grooves on the outer circumference as shown in FIG. 31, and a nut 6302 meshing with the groove of the spline shaft 6301 (up and down).
And a housing 6303 which fits around the outer periphery of the nut 6302 so as not to rotate, and a bearing stand 6305 which is above and below the housing 6303 and which holds the housing 6303 so that it can rotate freely (fixed to the upper and lower stand (A) 6300) ).

On the other hand, a gear (A) 6306 is fixed to the housing 6303 and meshes with a gear (B) 6307 fixed to the rotating shaft 6310 of the pulse motor 6310. This pulse motor 63
Reference numeral 10 denotes a motor bracket 6313 (the rotation shaft 6310 also rotatably holds), which is fixed to the upper and lower table (A) 6300.
However, the gear ratio between the gear (A) 6306 and the gear (B) 6307 is increased to reduce the rotation angle per pulse of the pulse motor so that the position can be adjusted in units of 1 μm.

As described above, in the θ drive unit 630, the spline shaft 630
3 (fixing the chuck portion 620) can move up and down, and can rotate in units of 1 μm according to a rotation command to the pulse motor 6310.

Next, the vertical drive unit (A) 640 is connected to the vertical mount (A) 630.
The slide unit (A) 6408 is fixed to the slide table 6406 at a position where the slide unit (A) 6408 slides. The slide table 6406 holds the lower part of the spline shaft 6303 so that it can rotate and move up and down freely, fixes the cam follower 6409 below, and provides a tension spring 6412 between springs (not shown). Lifting. The cam follower 6409 is in contact with a cam 6405 formed by a predetermined curve (in this case, a deformed trapezoidal curve). The cam 6405 is fixed to a rotating shaft 6410, is rotatably held on both sides by bearings (fixed to the slide base 6406), and is connected to a motor rotating shaft of a motor by a joint. As described above, when rotation is given to the motor, the cam 6405 rotates, and the chuck portion 610 moves up and down according to the cam curve, so that extremely gentle up and down movement is possible.
Since the spline shaft 6303 is lifted by the tension spring 6412, the semiconductor element 1 is pressed against the glass jig 4 of the head section 380 with a constant pressing force even after contact.

The vertical drive unit (B) 650 fixes the θ rotation unit 630, the chuck unit 620, and the vertical mount (A) 6300 to which the vertical drive unit (A) 640 is fixed to a slide base 6406 that slides up and down,
It engages with the guide rail 6415 fixed to the support base 6500. Since the upper and lower bases (A) 6300 are connected to the lot 6508 of the air cylinder 6506 and the connecting plate 6509, they can be moved up and down by the air cylinder 6506 (fixed to the support base 6500). The air cylinder 6506 is a cylinder that can take a two-stage stroke.

Next, the XY drive unit 660 is a commercially available XY table unit 6600, which rotates a ball screw according to a rotation command to a pulse motor, and fixes the table 6601 (the support base 6500 is fixed).
Is moved in the XY direction. In the present invention, 1 μm
It can be moved in the XY direction in m units.

As described above, the positioning unit 60 receives the semiconductor element 1 carried by the turntable (A) 26 and makes it movable in the X, Y, and θ directions. The movement in the X, Y, and θ directions is performed by a method (not shown) such that the solder ball (sucked on the glass jig) sucked into the turntable (B) 380 is turned downward by a method (not shown). Position) (X, Y, θ directions)
And the position of the semiconductor device carried by the turntable section (A) 26 (in the X, Y, and θ directions) is measured (based on the position of the solder ball), and the amount of the deviation is determined. The positioning unit 60 is moved in the manner described above. Next, the semiconductor element is raised after the alignment, and the solder ball of the glass jig is brought into close contact with the semiconductor element.

Irradiation is carried out by the laser unit shown in FIG.
The glass jig adsorbed on the square pillar 3801 of 380 is downward (same as the solder ball), and the square hole of square pillar 3801 (A)
The inside of the 3802 is cut off from the suction means (however, the groove 3803 is in a suction state), and the flat plate 3820 slides, and the inside of the square hole (A) 3802 is opened to the outside air so that the solder ball melted by laser irradiation is opened. The semiconductor element is bonded to the pad surface without suction force. When the solder ball is bonded to the pad surface in this way, the chuck at the alignment portion is lowered, the semiconductor element is separated from the glass jig surface 4 (by the cam and the air cylinder), and the turntable (A) 26 is turned off. Returned to On the other hand, a glass jig without solder balls is sent to the next step by a turntable (B).

Next, as shown in FIG. 13, the semiconductor discharge section 80 includes the semiconductor element supply section 24 (FIG. 20) and the pallet supply section.
22 (FIG. 18), an XY table section 23 (FIG. 19), and a pallet support 900 for receiving the pallet 20 . Therefore, the semiconductor elements carried by the turntable (A) 26 are transferred to the pallet 20 of the XY table 23 by the semiconductor element supply unit 24 (however, no pallets are loaded into the magazine 21 in the pallet supply unit 22 ). Are stored one by one in the pallet 20 and are automatically sent to the pallet receiving base 900 when they enter all of the square grooves 202 of the pallet 20 .

As described above, according to the microparticle mounting apparatus of the present invention, bumps can be formed at a high density on one surface of a semiconductor module, so that the flip-chip type semiconductor module produced by the apparatus of the present invention can be used. It is mounted on a substrate in a large computer, a communication device (electronic exchange), a high-speed electric signal measuring device, or the like, and can improve the processing capacity of each device.

〔The invention's effect〕

 According to the present invention, the following effects can be obtained.

(1) At the time of mounting to the hole in the jig, the solder ball is disturbed by the turbulent flow of compressed air, and the solder ball is repeatedly supplied (transferred) to the person who wants to mount in a short time. (2) Since the supply and collection of the solder balls are performed by the gas flow by the compressed air and the suction means, the operation can be performed at extremely high speed. Also, since no mechanical force is applied to the solder balls, there is no damage to the solder balls.

(3) A long time continuous operation is possible because a few hours are put in a stocker, and it is supplied in a necessary quantity at a time.

[Brief description of the drawings]

FIG. 1 shows a solder ball supply unit of a solder ball mounting apparatus according to an embodiment of the present invention. Transfer part. FIG. 2 (a) is a top view of a solder ball supply unit, and FIG.
3 (b) is a principal view, FIG. 3 (a) is a cross-sectional view of the transfer head, FIG. 3 (b) is a bottom view thereof, and FIG. 4 (a) is from arrow A in FIG. Top view when viewed,
(B) is a front view also seen from the arrow A in FIG.
FIG. 6 is a sectional view of the supply unit, and FIG. 6 is a sectional view taken along the line DD of FIG.
FIG. 7 is a cross-sectional view of the recovery unit, and FIG.
FIG. 9B is a plan view of the horizontal drive unit, FIG. 9B is a view taken along the line EE of FIG. 2B, FIG.
The figure is a circuit diagram for controlling the disturbance of the solder balls and the pressure of the compressed air in the supply section, and FIGS. 11 (t) (a) to (f).
Is a diagram showing a main configuration of a supply portion of a solder ball, FIG.
(U) (a) to (g) are schematic diagrams of supplying and collecting solder balls, FIG. 12 is a diagram showing the transfer portion shown in FIG. 3 upside down, and FIG. 14 (a) and (b) are views showing a workpiece to which the present invention is applied, and FIGS. 15 (a) and (b) are views of the present invention. FIG. 16 (a) shows a jig for mounting the target component,
(B) is a diagram showing a pallet for placing a target work,
FIG. 17 is a diagram showing a magazine for storing the pallet,
FIGS. 18 (a), (b) and (c) show a supply section for supplying the pallets, and FIGS. 19 (a), (b) and (c).
FIG. 20 is a view showing an x, y table section for moving the pallet in the x, y directions. FIGS. 20 (a) and (b) are views showing a semiconductor element supply section for conveying a target work, and FIG. (A), (b)
Is a turntable unit that sucks and transports the target work (A)
FIGS. 22 (a), (b) and (c) are detailed views of the head part of the turntable part (A), and FIG. 23 (a) is a view showing the mounting glass jig. A front view showing a glass jig supply / discharge unit for replacement, (b) is a side view thereof, (c) is a view as viewed from an arrow B, and FIG. 24 is a view showing a glass jig supply / discharge unit. FIG. 25 (a) is a side view showing a turntable part (B) for sucking and conveying the glass jig, FIG. 25 (a) is a side view showing the same, and FIG. FIGS. 26 (a) and (b) are detailed views of a head portion attached to the turntable (B) and adsorbing the glass jig, FIG. 27 (a) is a top view of the head portion, FIG. 28 (b) is a bottom view of the same, FIG. 28 is a view showing a driving unit to be joined, and FIGS. 29 (a) and 29 (b) are arrangements and a half of a solder ball of a glass jig. FIG. 30 is a diagram showing a visual camera for detecting a positional deviation between the arrangement of the connection pads of the conductor module and the arrangement of the connection pads of the semiconductor module.
FIGS. 31 (a) and (b) are views showing a driving unit to be joined.
FIG. 32 is a perspective view of a flip-chip type semiconductor module made by using the mounting method of the present invention, and FIGS. 33 (a), (b), (c) and (d) show solder ball alignment according to the prior art. It is a figure showing a method. 3 ... solder ball, 4 ... glass jig, 10 ... base, 20 ... palette, 21 ... magazine, 22 ... palette supply section, 24 ... XY table section, 25 ... semiconductor supply section, 2 Pallet discharge section 26 Turntable section (A) 30 Glass supply and discharge section 38 Turntable section (B) 50 Solder ball supply section 60 Alignment section 80 … Semiconductor discharge section, 380 … Head section, 500 … Transfer head section, 530… Supply section, 560… Recovery section, 590… Recognition section 2, 600… Irradiation section.

──────────────────────────────────────────────────続 き Continuation of the front page (72) Inventor Hideyuki Fukasawa 1 Horiyamashita, Hadano-shi, Kanagawa Hitachi, Ltd. Kanagawa Plant (56) References JP-A-2-295186 (JP, A) JP-A-62- 25435 (JP, A) JP-A-2-278831 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01L 21/60

Claims (11)

(57) [Claims] 1. A method according to claim 1, wherein a plurality of conductive particles are supplied by air or an inert gas flow to a suction jig side of a mounting jig having a through hole corresponding to a pad position of the semiconductor device. Mounting the conductive particles in the through-hole by suction from the opposite surface, and, if there is a mounting failure, supplying and mounting the conductive particles again, A method for manufacturing a semiconductor device, comprising: aligning a position with a conductive particle mounted on the mounting jig; and transferring the conductive particle to a pad of the semiconductor device. 2. A method according to claim 1, wherein a plurality of conductive particles are supplied by air or an inert gas flow to the suction surface of the mounting jig having a through hole corresponding to a pad position of the semiconductor device. Mounting the conductive particles in the through-hole by suction from the opposite surface, and, if there is a mounting failure, supplying and mounting the conductive particles again, Aligning the position with the conductive granules mounted on the mounting jig, pressing the pads of the semiconductor device and the conductive granules mounted on the mounting jig, A method for manufacturing a semiconductor device, wherein the method is transferred to a pad of the semiconductor device. 3. A method of supplying a large number of conductive particles to the suction surface of a mounting jig having a through hole corresponding to a pad position of a semiconductor device by air or an inert gas flow. Mounting the conductive particles in the through-hole by suction from the opposite surface, and, if there is a mounting failure, supplying and mounting the conductive particles again, Aligning the position with the conductive particles mounted on the mounting jig, pressing the pads of the semiconductor device and the conductive particles mounted on the mounting jig to imitate, A method of manufacturing a semiconductor device, comprising transferring particles to pads of the semiconductor device. 4. The method of manufacturing a semiconductor device according to claim 1, wherein the number of repetitions of the step of supplying and mounting the conductive particles is limited. . 5. The method for manufacturing a semiconductor device according to claim 1, wherein the conductive particles are supplied to the mounting jig by a pulsating airflow. . 6. The method for manufacturing a semiconductor device according to claim 1, wherein the conductive particles are supplied to the mounting jig by an air current.
A method for manufacturing a semiconductor device, comprising: turning off a semiconductor device; 7. A method for supplying a large number of conductive particles to the suction surface of a mounting jig having a through hole corresponding to a pad position of a semiconductor device by air or an inert gas flow. Attach the conductive particles to the through holes by suctioning from the opposite surface, remove and collect excess conductive particles, and supply and mount conductive particles again if there is a mounting failure. Performing the step of: aligning the pad position of the semiconductor device with the conductive particles mounted on the mounting jig, and transferring the conductive particles to the pads of the semiconductor device. Semiconductor device manufacturing method. 8. A method for supplying a large number of conductive particles to the suction surface of a mounting jig having a through hole corresponding to a pad position of a semiconductor device by air or an inert gas flow. The conductive particles are attached to the through-hole by suctioning from the opposite surface, excess conductive particles are removed and collected by vacuum suction or gas blowing, and the pad position of the semiconductor device and the mounting jig A method of manufacturing a semiconductor device, comprising: aligning a conductive particle mounted on a semiconductor device; and transferring the conductive particle to a pad of the semiconductor device. 9. A method for supplying a large number of conductive particles to the suction surface of a mounting jig having a through hole corresponding to a pad position of a semiconductor device by air or an inert gas flow. Attach the conductive particles to the through-hole by suctioning from the opposite surface, irradiate illumination light from one side of the mounting jig, and a light receiving element provided on the other side of the mounting jig The presence or absence of the conductive particles is inspected, and if there is a mounting failure, a step of supplying and mounting the conductive particles again is performed, and the semiconductor device is mounted on the pad position and the mounting jig. A method for manufacturing a semiconductor device, comprising: aligning a conductive particle with a conductive particle; and transferring the conductive particle to a pad of the semiconductor device. 10. A method for supplying a large number of conductive particles to a suction surface of a mounting jig having a through hole corresponding to a pad position of a semiconductor device by air or an inert gas flow. Mounting the conductive particles in the through-hole by suction from the opposite surface, and, if there is a mounting failure, supplying and mounting the conductive particles again, Align the position with the conductive particles mounted on the mounting jig, transfer the conductive particles to pads of the semiconductor device, heat the conductive particles by heating means, and join them A method for manufacturing a semiconductor device, comprising: 11. A method of supplying a large number of conductive particles to a suction surface of a mounting jig having a through hole corresponding to a pad position of a semiconductor device by air or an inert gas flow. Mounting the conductive particles in the through-hole by suction from the opposite surface, and, if there is a mounting failure, supplying and mounting the conductive particles again, Align the position with the conductive particles mounted on the mounting jig, transfer the conductive particles to the pads of the semiconductor device, heat the conductive particles by laser irradiation, and join them A method for manufacturing a semiconductor device, comprising: